TW200640042A - Single chip LED as compact color variable light source - Google Patents

Single chip LED as compact color variable light source

Info

Publication number
TW200640042A
TW200640042A TW094142644A TW94142644A TW200640042A TW 200640042 A TW200640042 A TW 200640042A TW 094142644 A TW094142644 A TW 094142644A TW 94142644 A TW94142644 A TW 94142644A TW 200640042 A TW200640042 A TW 200640042A
Authority
TW
Taiwan
Prior art keywords
array
leds
variable light
light source
color variable
Prior art date
Application number
TW094142644A
Other languages
English (en)
Inventor
Johannes Petrus Maria Ansems
Christoph Gerard August Hoelen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200640042A publication Critical patent/TW200640042A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW094142644A 2004-12-06 2005-12-02 Single chip LED as compact color variable light source TW200640042A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04106320 2004-12-06

Publications (1)

Publication Number Publication Date
TW200640042A true TW200640042A (en) 2006-11-16

Family

ID=36578285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142644A TW200640042A (en) 2004-12-06 2005-12-02 Single chip LED as compact color variable light source

Country Status (7)

Country Link
US (1) US8026532B2 (zh)
EP (1) EP1825515B1 (zh)
JP (1) JP5616000B2 (zh)
KR (1) KR101199260B1 (zh)
CN (1) CN101073155B (zh)
TW (1) TW200640042A (zh)
WO (1) WO2006061728A2 (zh)

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US8773337B2 (en) 2007-04-13 2014-07-08 Intematix Corporation Color temperature tunable white light source
TWI461100B (zh) * 2007-09-28 2014-11-11 英特曼帝克司公司 Ｌｅｄ訊號燈
TWI779000B (zh) * 2016-12-30 2022-10-01 美商亮銳公司 用於發光二極體之改善磷光體沉積系統

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US8773337B2 (en) 2007-04-13 2014-07-08 Intematix Corporation Color temperature tunable white light source
TWI461100B (zh) * 2007-09-28 2014-11-11 英特曼帝克司公司 Ｌｅｄ訊號燈
TWI779000B (zh) * 2016-12-30 2022-10-01 美商亮銳公司 用於發光二極體之改善磷光體沉積系統
US11699777B2 (en) 2016-12-30 2023-07-11 Lumileds Llc Phosphor deposition system for LEDs

Also Published As

Publication number Publication date
EP1825515B1 (en) 2015-11-25
WO2006061728A3 (en) 2006-11-30
CN101073155B (zh) 2010-09-29
JP5616000B2 (ja) 2014-10-29
CN101073155A (zh) 2007-11-14
KR101199260B1 (ko) 2012-11-09
JP2008523583A (ja) 2008-07-03
US20100109575A1 (en) 2010-05-06
WO2006061728A2 (en) 2006-06-15
US8026532B2 (en) 2011-09-27
EP1825515A2 (en) 2007-08-29
KR20070090234A (ko) 2007-09-05

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