TW200604131A - Method for purifying silicon carbide coated structures - Google Patents

Method for purifying silicon carbide coated structures

Info

Publication number
TW200604131A
TW200604131A TW094110383A TW94110383A TW200604131A TW 200604131 A TW200604131 A TW 200604131A TW 094110383 A TW094110383 A TW 094110383A TW 94110383 A TW94110383 A TW 94110383A TW 200604131 A TW200604131 A TW 200604131A
Authority
TW
Taiwan
Prior art keywords
silicon carbide
carbide coated
purifying silicon
coated structures
structures
Prior art date
Application number
TW094110383A
Other languages
English (en)
Other versions
TWI356813B (en
Inventor
Larry Wayne Shive
Brian Lawrence Gilmore
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of TW200604131A publication Critical patent/TW200604131A/zh
Application granted granted Critical
Publication of TWI356813B publication Critical patent/TWI356813B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Ceramic Products (AREA)
TW094110383A 2004-07-27 2005-03-31 Method for purifying silicon carbide coated struct TWI356813B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/900,938 US7888685B2 (en) 2004-07-27 2004-07-27 High purity silicon carbide structures

Publications (2)

Publication Number Publication Date
TW200604131A true TW200604131A (en) 2006-02-01
TWI356813B TWI356813B (en) 2012-01-21

Family

ID=34993298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110383A TWI356813B (en) 2004-07-27 2005-03-31 Method for purifying silicon carbide coated struct

Country Status (8)

Country Link
US (2) US7888685B2 (zh)
EP (2) EP2199267B1 (zh)
JP (1) JP5103178B2 (zh)
KR (1) KR101201164B1 (zh)
CN (1) CN100575311C (zh)
DE (1) DE602005024989D1 (zh)
TW (1) TWI356813B (zh)
WO (1) WO2006022875A1 (zh)

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US7601227B2 (en) * 2005-08-05 2009-10-13 Sumco Corporation High purification method of jig for semiconductor heat treatment
JP4290187B2 (ja) * 2006-09-27 2009-07-01 コバレントマテリアル株式会社 半導体ウェーハ熱処理用ボートの表面清浄化方法
KR100954107B1 (ko) * 2006-12-27 2010-04-23 주식회사 하이닉스반도체 반도체 소자의 제조방법
JP2009194216A (ja) * 2008-02-15 2009-08-27 Hitachi Ltd 半導体装置の製造方法
WO2012008179A1 (ja) * 2010-07-12 2012-01-19 住友精密工業株式会社 エッチング方法
EE05583B1 (et) * 2010-09-13 2012-10-15 OÜ Skeleton Technologies Meetod sünteetilise karbiidset päritolu süsinikmaterjali ja räni homodispersse komposiidi valmistamiseks ning selle kasutamine elektroodmaterjalina energiasalvestis
JP5925685B2 (ja) * 2010-09-27 2016-05-25 多摩化学工業株式会社 半導体基板用アルカリ性処理液の精製方法及び精製装置
US9343379B2 (en) * 2011-10-14 2016-05-17 Sunedison Semiconductor Limited Method to delineate crystal related defects
JP5890232B2 (ja) * 2012-04-06 2016-03-22 株式会社ブリヂストン 炭化ケイ素部材の製造方法
US9546420B1 (en) * 2012-10-08 2017-01-17 Sandia Corporation Methods of depositing an alpha-silicon-carbide-containing film at low temperature
JP6057292B2 (ja) * 2013-06-13 2017-01-11 学校法人関西学院 ＳｉＣ半導体素子の製造方法
JP6086056B2 (ja) * 2013-11-26 2017-03-01 信越半導体株式会社 熱処理方法
CN104299890A (zh) * 2014-10-09 2015-01-21 浙江大学 一种硅片表面钨铁金属离子的清洗方法
CN106298616B (zh) * 2015-06-04 2019-12-13 有研半导体材料有限公司 一种硅片承载部件及降低高温退火片体金属含量的方法
EP3159325B1 (en) 2015-10-22 2020-07-08 Rolls-Royce High Temperature Composites Inc Reducing impurities in ceramic matrix composites
EP3375767B1 (en) * 2017-03-16 2020-05-13 Infineon Technologies AG Electrochemically robust ceramic substrates
CN109179422B (zh) * 2018-08-29 2021-08-24 四川大学 一种大规模无定形硅颗粒的制备方法
CN109824367A (zh) * 2019-02-21 2019-05-31 国网河南省电力公司社旗县供电公司 一种碳化硅基复合电路板及其制备方法
CN113479889B (zh) * 2021-08-20 2022-12-09 中电化合物半导体有限公司 一种碳化硅粉料的合成方法

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Also Published As

Publication number Publication date
CN100575311C (zh) 2009-12-30
US7696103B2 (en) 2010-04-13
EP2199267B1 (en) 2013-09-18
KR101201164B1 (ko) 2012-11-13
KR20070073736A (ko) 2007-07-10
US20060024969A1 (en) 2006-02-02
EP2199267A1 (en) 2010-06-23
EP1791799A1 (en) 2007-06-06
JP2008508176A (ja) 2008-03-21
US7888685B2 (en) 2011-02-15
JP5103178B2 (ja) 2012-12-19
TWI356813B (en) 2012-01-21
US20070221609A1 (en) 2007-09-27
EP1791799B1 (en) 2010-11-24
CN101027267A (zh) 2007-08-29
DE602005024989D1 (de) 2011-01-05
WO2006022875A1 (en) 2006-03-02

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