TW200509364A - Pasting method and pasting apparatus - Google Patents
Pasting method and pasting apparatusInfo
- Publication number
- TW200509364A TW200509364A TW093122302A TW93122302A TW200509364A TW 200509364 A TW200509364 A TW 200509364A TW 093122302 A TW093122302 A TW 093122302A TW 93122302 A TW93122302 A TW 93122302A TW 200509364 A TW200509364 A TW 200509364A
- Authority
- TW
- Taiwan
- Prior art keywords
- pasting
- members
- thin plate
- liquid
- liquid crystal
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 230000007246 mechanism Effects 0.000 abstract 5
- 239000004973 liquid crystal related substance Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B2038/1891—Using a robot for handling the layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003281703A JP2005051055A (ja) | 2003-07-29 | 2003-07-29 | 貼合せ方法および貼合せ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200509364A true TW200509364A (en) | 2005-03-01 |
Family
ID=34100963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093122302A TW200509364A (en) | 2003-07-29 | 2004-07-26 | Pasting method and pasting apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070187868A1 (zh) |
EP (1) | EP1650791A4 (zh) |
JP (1) | JP2005051055A (zh) |
KR (2) | KR100826862B1 (zh) |
CN (1) | CN100433287C (zh) |
TW (1) | TW200509364A (zh) |
WO (1) | WO2005010979A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI573662B (zh) * | 2011-03-25 | 2017-03-11 | 不二越機械工業股份有限公司 | 工作件之貼附方法以及貼附裝置 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004007060B3 (de) | 2004-02-13 | 2005-07-07 | Thallner, Erich, Dipl.-Ing. | Vorrichtung und Verfahren zum Verbinden von Wafern |
JP2006237492A (ja) * | 2005-02-28 | 2006-09-07 | Dainippon Screen Mfg Co Ltd | ウエハ処理装置 |
JP4954663B2 (ja) * | 2005-10-17 | 2012-06-20 | 東京エレクトロン株式会社 | 貼り合せ装置 |
JP2007109999A (ja) * | 2005-10-17 | 2007-04-26 | Tokyo Electron Ltd | 貼り合せ方法 |
DE102006058493B4 (de) * | 2006-12-12 | 2012-03-22 | Erich Thallner | Verfahren und Vorrichtung zum Bonden von Wafern |
US8950459B2 (en) | 2009-04-16 | 2015-02-10 | Suss Microtec Lithography Gmbh | Debonding temporarily bonded semiconductor wafers |
KR20120027237A (ko) | 2009-04-16 | 2012-03-21 | 수스 마이크로텍 리소그라피 게엠바하 | 웨이퍼 가접합 및 분리를 위한 개선된 장치 |
JP5476063B2 (ja) | 2009-07-28 | 2014-04-23 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
JP5537081B2 (ja) | 2009-07-28 | 2014-07-02 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
EP2474478B1 (en) * | 2009-09-04 | 2017-04-05 | Dexerials Corporation | Filling device |
CN101702397B (zh) * | 2009-11-16 | 2011-08-10 | 中国电子科技集团公司第四十五研究所 | 晶片蜡粘接设备 |
CN102811837B (zh) * | 2010-03-25 | 2015-12-02 | 富士纺控股株式会社 | 玻璃基板保持用膜体及玻璃基板的研磨方法 |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
TWI468787B (zh) * | 2012-04-25 | 2015-01-11 | Mirle Automation Corp | 暫時性貼合方法及其貼合設備 |
CN102707657B (zh) * | 2012-05-17 | 2014-04-02 | 山东轻工业学院 | 一种led芯片多工位全自动上蜡控制系统及控制方法 |
CN103219266B (zh) * | 2013-04-28 | 2015-09-09 | 康可电子(无锡)有限公司 | 晶圆涂蜡台 |
CN104759974B (zh) * | 2015-04-16 | 2017-07-04 | 常州市科沛达超声工程设备有限公司 | 全自动贴片机 |
TWI668158B (zh) * | 2017-03-14 | 2019-08-11 | 萬潤科技股份有限公司 | Component bonding method and device |
KR102312748B1 (ko) * | 2020-03-05 | 2021-10-14 | 코세스지티 주식회사 | 박형 글래스 적층장치 및 이를 이용한 적층방법 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
US3870416A (en) * | 1974-01-09 | 1975-03-11 | Bell Telephone Labor Inc | Wafer alignment apparatus |
FR2557026B1 (fr) * | 1983-12-26 | 1986-08-22 | Alsacienne Aluminium | Materiau souple en feuille, notamment pour l'emballage et le surbouchage |
US4682766A (en) * | 1985-08-06 | 1987-07-28 | Pace, Incorporated | X-Y-Z rotation positioning system using flexible mountings |
JPH07115298B2 (ja) * | 1987-03-28 | 1995-12-13 | 三菱マテリアル株式会社 | ウエ−ハの加圧接着装置 |
JP2534210B2 (ja) * | 1989-04-03 | 1996-09-11 | 三菱電機株式会社 | ウエハ剥し装置 |
JP2648638B2 (ja) * | 1990-11-30 | 1997-09-03 | 三菱マテリアル株式会社 | ウェーハの接着方法およびその装置 |
JPH05111976A (ja) * | 1991-10-22 | 1993-05-07 | Nippon Steel Corp | 耐デント性に優れた自動車用薄鋼板クラツドアルミニウム薄板もしくはアルミニウム合金薄板およびその製造方法 |
JPH1012578A (ja) * | 1996-06-26 | 1998-01-16 | Mitsubishi Electric Corp | ウエハ・支持基板貼付け方法,及びウエハ・支持基板貼付け装置 |
JPH1076439A (ja) * | 1996-08-30 | 1998-03-24 | Sony Corp | 薄板保持装置 |
US5976331A (en) * | 1998-04-30 | 1999-11-02 | Lucent Technologies Inc. | Electrodeposition apparatus for coating wafers |
JP3995796B2 (ja) * | 1998-05-01 | 2007-10-24 | 不二越機械工業株式会社 | ウェーハの貼付方法及びその装置 |
JP2000062116A (ja) * | 1998-08-25 | 2000-02-29 | Japan Polychem Corp | 包装用積層フィルム |
DE10014017C1 (de) * | 2000-03-23 | 2002-01-03 | Thyssenkrupp Stahl Ag | Verfahren zum Herstellen eines Doppellagenbleches sowie ein tiefziehfähiges Doppellagenblech |
JP3938655B2 (ja) * | 2000-08-25 | 2007-06-27 | 東レエンジニアリング株式会社 | アライメント装置 |
CN1476629A (zh) * | 2000-11-22 | 2004-02-18 | 株式会社尼康 | 曝光设备、曝光法及器件制造法 |
-
2003
- 2003-07-29 JP JP2003281703A patent/JP2005051055A/ja active Pending
-
2004
- 2004-07-14 KR KR1020067002068A patent/KR100826862B1/ko not_active IP Right Cessation
- 2004-07-14 WO PCT/JP2004/010050 patent/WO2005010979A1/ja active Application Filing
- 2004-07-14 EP EP04747516A patent/EP1650791A4/en active Pending
- 2004-07-14 US US10/566,217 patent/US20070187868A1/en not_active Abandoned
- 2004-07-14 CN CNB2004800216852A patent/CN100433287C/zh not_active Expired - Fee Related
- 2004-07-14 KR KR1020077024762A patent/KR100864466B1/ko not_active IP Right Cessation
- 2004-07-26 TW TW093122302A patent/TW200509364A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI573662B (zh) * | 2011-03-25 | 2017-03-11 | 不二越機械工業股份有限公司 | 工作件之貼附方法以及貼附裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20070187868A1 (en) | 2007-08-16 |
EP1650791A4 (en) | 2007-12-19 |
EP1650791A1 (en) | 2006-04-26 |
JP2005051055A (ja) | 2005-02-24 |
CN1830076A (zh) | 2006-09-06 |
KR20060031701A (ko) | 2006-04-12 |
KR100864466B1 (ko) | 2008-10-22 |
KR100826862B1 (ko) | 2008-05-06 |
KR20070119711A (ko) | 2007-12-20 |
WO2005010979A1 (ja) | 2005-02-03 |
CN100433287C (zh) | 2008-11-12 |
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