TW200509159A - Micro surface mount coil unit - Google Patents

Micro surface mount coil unit

Info

Publication number
TW200509159A
TW200509159A TW093121846A TW93121846A TW200509159A TW 200509159 A TW200509159 A TW 200509159A TW 093121846 A TW093121846 A TW 093121846A TW 93121846 A TW93121846 A TW 93121846A TW 200509159 A TW200509159 A TW 200509159A
Authority
TW
Taiwan
Prior art keywords
coil unit
coil
lead frame
surface mount
micro surface
Prior art date
Application number
TW093121846A
Other languages
English (en)
Other versions
TWI249172B (en
Inventor
Juichi Ooki
Original Assignee
Sumida Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corp filed Critical Sumida Corp
Publication of TW200509159A publication Critical patent/TW200509159A/zh
Application granted granted Critical
Publication of TWI249172B publication Critical patent/TWI249172B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/045Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Housings And Mounting Of Transformers (AREA)
TW093121846A 2003-07-23 2004-07-22 Micro surface mount coil unit TWI249172B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003278246A JP4315425B2 (ja) 2003-07-23 2003-07-23 超小型面実装コイル装置

Publications (2)

Publication Number Publication Date
TW200509159A true TW200509159A (en) 2005-03-01
TWI249172B TWI249172B (en) 2006-02-11

Family

ID=34074704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121846A TWI249172B (en) 2003-07-23 2004-07-22 Micro surface mount coil unit

Country Status (5)

Country Link
US (1) US7071803B2 (zh)
JP (1) JP4315425B2 (zh)
KR (1) KR100674481B1 (zh)
CN (1) CN100517525C (zh)
TW (1) TWI249172B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004037844A1 (de) * 2004-08-04 2006-02-23 Epcos Ag Halterung für eine elektrische Komponente
JP4702601B2 (ja) * 2005-03-29 2011-06-15 Tdk株式会社 コイル部品
JP4781223B2 (ja) * 2005-12-22 2011-09-28 スミダコーポレーション株式会社 インダクタンス素子
JP2007258194A (ja) * 2006-03-20 2007-10-04 Sumida Corporation インダクタ
JP4535083B2 (ja) * 2007-04-10 2010-09-01 Tdk株式会社 コイル部品
JP4924893B2 (ja) * 2007-06-27 2012-04-25 Tdk株式会社 コイル部品の製造方法及びコイル部品の製造装置
KR101147019B1 (ko) * 2007-09-10 2012-05-17 스미다 코포레이션 가부시키가이샤 자성부품
US7515028B1 (en) 2008-06-24 2009-04-07 Tdk Corporation Coil component
US9136050B2 (en) * 2010-07-23 2015-09-15 Cyntec Co., Ltd. Magnetic device and method of manufacturing the same
JP3171315U (ja) * 2011-07-25 2011-10-27 スミダコーポレーション株式会社 磁性素子
JP5786660B2 (ja) * 2011-11-08 2015-09-30 スミダコーポレーション株式会社 磁性部品および磁性部品の製造方法
CN102637512A (zh) * 2012-04-09 2012-08-15 卡尔马斯特电子有限公司 多电感器用端子
JP2013243192A (ja) * 2012-05-18 2013-12-05 Toko Inc 面実装インダクタ
JP6135076B2 (ja) * 2012-09-12 2017-05-31 スミダコーポレーション株式会社 磁性コアおよび磁性部品
KR101593323B1 (ko) * 2013-09-18 2016-02-11 티디케이가부시기가이샤 코일 장치
US20150116069A1 (en) * 2013-10-31 2015-04-30 Samsung Electro-Mechanics Co., Ltd. Coil component and method of manufacturing the same
US10170234B2 (en) * 2015-01-22 2019-01-01 Tdk Corporation Coil device capable of performing a wire connection
JP6332073B2 (ja) * 2015-02-13 2018-05-30 株式会社村田製作所 コイル部品
JP6609797B2 (ja) * 2015-04-16 2019-11-27 パナソニックIpマネジメント株式会社 電子部品およびそれを用いた電子機器
DE102015107605B4 (de) * 2015-05-13 2018-01-25 Sma Solar Technology Ag Induktives Bauelement für Leiterplattenmontage und Wechselrichter mit einem leiterplattenmontierten induktiven Bauelement
US9899131B2 (en) * 2015-07-20 2018-02-20 Cyntec Co., Ltd. Structure of an electronic component and an inductor
JP7352154B2 (ja) * 2019-09-19 2023-09-28 株式会社村田製作所 インダクタ部品およびインダクタ部品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058914U (ja) * 1991-07-16 1993-02-05 テイーデイーケイ株式会社 コイル部品
JPH0536530A (ja) * 1991-08-01 1993-02-12 Koa Corp チツプ状インダクタおよびその製造方法
JP3497276B2 (ja) * 1994-07-20 2004-02-16 松下電器産業株式会社 インダクタンス素子とその製造方法
JP3201958B2 (ja) 1996-06-28 2001-08-27 太陽誘電株式会社 面実装インダクタ
US6292083B1 (en) * 1998-03-27 2001-09-18 Taiyo Yuden Co., Ltd. Surface-mount coil
JP3317893B2 (ja) 1998-03-27 2002-08-26 太陽誘電株式会社 面実装型コイル

Also Published As

Publication number Publication date
US20050017835A1 (en) 2005-01-27
JP4315425B2 (ja) 2009-08-19
TWI249172B (en) 2006-02-11
US7071803B2 (en) 2006-07-04
CN100517525C (zh) 2009-07-22
KR20050012186A (ko) 2005-01-31
KR100674481B1 (ko) 2007-01-25
CN1577650A (zh) 2005-02-09
JP2005045052A (ja) 2005-02-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees