TW200510060A - Metallic nano-particle and method for producing same, liquid dispersion of metallic nano-particle and method for producing same, metal thin line, metal film and method for producing same - Google Patents
Metallic nano-particle and method for producing same, liquid dispersion of metallic nano-particle and method for producing same, metal thin line, metal film and method for producing sameInfo
- Publication number
- TW200510060A TW200510060A TW093127010A TW93127010A TW200510060A TW 200510060 A TW200510060 A TW 200510060A TW 093127010 A TW093127010 A TW 093127010A TW 93127010 A TW93127010 A TW 93127010A TW 200510060 A TW200510060 A TW 200510060A
- Authority
- TW
- Taiwan
- Prior art keywords
- producing same
- particle
- metallic nano
- metal
- liquid dispersion
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 7
- 239000006185 dispersion Substances 0.000 title abstract 4
- 239000007788 liquid Substances 0.000 title abstract 4
- 239000002105 nanoparticle Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 3
- -1 amine metal complex Chemical class 0.000 abstract 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 229930195729 fatty acid Natural products 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 150000004665 fatty acids Chemical class 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910000510 noble metal Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052723 transition metal Inorganic materials 0.000 abstract 1
- 150000003624 transition metals Chemical class 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/0004—Preparation of sols
- B01J13/0043—Preparation of sols containing elemental metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
- C09K23/16—Amines or polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Composite Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003317161A JP2005081501A (ja) | 2003-09-09 | 2003-09-09 | 金属ナノ粒子及びその製造方法、金属ナノ粒子分散液及びその製造方法、並びに金属細線及び金属膜及びその形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200510060A true TW200510060A (en) | 2005-03-16 |
TWI351982B TWI351982B (zh) | 2011-11-11 |
Family
ID=34269849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093127010A TW200510060A (en) | 2003-09-09 | 2004-09-07 | Metallic nano-particle and method for producing same, liquid dispersion of metallic nano-particle and method for producing same, metal thin line, metal film and method for producing same |
Country Status (7)
Country | Link |
---|---|
US (1) | US7628840B2 (zh) |
EP (1) | EP1666408A4 (zh) |
JP (1) | JP2005081501A (zh) |
KR (1) | KR100764535B1 (zh) |
CN (1) | CN1849260B (zh) |
TW (1) | TW200510060A (zh) |
WO (1) | WO2005023702A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464753B (zh) * | 2011-07-26 | 2014-12-11 | Univ Nat Sun Yat Sen | 在室溫下形成導電薄膜之方法 |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1724789B1 (en) | 2004-03-10 | 2010-12-22 | Asahi Glass Company, Limited | Metal-containing fine particle, liquid dispersion of metal-containing fine particle, and conductive metal-containing material |
US7270694B2 (en) | 2004-10-05 | 2007-09-18 | Xerox Corporation | Stabilized silver nanoparticles and their use |
KR100773534B1 (ko) * | 2005-07-15 | 2007-11-05 | 삼성전기주식회사 | 혼합 분산제, 이를 이용한 페이스트 조성물 및 분산방법 |
JP4822783B2 (ja) * | 2005-09-22 | 2011-11-24 | 株式会社日本触媒 | 金属ナノ粒子の製法および当該製法により得られた粒子のコロイド |
JP4699156B2 (ja) * | 2005-09-29 | 2011-06-08 | 大日本印刷株式会社 | ガスバリアフィルム |
US7981327B2 (en) | 2005-10-14 | 2011-07-19 | Toyo Ink Mfg. Co. Ltd. | Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film |
US8110510B1 (en) * | 2005-10-17 | 2012-02-07 | Merck Patent Gmbh | Low temperature synthesis of nanowires in solution |
KR101167733B1 (ko) * | 2005-11-16 | 2012-07-23 | 삼성전기주식회사 | 캡핑 리간드가 표면에 결합되어 있는 나노입자용 분산제, 이를 이용한 나노입자의 분산방법 및 이를 포함하는 나노입자 박막 |
TWI347614B (en) * | 2006-01-11 | 2011-08-21 | Dowa Electronics Materials Co Ltd | Silver electroconductive film and manufacturing method of the same |
JP5084145B2 (ja) * | 2006-01-25 | 2012-11-28 | 株式会社日本触媒 | ナノ粒子分散体の保存方法及び輸送方法 |
JP4983150B2 (ja) | 2006-04-28 | 2012-07-25 | 東洋インキScホールディングス株式会社 | 導電性被膜の製造方法 |
US20100075137A1 (en) * | 2006-05-17 | 2010-03-25 | Lockheed Martin Corporation | Carbon nanotube synthesis using refractory metal nanoparticles and manufacture of refractory metal nanoparticles |
US8012676B2 (en) | 2006-06-22 | 2011-09-06 | Mitsubishi Paper Mills Limited | Process for preparing conductive material |
KR100790457B1 (ko) * | 2006-07-10 | 2008-01-02 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
EP2048205A4 (en) * | 2006-07-28 | 2010-07-21 | Asahi Glass Co Ltd | DISPERSION CONTAINING FINE METALLIC PARTICLES, METHOD FOR PRODUCING THE DISPERSION AND ARTICLES HAVING METALLIC FILMS |
US8337726B2 (en) | 2006-07-28 | 2012-12-25 | Furukawa Electric Co., Ltd. | Fine particle dispersion and method for producing fine particle dispersion |
US8277693B2 (en) | 2006-07-28 | 2012-10-02 | Furukawa Electric Co., Ltd. | Method for producing fine particle dispersion and fine particle dispersion |
JP5139659B2 (ja) * | 2006-09-27 | 2013-02-06 | Dowaエレクトロニクス株式会社 | 銀粒子複合粉末およびその製造法 |
JP5096735B2 (ja) | 2006-12-05 | 2012-12-12 | Jx日鉱日石エネルギー株式会社 | ワイヤグリッド型偏光子及びその製造方法、並びにそれを用いた位相差フィルム及び液晶表示素子 |
KR100818195B1 (ko) | 2006-12-14 | 2008-03-31 | 삼성전기주식회사 | 금속 나노입자의 제조방법 및 이에 따라 제조된 금속나노입자 |
WO2009008390A1 (ja) * | 2007-07-06 | 2009-01-15 | M.Technique Co., Ltd. | 金属微粒子の製造方法及びその金属微粒子を含む金属コロイド溶液 |
US8555491B2 (en) | 2007-07-19 | 2013-10-15 | Alpha Metals, Inc. | Methods of attaching a die to a substrate |
KR20090012605A (ko) * | 2007-07-30 | 2009-02-04 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
US8841375B2 (en) * | 2007-09-27 | 2014-09-23 | Basf Se | Isolable and redispersable transition metal nanoparticles their preparation and use as IR absorbers |
KR20090032841A (ko) * | 2007-09-28 | 2009-04-01 | 삼성전기주식회사 | 로드 형태를 포함하는 금속 나노입자의 제조방법 |
US8293144B2 (en) * | 2007-10-24 | 2012-10-23 | Dowa Electronics Materials Co., Ltd. | Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles |
KR20090041964A (ko) * | 2007-10-25 | 2009-04-29 | 재단법인서울대학교산학협력재단 | 침철광 나노튜브 및 그 제조 방법 |
US8801971B2 (en) | 2007-12-18 | 2014-08-12 | Hitachi Chemical Company, Ltd. | Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
WO2009085342A1 (en) | 2007-12-27 | 2009-07-09 | Lockheed Martin Corporation | Nano-structured refractory metals, metal carbides, and coatings and parts fabricated therefrom |
US8192866B2 (en) * | 2008-03-04 | 2012-06-05 | Lockheed Martin Corporation | Tin nanoparticles and methodology for making same |
FI20085229L (fi) * | 2008-03-18 | 2009-09-19 | Keskuslaboratorio | Uudet materiaalit ja menetelmät |
US8414806B2 (en) * | 2008-03-28 | 2013-04-09 | Nanyang Technological University | Membrane made of a nanostructured material |
US20110155968A1 (en) * | 2008-06-30 | 2011-06-30 | Dowa Electronics Materials Co., Ltd. | Fine metal particle-containing composition and method for manufacturing the same |
JP4454673B2 (ja) * | 2008-08-01 | 2010-04-21 | 株式会社新川 | 金属ナノインクとその製造方法並びにその金属ナノインクを用いるダイボンディング方法及びダイボンディング装置 |
KR20100016821A (ko) * | 2008-08-05 | 2010-02-16 | 삼성전기주식회사 | 니켈 나노입자 제조방법 |
US8900704B1 (en) | 2008-08-05 | 2014-12-02 | Lockheed Martin Corporation | Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity |
US8419822B2 (en) * | 2008-08-18 | 2013-04-16 | Xerox Corporation | Methods for producing carboxylic acid stabilized silver nanoparticles |
US9095898B2 (en) | 2008-09-15 | 2015-08-04 | Lockheed Martin Corporation | Stabilized metal nanoparticles and methods for production thereof |
US8105414B2 (en) * | 2008-09-15 | 2012-01-31 | Lockheed Martin Corporation | Lead solder-free electronics |
US8486305B2 (en) * | 2009-11-30 | 2013-07-16 | Lockheed Martin Corporation | Nanoparticle composition and methods of making the same |
JP5667558B2 (ja) * | 2009-02-27 | 2015-02-12 | 日産化学工業株式会社 | 有機スイッチング素子及びその製造方法 |
JP5526578B2 (ja) * | 2009-04-01 | 2014-06-18 | 三菱マテリアル株式会社 | 粒子分散体の製造方法並びにこの粒子分散体を用いた酸化物半導体粒子、金属粒子及び半金属粒子の製造方法 |
JP5574761B2 (ja) * | 2009-04-17 | 2014-08-20 | 国立大学法人山形大学 | 被覆銀超微粒子とその製造方法 |
US9072185B2 (en) | 2009-07-30 | 2015-06-30 | Lockheed Martin Corporation | Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas |
US9011570B2 (en) | 2009-07-30 | 2015-04-21 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
US8834747B2 (en) * | 2010-03-04 | 2014-09-16 | Lockheed Martin Corporation | Compositions containing tin nanoparticles and methods for use thereof |
US10544483B2 (en) | 2010-03-04 | 2020-01-28 | Lockheed Martin Corporation | Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same |
KR101700615B1 (ko) * | 2010-03-30 | 2017-01-31 | 주식회사 동진쎄미켐 | 금속 나노입자의 제조방법, 이에 의해 제조된 금속 나노입자 및 이를 포함하는 금속 잉크 조성물 |
KR20110139941A (ko) * | 2010-06-24 | 2011-12-30 | 삼성전기주식회사 | 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴 |
KR20110139942A (ko) * | 2010-06-24 | 2011-12-30 | 삼성전기주식회사 | 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴 |
SG190408A1 (en) * | 2010-12-01 | 2013-06-28 | Univ Singapore | Method of preparing transparent conducting oxide films |
TWI520990B (zh) | 2011-01-26 | 2016-02-11 | Maruzen Petrochem Co Ltd | Metal nano particle composite and its manufacturing method |
JP5624915B2 (ja) * | 2011-03-03 | 2014-11-12 | 株式会社アルバック | 金属ナノ粒子分散液 |
KR20130031414A (ko) * | 2011-09-21 | 2013-03-29 | 삼성전기주식회사 | 저온소성용 도전성 페이스트 조성물 |
US20140312285A1 (en) * | 2011-10-24 | 2014-10-23 | Bando Chemical Industries, Ltd. | Composition for bonding |
CN102371358A (zh) * | 2011-11-18 | 2012-03-14 | 复旦大学 | 一种可再分散的纳米铜粒子的水相制备方法 |
KR101151366B1 (ko) * | 2011-11-24 | 2012-06-08 | 한화케미칼 주식회사 | 도전성 입자 및 이의 제조방법 |
EP2812923B1 (en) | 2012-02-10 | 2019-11-27 | Lockheed Martin Corporation | Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof |
EP2812139B1 (en) | 2012-02-10 | 2017-12-27 | Lockheed Martin Corporation | Nanoparticle paste formulations and methods for production and use thereof |
EP2818265B1 (en) * | 2012-02-21 | 2019-01-16 | M Technique Co., Ltd. | Method for producing microparticles |
US8968824B2 (en) * | 2013-03-14 | 2015-03-03 | Dowa Electronics Materials Co., Ltd. | Method for producing silver conductive film |
CN104521005B (zh) * | 2013-04-05 | 2016-08-24 | 苏州诺菲纳米科技有限公司 | 带有融合金属纳米线的透明导电电极、它们的结构设计及其制造方法 |
JP6099472B2 (ja) * | 2013-04-26 | 2017-03-22 | Dowaエレクトロニクス株式会社 | 金属ナノ粒子分散体、金属ナノ粒子分散体の製造方法および接合方法 |
JP6676403B2 (ja) | 2016-02-23 | 2020-04-08 | エスアイアイ・クリスタルテクノロジー株式会社 | 圧電振動片、及び圧電振動子 |
KR102201639B1 (ko) * | 2016-05-16 | 2021-01-12 | 디아이씨 가부시끼가이샤 | 금속 나노 입자 수분산액 |
US10356899B2 (en) | 2016-08-09 | 2019-07-16 | Eastman Kodak Company | Articles having reducible silver ion complexes or silver metal |
US10186342B2 (en) | 2016-08-09 | 2019-01-22 | Eastman Kodak Company | Photosensitive reducible silver ion-containing compositions |
US10087331B2 (en) | 2016-08-09 | 2018-10-02 | Eastman Kodak Company | Methods for forming and using silver metal |
US10311990B2 (en) | 2016-08-09 | 2019-06-04 | Eastman Kodak Company | Photosensitive reducible silver ion-containing compositions |
US9718842B1 (en) | 2016-08-09 | 2017-08-01 | Eastman Kodak Company | Silver ion carboxylate primary alkylamine complexes |
US10314173B2 (en) | 2016-08-09 | 2019-06-04 | Eastman Kodak Company | Articles with reducible silver ions or silver metal |
US9809606B1 (en) | 2016-08-09 | 2017-11-07 | Eastman Kodak Company | Silver ion carboxylate N-heteroaromatic complexes |
CN106829887B (zh) * | 2017-01-19 | 2019-05-24 | 南开大学 | 一种基于MOFs材料同步合成有机物和金属化合物纳米粒子的方法 |
JP7120890B2 (ja) * | 2018-11-16 | 2022-08-17 | 田中貴金属工業株式会社 | 金属配線を備える導電基板及び該導電基板の製造方法、並びに金属配線形成用の金属インク |
CN111438373B (zh) * | 2020-05-27 | 2022-11-22 | 山西大同大学 | 一种铜银核壳结构双金属球状纳米粒子的制备方法 |
CN114226711A (zh) * | 2021-12-31 | 2022-03-25 | 江苏纳美达光电科技有限公司 | 银纳米粒子及其制备方法 |
CN116403757B (zh) * | 2023-05-23 | 2024-07-02 | 广东工业大学 | 一种纳米金属粉浆及其制备方法和应用 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5250101A (en) * | 1991-04-08 | 1993-10-05 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of fine powder |
US5389122A (en) * | 1993-07-13 | 1995-02-14 | E. I. Du Pont De Nemours And Company | Process for making finely divided, dense packing, spherical shaped silver particles |
JP3205793B2 (ja) | 1996-12-19 | 2001-09-04 | 株式会社巴製作所 | 超微粒子及びその製造方法 |
US6103868A (en) * | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
JPH11269656A (ja) * | 1998-03-20 | 1999-10-05 | Kojundo Chem Lab Co Ltd | 薄膜形成用組成物の製造法とそれを用いた薄膜 |
JPH11319538A (ja) | 1998-05-20 | 1999-11-24 | Nippon Paint Co Ltd | 貴金属又は銅のコロイドの製造方法 |
AU5248600A (en) | 1999-06-15 | 2001-01-02 | Kimoto, Masaaki | Ultrafine composite metal powder and method for producing the same |
US6346136B1 (en) * | 2000-03-31 | 2002-02-12 | Ping Chen | Process for forming metal nanoparticles and fibers |
JP4871443B2 (ja) | 2000-10-13 | 2012-02-08 | 株式会社アルバック | 金属超微粒子分散液の製造方法 |
CA2426861C (en) * | 2000-10-25 | 2008-10-28 | Yorishige Matsuba | Conductive metal paste |
JP4627376B2 (ja) | 2001-02-20 | 2011-02-09 | バンドー化学株式会社 | 金属コロイド液及びその製造方法 |
JP2002317215A (ja) * | 2001-04-19 | 2002-10-31 | Mitsuboshi Belting Ltd | 金属微粒子の製造方法 |
KR100867281B1 (ko) * | 2001-10-12 | 2008-11-06 | 재단법인서울대학교산학협력재단 | 크기분리 과정 없이 균일하고 결정성이 우수한 금속,합금, 금속 산화물, 및 복합금속 산화물 나노입자를제조하는 방법 |
US6676729B2 (en) * | 2002-01-02 | 2004-01-13 | International Business Machines Corporation | Metal salt reduction to form alloy nanoparticles |
DE60302682T2 (de) * | 2002-02-18 | 2006-08-31 | Fuji Photo Film Co., Ltd., Minami-Ashigara | Verfahren zur Herstellung von Nanopartikeln |
US6974493B2 (en) * | 2002-11-26 | 2005-12-13 | Honda Motor Co., Ltd. | Method for synthesis of metal nanoparticles |
EP1640338B1 (en) * | 2003-06-10 | 2011-11-02 | Asahi Glass Company, Limited | Method for producing metal hydride fine particle, liquid dispersion containing metal hydride fine particle, and metallic material |
US7160525B1 (en) * | 2003-10-14 | 2007-01-09 | The Board Of Trustees Of The University Of Arkansas | Monodisperse noble metal nanocrystals |
US7335245B2 (en) * | 2004-04-22 | 2008-02-26 | Honda Motor Co., Ltd. | Metal and alloy nanoparticles and synthesis methods thereof |
-
2003
- 2003-09-09 JP JP2003317161A patent/JP2005081501A/ja active Pending
-
2004
- 2004-09-07 CN CN2004800259542A patent/CN1849260B/zh not_active Expired - Lifetime
- 2004-09-07 WO PCT/JP2004/012968 patent/WO2005023702A1/ja active Application Filing
- 2004-09-07 TW TW093127010A patent/TW200510060A/zh unknown
- 2004-09-07 US US10/571,315 patent/US7628840B2/en active Active
- 2004-09-07 EP EP04787672A patent/EP1666408A4/en not_active Withdrawn
- 2004-09-07 KR KR1020067004830A patent/KR100764535B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI464753B (zh) * | 2011-07-26 | 2014-12-11 | Univ Nat Sun Yat Sen | 在室溫下形成導電薄膜之方法 |
Also Published As
Publication number | Publication date |
---|---|
US7628840B2 (en) | 2009-12-08 |
KR20060069491A (ko) | 2006-06-21 |
WO2005023702A1 (ja) | 2005-03-17 |
US20070134491A1 (en) | 2007-06-14 |
KR100764535B1 (ko) | 2007-10-09 |
CN1849260B (zh) | 2011-12-14 |
TWI351982B (zh) | 2011-11-11 |
JP2005081501A (ja) | 2005-03-31 |
EP1666408A4 (en) | 2009-11-25 |
EP1666408A1 (en) | 2006-06-07 |
CN1849260A (zh) | 2006-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200510060A (en) | Metallic nano-particle and method for producing same, liquid dispersion of metallic nano-particle and method for producing same, metal thin line, metal film and method for producing same | |
Beech | Sulfate-reducing bacteria in biofilms on metallic materials and corrosion | |
Radovanović et al. | Protection of copper surface in acidic chloride solution by non-toxic thiadiazole derivative | |
TW200636834A (en) | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | |
KR950032710A (ko) | 동 또는 동합금 처리 조성물 | |
Jiang et al. | Corrosion protection of polypyrrole electrodeposited on AZ91 magnesium alloys in alkaline solutions | |
Presuel-Moreno et al. | Inhibition of the oxygen reduction reaction on copper with cobalt, cerium, and molybdate ions | |
CA2729376A1 (en) | Method for dispersing and separating nanotubes | |
Bernasconi et al. | Ruthenium electrodeposition from deep eutectic solvents | |
CN101956090A (zh) | 一种采用Cu-Zn合金制备纳米多孔铜的方法 | |
EP1739208A4 (en) | ELECTRODE FOR GENERATING HYDROGEN, PROCESS FOR PRODUCING THE SAME, AND ELECTROLYSIS METHOD WITH SAME | |
ATE503852T1 (de) | Verfahren zur herstellung eines rheniumhaltigen legierungspulvers | |
Oulfajrite et al. | Electrochemical behavior of a new solder material (Sn–In–Ag) | |
ATE381965T1 (de) | Chromfreie kupfermetall-katalysator mit wenigstens einem weiteren metall | |
Yan et al. | Corrosion control coatings for aluminum alloys based on neutral and n-doped conjugated polymers | |
AR034247A1 (es) | Un proceso para la electrodeposicion de cobre a partir de una solucion en una celda electrolitica, una celda electrolitica, un electrodo para usar en la celda electrolitica, y un metodo para producir el electrodo | |
Zaky et al. | Electrochemical behaviour of silver in borate buffer solutions | |
EA200501752A1 (ru) | Композиции и способы чернения и придания коррозионно-стойких свойств цинку или другим активным металлам | |
Radovanovic et al. | Protection of Brass in HCl Solution by L‐Cysteine and Cationic Surfactant | |
ATE330039T1 (de) | Kupferlegierung mit zink, zinn und eisen zur elektrischen verbindung und verfahren zur herstellung der legierung | |
Tsai et al. | Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping | |
Kitada et al. | Potentiostatic Cu-Zn alloying for polymer metallization using medium-low temperature ionic liquid baths | |
CN110129807A (zh) | 一种用于铜/铁基材的酸洗缓蚀剂及酸洗液 | |
Sharma et al. | Effect of Cr addition on pitting behaviour of iron aluminide intermetallic | |
Phan et al. | Characterization of nanostructured PbO2–PANi composite materials synthesized by combining electrochemical and chemical methods |