TW200607428A - PCB and its manufacturing method - Google Patents

PCB and its manufacturing method

Info

Publication number
TW200607428A
TW200607428A TW094121251A TW94121251A TW200607428A TW 200607428 A TW200607428 A TW 200607428A TW 094121251 A TW094121251 A TW 094121251A TW 94121251 A TW94121251 A TW 94121251A TW 200607428 A TW200607428 A TW 200607428A
Authority
TW
Taiwan
Prior art keywords
capacitor
upper electrode
electrode connector
lower electrode
connector
Prior art date
Application number
TW094121251A
Other languages
English (en)
Chinese (zh)
Other versions
TWI334756B (https=
Inventor
Takashi Kariya
Akira Mochida
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200607428A publication Critical patent/TW200607428A/zh
Application granted granted Critical
Publication of TWI334756B publication Critical patent/TWI334756B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094121251A 2004-06-25 2005-06-24 PCB and its manufacturing method TW200607428A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188855 2004-06-25

Publications (2)

Publication Number Publication Date
TW200607428A true TW200607428A (en) 2006-02-16
TWI334756B TWI334756B (https=) 2010-12-11

Family

ID=35781916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121251A TW200607428A (en) 2004-06-25 2005-06-24 PCB and its manufacturing method

Country Status (6)

Country Link
US (3) US7480150B2 (https=)
EP (1) EP1768474A4 (https=)
JP (2) JPWO2006001505A1 (https=)
CN (2) CN101695216B (https=)
TW (1) TW200607428A (https=)
WO (1) WO2006001505A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4700332B2 (ja) * 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
JP4758235B2 (ja) * 2006-01-23 2011-08-24 日本特殊陶業株式会社 誘電体積層構造体の製造方法
US7336501B2 (en) * 2006-06-26 2008-02-26 Ibiden Co., Ltd. Wiring board with built-in capacitor
US7738257B2 (en) * 2006-12-13 2010-06-15 Intel Corporation Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
JP4980419B2 (ja) 2007-04-18 2012-07-18 イビデン株式会社 多層プリント配線板及びその製造方法
US8730647B2 (en) * 2008-02-07 2014-05-20 Ibiden Co., Ltd. Printed wiring board with capacitor
JP4836092B2 (ja) 2008-03-19 2011-12-14 国立大学法人東北大学 半導体装置の形成方法
JP5284155B2 (ja) * 2008-03-24 2013-09-11 日本特殊陶業株式会社 部品内蔵配線基板
JP2010087499A (ja) * 2008-09-30 2010-04-15 Ibiden Co Ltd コンデンサ装置の製造方法
JP4829998B2 (ja) * 2009-05-01 2011-12-07 新光電気工業株式会社 キャパシタ実装配線基板
JP5352437B2 (ja) * 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20120039460A (ko) * 2010-10-15 2012-04-25 삼성전자주식회사 반도체 패키지
WO2013023926A2 (en) * 2011-08-15 2013-02-21 Sma Solar Technology Ag Electronic device comprising a capacitor in a holder for a circuit board and method for production thereof
US10433421B2 (en) * 2012-12-26 2019-10-01 Intel Corporation Reduced capacitance land pad
US9704894B2 (en) 2013-05-10 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Display device including pixel electrode including oxide
JP2015095587A (ja) * 2013-11-13 2015-05-18 日本特殊陶業株式会社 多層配線基板
KR102231100B1 (ko) * 2014-10-02 2021-03-23 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
JP6628544B2 (ja) 2015-10-07 2020-01-08 富士通株式会社 配線基板の製造方法
CN106658965A (zh) * 2015-10-30 2017-05-10 碁鼎科技秦皇岛有限公司 载板及其制作方法
WO2017183135A1 (ja) * 2016-04-20 2017-10-26 富士通株式会社 回路基板、回路基板の製造方法及び電子装置
JP6750462B2 (ja) 2016-11-04 2020-09-02 Tdk株式会社 薄膜コンデンサ及び電子部品内蔵基板
JP7446335B2 (ja) * 2019-04-29 2024-03-08 アプライド マテリアルズ インコーポレイテッド 接地用ストラップアセンブリ
KR102642386B1 (ko) * 2020-06-29 2024-02-29 티디케이가부시기가이샤 박막 캐패시터 및 그 제조 방법 및 박막 캐패시터를 구비하는 전자 회로 기판
CN117917190A (zh) * 2021-09-09 2024-04-19 三星电子株式会社 用于降低电源噪声的印刷电路板及包括其的电子装置
CN117560860A (zh) * 2022-08-04 2024-02-13 辉达公司 堆叠多个印刷电路板的方法和配置
CN119300233B (zh) * 2023-07-10 2025-11-14 鹏鼎控股(深圳)股份有限公司 具有嵌埋式细线路的电路板结构及其制造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02177350A (ja) * 1988-12-27 1990-07-10 Nec Corp 半導体装置用パッケージ
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen
JPH06291520A (ja) * 1992-04-03 1994-10-18 Matsushita Electric Ind Co Ltd 高周波多層集積回路
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US6005197A (en) * 1997-08-25 1999-12-21 Lucent Technologies Inc. Embedded thin film passive components
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6218729B1 (en) * 1999-03-11 2001-04-17 Atmel Corporation Apparatus and method for an integrated circuit having high Q reactive components
JP3792445B2 (ja) * 1999-03-30 2006-07-05 日本特殊陶業株式会社 コンデンサ付属配線基板
JP2001044591A (ja) * 1999-08-03 2001-02-16 Ngk Spark Plug Co Ltd 配線基板
JP2001210789A (ja) * 2000-01-21 2001-08-03 Hitachi Ltd 薄膜コンデンサ内蔵電子回路及びその製造方法
JP3540709B2 (ja) * 2000-03-06 2004-07-07 日本特殊陶業株式会社 配線基板
JP4224190B2 (ja) * 2000-06-20 2009-02-12 パナソニック電工株式会社 プリント配線板の製造方法及びプリント配線板
US6822170B2 (en) * 2000-12-26 2004-11-23 Ngk Spark Plug Co., Ltd. Embedding resin and wiring substrate using the same
US6512182B2 (en) * 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
JP2003229672A (ja) * 2001-11-30 2003-08-15 Ngk Spark Plug Co Ltd 配線基板
JP4166013B2 (ja) * 2001-12-26 2008-10-15 富士通株式会社 薄膜キャパシタ製造方法
JP2003332752A (ja) * 2002-05-14 2003-11-21 Shinko Electric Ind Co Ltd メタルコア基板およびその製造方法
JP3657925B2 (ja) * 2002-06-17 2005-06-08 株式会社東芝 半導体装置及びその製造方法
JP4103502B2 (ja) 2002-08-28 2008-06-18 株式会社トッパンＮｅｃサーキットソリューションズ 多層配線板及びその製造方法
US20040108134A1 (en) * 2002-10-11 2004-06-10 Borland William J. Printed wiring boards having low inductance embedded capacitors and methods of making same
KR100455891B1 (ko) * 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
US20040231885A1 (en) * 2003-03-07 2004-11-25 Borland William J. Printed wiring boards having capacitors and methods of making thereof
US6970363B2 (en) * 2003-11-26 2005-11-29 Hewlett-Packard Development Company, L.P. Expansion card support mechanism
US20090020073A1 (en) * 2007-07-16 2009-01-22 Hansen Daniel D Deer conditioning system
US8730647B2 (en) 2008-02-07 2014-05-20 Ibiden Co., Ltd. Printed wiring board with capacitor

Also Published As

Publication number Publication date
TWI334756B (https=) 2010-12-11
US20080104833A1 (en) 2008-05-08
JPWO2006001505A1 (ja) 2008-04-17
US7480150B2 (en) 2009-01-20
CN1973590A (zh) 2007-05-30
US20100193227A1 (en) 2010-08-05
EP1768474A1 (en) 2007-03-28
CN101695216A (zh) 2010-04-14
CN101695216B (zh) 2012-01-04
US20070105278A1 (en) 2007-05-10
CN100576979C (zh) 2009-12-30
US7856710B2 (en) 2010-12-28
JP2012033968A (ja) 2012-02-16
EP1768474A4 (en) 2010-06-16
US8093508B2 (en) 2012-01-10
WO2006001505A1 (ja) 2006-01-05

Similar Documents

Publication Publication Date Title
TW200607428A (en) PCB and its manufacturing method
EP1895820A3 (en) Wired circuit board and production method thereof
TW200617098A (en) Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method
EP1956875A3 (en) Wired circuit board and method for producing the same
TW200731889A (en) Method of fabricating substrate with embedded component therein
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
WO2007127926A3 (en) Spinal cord stimulation paddle lead and method of making the same
WO2009021233A3 (en) Pcb droplet actuator fabrication
EP2325911A3 (en) Phase change memory elements using self-aligned phase change material layers and methods of making and using the same
MY158913A (en) Material for electric contact and method of producing the same
PL2195885T3 (pl) Elektryczny element stykowy i sposób jego wytwarzania
SG135106A1 (en) Method and process for embedding electrically conductive elements in a dielectric layer
ATE266247T1 (de) Festelektrolytkondensatoren und deren herstellungsverfahren
TW200746940A (en) Printed wiring board
EP1926089A3 (en) Suspension board with circuit and producing method thereof
EP1906714A3 (en) Wired Circuit Board and Producing Method Thereof
FI20030293A7 (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
WO2002084683A1 (en) Production method of laminate ceramic electronic component
TW200625596A (en) Inductor and method of forming the same
ATE279013T1 (de) Festelektrolytkondensatoren und herstellungsverfahren
MXPA05008151A (es) Capacitor y metodo de produccion del capacitor.
TW200614292A (en) Method for producing dielectric layer-constituting material, dielectric layer-constituting material produced by such method, method for manufacturing capacitor circuit-forming member using such dielectric layer-constituting material, capacitor circui
WO2008155967A1 (ja) 部品内蔵基板及びその製造方法
TW200601917A (en) Method for fabricating electrical connection structure of circuit board
TW200644004A (en) Multilayer ceramic electronic device and method of production of the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees