TW200610166A - Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted - Google Patents
Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mountedInfo
- Publication number
- TW200610166A TW200610166A TW094127122A TW94127122A TW200610166A TW 200610166 A TW200610166 A TW 200610166A TW 094127122 A TW094127122 A TW 094127122A TW 94127122 A TW94127122 A TW 94127122A TW 200610166 A TW200610166 A TW 200610166A
- Authority
- TW
- Taiwan
- Prior art keywords
- dimm
- stacked
- boc
- packages
- stacked board
- Prior art date
Links
- 230000009977 dual effect Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000009434 installation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0613—Square or rectangular array
- H01L2224/06134—Square or rectangular array covering only portions of the surface to be connected
- H01L2224/06136—Covering only the central area of the surface to be connected, i.e. central arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1094—Thermal management, e.g. cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040072471A KR100688501B1 (ko) | 2004-09-10 | 2004-09-10 | 미러링 구조를 갖는 스택 boc 패키지 및 이를 장착한양면 실장형 메모리 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610166A true TW200610166A (en) | 2006-03-16 |
TWI283489B TWI283489B (en) | 2007-07-01 |
Family
ID=36159680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127122A TWI283489B (en) | 2004-09-10 | 2005-08-10 | Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted |
Country Status (4)
Country | Link |
---|---|
US (1) | US7276786B2 (zh) |
JP (1) | JP4938273B2 (zh) |
KR (1) | KR100688501B1 (zh) |
TW (1) | TWI283489B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10334727B2 (en) | 2017-05-26 | 2019-06-25 | Realtek Semiconductor Corp. | Electronic apparatus, and circuit board and control device thereof |
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KR100702016B1 (ko) * | 2005-02-02 | 2007-03-30 | 삼성전자주식회사 | 양면 실장 메모리 모듈의 인쇄 회로 기판 및 이를이용하는 양면 실장 메모리 모듈 |
KR100615606B1 (ko) * | 2005-03-15 | 2006-08-25 | 삼성전자주식회사 | 메모리 모듈 및 이 모듈의 신호 라인 배치 방법 |
SG130055A1 (en) | 2005-08-19 | 2007-03-20 | Micron Technology Inc | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
SG130066A1 (en) | 2005-08-26 | 2007-03-20 | Micron Technology Inc | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
KR100660882B1 (ko) * | 2005-10-27 | 2006-12-26 | 삼성전자주식회사 | 보드 온 칩 패키지 및 그 제조 방법 |
US7990727B1 (en) * | 2006-04-03 | 2011-08-02 | Aprolase Development Co., Llc | Ball grid array stack |
US20080116584A1 (en) * | 2006-11-21 | 2008-05-22 | Arkalgud Sitaram | Self-aligned through vias for chip stacking |
US7566962B2 (en) * | 2006-12-26 | 2009-07-28 | Advanced Semiconductor Engineering Inc. | Semiconductor package structure and method for manufacturing the same |
JP4934444B2 (ja) * | 2007-01-29 | 2012-05-16 | 日本シイエムケイ株式会社 | 半導体装置とその製造方法 |
US7981703B2 (en) * | 2007-05-29 | 2011-07-19 | Occam Portfolio Llc | Electronic assemblies without solder and methods for their manufacture |
KR100855626B1 (ko) * | 2007-06-01 | 2008-09-03 | 삼성전기주식회사 | 반도체 패키지 및 그 제조방법 |
KR20090021605A (ko) * | 2007-08-27 | 2009-03-04 | 삼성전기주식회사 | 반도체 메모리 패키지 |
JP2009099589A (ja) * | 2007-10-12 | 2009-05-07 | Elpida Memory Inc | ウエハまたは回路基板およびその接続構造体 |
US8106498B2 (en) * | 2009-03-05 | 2012-01-31 | Stats Chippac Ltd. | Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof |
TWI366906B (en) * | 2009-03-31 | 2012-06-21 | Ind Tech Res Inst | Die stacking structure and fabricating method thereof |
KR101061531B1 (ko) * | 2010-12-17 | 2011-09-01 | 테세라 리써치 엘엘씨 | 중앙 콘택을 구비하며 접지 또는 배전을 개선한 적층형 마이크로전자 조립체 |
KR101321170B1 (ko) * | 2010-12-21 | 2013-10-23 | 삼성전기주식회사 | 패키지 및 이의 제조 방법 |
US9118144B2 (en) | 2012-06-08 | 2015-08-25 | International Business Machines Corporation | Multi-level connector and use thereof that mitigates data signaling reflections |
KR102021077B1 (ko) * | 2013-01-24 | 2019-09-11 | 삼성전자주식회사 | 적층된 다이 패키지, 이를 포함하는 시스템 및 이의 제조 방법 |
US9900983B2 (en) | 2014-06-18 | 2018-02-20 | Intel Corporation | Modular printed circuit board electrical integrity and uses |
US9829915B2 (en) | 2014-06-18 | 2017-11-28 | Intel Corporation | Modular printed circuit board |
MY178559A (en) * | 2014-07-07 | 2020-10-16 | Intel Corp | Package-on-package stacked microelectronic structures |
TWI654723B (zh) * | 2015-02-06 | 2019-03-21 | 矽品精密工業股份有限公司 | 封裝結構之製法 |
US9859202B2 (en) * | 2015-06-24 | 2018-01-02 | Dyi-chung Hu | Spacer connector |
EP3347741B1 (en) * | 2015-09-08 | 2020-05-20 | Shenzhen Xpectvision Technology Co., Ltd. | Methods for making an x-ray detector |
US10310547B2 (en) * | 2016-03-05 | 2019-06-04 | Intel Corporation | Techniques to mirror a command/address or interpret command/address logic at a memory device |
US10193248B2 (en) | 2016-08-31 | 2019-01-29 | Crystal Group, Inc. | System and method for retaining memory modules |
US10622340B2 (en) * | 2016-11-21 | 2020-04-14 | Samsung Electronics Co., Ltd. | Semiconductor package |
EP3376539A1 (en) | 2017-03-14 | 2018-09-19 | HS Elektronik Systeme GmbH | Stackable power module |
JP6847797B2 (ja) | 2017-09-21 | 2021-03-24 | キオクシア株式会社 | 半導体記憶装置 |
US10453820B2 (en) * | 2018-02-07 | 2019-10-22 | Micron Technology, Inc. | Semiconductor assemblies using edge stacking and methods of manufacturing the same |
CN110364496A (zh) * | 2018-04-11 | 2019-10-22 | 中国科学院微电子研究所 | 一种芯片封装结构及其封装方法 |
JP7044653B2 (ja) * | 2018-07-12 | 2022-03-30 | アオイ電子株式会社 | 半導体装置および半導体装置の製造方法 |
US10734756B2 (en) | 2018-08-10 | 2020-08-04 | Crystal Group Inc. | DIMM/expansion card retention method for highly kinematic environments |
CN113488454B (zh) * | 2020-11-05 | 2022-06-03 | 浙江荷清柔性电子技术有限公司 | 封装结构及封装方法 |
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JPH0794669A (ja) * | 1993-09-20 | 1995-04-07 | Toshiba Corp | 半導体パッケ−ジモジュ−ル |
JPH08250650A (ja) * | 1995-03-09 | 1996-09-27 | Sumitomo Electric Ind Ltd | 半導体装置 |
US5798564A (en) * | 1995-12-21 | 1998-08-25 | Texas Instruments Incorporated | Multiple chip module apparatus having dual sided substrate |
JPH09260538A (ja) * | 1996-03-27 | 1997-10-03 | Miyazaki Oki Electric Co Ltd | 樹脂封止型半導体装置及び製造方法とその実装構造 |
US5748452A (en) * | 1996-07-23 | 1998-05-05 | International Business Machines Corporation | Multi-electronic device package |
JP2000208698A (ja) * | 1999-01-18 | 2000-07-28 | Toshiba Corp | 半導体装置 |
JP3939429B2 (ja) * | 1998-04-02 | 2007-07-04 | 沖電気工業株式会社 | 半導体装置 |
JP3180758B2 (ja) * | 1998-04-13 | 2001-06-25 | 住友金属工業株式会社 | 積層可能な半導体装置とこれらの半導体装置モジュール |
JP3792445B2 (ja) * | 1999-03-30 | 2006-07-05 | 日本特殊陶業株式会社 | コンデンサ付属配線基板 |
KR100353224B1 (ko) | 1999-11-10 | 2002-09-18 | 밍-퉁 센 | 반도체 칩 모듈 |
JP3798597B2 (ja) * | 1999-11-30 | 2006-07-19 | 富士通株式会社 | 半導体装置 |
US6577013B1 (en) * | 2000-09-05 | 2003-06-10 | Amkor Technology, Inc. | Chip size semiconductor packages with stacked dies |
JP4459421B2 (ja) * | 2000-10-17 | 2010-04-28 | Okiセミコンダクタ宮崎株式会社 | 半導体装置 |
JP3798620B2 (ja) * | 2000-12-04 | 2006-07-19 | 富士通株式会社 | 半導体装置の製造方法 |
JP4413452B2 (ja) * | 2001-05-30 | 2010-02-10 | パナソニック株式会社 | 半導体装置およびその製造方法 |
JP2002359343A (ja) * | 2001-05-31 | 2002-12-13 | Nec Corp | 半導体装置 |
US7119432B2 (en) * | 2004-04-07 | 2006-10-10 | Lsi Logic Corporation | Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package |
-
2004
- 2004-09-10 KR KR1020040072471A patent/KR100688501B1/ko not_active IP Right Cessation
-
2005
- 2005-07-08 US US11/177,736 patent/US7276786B2/en not_active Expired - Fee Related
- 2005-08-10 TW TW094127122A patent/TWI283489B/zh not_active IP Right Cessation
- 2005-09-07 JP JP2005259666A patent/JP4938273B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10334727B2 (en) | 2017-05-26 | 2019-06-25 | Realtek Semiconductor Corp. | Electronic apparatus, and circuit board and control device thereof |
Also Published As
Publication number | Publication date |
---|---|
KR20060023677A (ko) | 2006-03-15 |
JP2006080521A (ja) | 2006-03-23 |
TWI283489B (en) | 2007-07-01 |
JP4938273B2 (ja) | 2012-05-23 |
US20060055017A1 (en) | 2006-03-16 |
KR100688501B1 (ko) | 2007-03-02 |
US7276786B2 (en) | 2007-10-02 |
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