TW200421961A - Multi-layer wiring substrate and the manufacturing method thereof - Google Patents

Multi-layer wiring substrate and the manufacturing method thereof Download PDF

Info

Publication number
TW200421961A
TW200421961A TW93103323A TW93103323A TW200421961A TW 200421961 A TW200421961 A TW 200421961A TW 93103323 A TW93103323 A TW 93103323A TW 93103323 A TW93103323 A TW 93103323A TW 200421961 A TW200421961 A TW 200421961A
Authority
TW
Taiwan
Prior art keywords
metal layer
layer
interlayer
metal
protective metal
Prior art date
Application number
TW93103323A
Other languages
English (en)
Chinese (zh)
Inventor
Eiji Yoshimura
Original Assignee
Daiwa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa Kk filed Critical Daiwa Kk
Publication of TW200421961A publication Critical patent/TW200421961A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW93103323A 2003-02-13 2004-02-12 Multi-layer wiring substrate and the manufacturing method thereof TW200421961A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003035185A JP4294967B2 (ja) 2003-02-13 2003-02-13 多層配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TW200421961A true TW200421961A (en) 2004-10-16

Family

ID=32866290

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93103323A TW200421961A (en) 2003-02-13 2004-02-12 Multi-layer wiring substrate and the manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP4294967B2 (ja)
TW (1) TW200421961A (ja)
WO (1) WO2004073369A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI617225B (zh) * 2010-12-24 2018-03-01 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4509757B2 (ja) 2004-12-03 2010-07-21 ソニーケミカル＆インフォメーションデバイス株式会社 多層配線基板の製造方法
JP5100989B2 (ja) * 2005-08-01 2012-12-19 大日本印刷株式会社 部品内蔵配線板
WO2007037075A1 (ja) * 2005-09-27 2007-04-05 Ain Co., Ltd. 配線板の製造方法および配線板
KR101238251B1 (ko) 2010-11-02 2013-02-27 삼성전기주식회사 회로기판 제조방법
TWI542264B (zh) * 2010-12-24 2016-07-11 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法
KR101231525B1 (ko) * 2010-12-24 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101251749B1 (ko) 2010-12-24 2013-04-05 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP6110084B2 (ja) * 2012-07-06 2017-04-05 株式会社 大昌電子 プリント配線板およびその製造方法
JP6910630B2 (ja) * 2015-09-02 2021-07-28 株式会社ダイワ工業 配線基板積層体の製造方法および配線基板積層体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736468B2 (ja) * 1991-03-06 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション 導電性転写部材
JPH05291744A (ja) * 1992-04-10 1993-11-05 Hitachi Chem Co Ltd 多層配線板の製造法および多層金属層付絶縁基板
JPH09216527A (ja) * 1996-02-13 1997-08-19 Sakae Riken Kogyo Kk 変速機用シフト装置
JP2001230551A (ja) * 2000-02-14 2001-08-24 Ibiden Co Ltd プリント配線板並びに多層プリント配線板及びその製造方法
JP3636290B2 (ja) * 2000-03-27 2005-04-06 株式会社東芝 プリント配線基板、及びその製造方法
JP2002208779A (ja) * 2000-11-10 2002-07-26 Daiwa Kogyo:Kk 柱状金属体の形成方法及び導電構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI617225B (zh) * 2010-12-24 2018-03-01 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法

Also Published As

Publication number Publication date
JP4294967B2 (ja) 2009-07-15
JP2004265930A (ja) 2004-09-24
WO2004073369A1 (ja) 2004-08-26

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