TW200420597A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
TW200420597A
TW200420597A TW092129841A TW92129841A TW200420597A TW 200420597 A TW200420597 A TW 200420597A TW 092129841 A TW092129841 A TW 092129841A TW 92129841 A TW92129841 A TW 92129841A TW 200420597 A TW200420597 A TW 200420597A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
cured article
resin composition
polyester
curing agent
Prior art date
Application number
TW092129841A
Other languages
English (en)
Other versions
TWI325870B (en
Inventor
Satoshi Idemura
Masao Yamada
Koichi Fujimoto
Katsuji Takahashi
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW200420597A publication Critical patent/TW200420597A/zh
Application granted granted Critical
Publication of TWI325870B publication Critical patent/TWI325870B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW092129841A 2002-10-31 2003-10-28 Epoxy resin composition TWI325870B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002317672 2002-10-31

Publications (2)

Publication Number Publication Date
TW200420597A true TW200420597A (en) 2004-10-16
TWI325870B TWI325870B (en) 2010-06-11

Family

ID=32089574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092129841A TWI325870B (en) 2002-10-31 2003-10-28 Epoxy resin composition

Country Status (6)

Country Link
US (1) US7141627B2 (zh)
EP (1) EP1416007B1 (zh)
KR (1) KR101003802B1 (zh)
CN (1) CN100336864C (zh)
DE (1) DE60301313T2 (zh)
TW (1) TWI325870B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600676B (zh) * 2013-06-10 2017-10-01 Ｄｉｃ股份有限公司 含有磷原子的活性酯樹脂及其製造方法、環氧樹脂組成物、其硬化物、預浸體、電路基板及增層膜
TWI636071B (zh) * 2016-09-23 2018-09-21 新亞Ｔ＆Ｃ公司 環氧樹脂用固化劑及其製備方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007013298D1 (de) * 2007-10-02 2011-04-28 Ferrania Technologies Spa Polymerfilm und optische vorrichtung damit
KR101065212B1 (ko) * 2009-05-20 2011-09-19 한국생산기술연구원 열팽창 특성이 개선된 에폭시 수지 복합체
CN102039701A (zh) * 2009-10-19 2011-05-04 台光电子材料股份有限公司 半固化胶片及金属箔基板
ES2642061T3 (es) * 2010-04-16 2017-11-15 Valspar Sourcing, Inc. Composiciones de recubrimiento para artículos de envasado y métodos de recubrimiento
JP5120520B2 (ja) * 2010-07-02 2013-01-16 Ｄｉｃ株式会社 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
WO2012109278A2 (en) 2011-02-07 2012-08-16 Valspar Sourcing, Inc. Coating compositions for containers and other articles and methods of coating
AU2013300118B2 (en) 2012-08-09 2017-07-13 Swimc Llc Container coating system
CN104540907B (zh) 2012-08-09 2018-04-10 Swimc有限公司 用于容器和其它物品的组合物以及使用相同组合物的方法
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
TWI572665B (zh) * 2012-10-17 2017-03-01 Dainippon Ink & Chemicals 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜
WO2015160788A1 (en) 2014-04-14 2015-10-22 Valspar Sourcing, Inc. Methods of preparing compositions for containers and other articles and methods of using same
KR102338614B1 (ko) * 2014-06-30 2021-12-13 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 방향족 폴리에스테르 함유 경화성 수지 조성물, 경화물, 전기·전자 부품 및 회로 기판
KR102268342B1 (ko) * 2014-06-30 2021-06-23 디아이씨 가부시끼가이샤 에폭시 수지, 경화성 수지 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 빌드업 필름, 빌드업 기판, 섬유 강화 복합 재료, 및 섬유 강화 성형품
KR101515485B1 (ko) * 2014-11-20 2015-04-30 주식회사 신아티앤씨 에폭시용 경화제 및 이의 제조방법
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
JP6332720B1 (ja) * 2016-07-06 2018-05-30 Dic株式会社 活性エステル樹脂とその硬化物
TW202138424A (zh) * 2020-02-17 2021-10-16 日商東洋紡股份有限公司 芳香族聚酯及其製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124057A (en) * 1978-03-22 1979-09-26 Furukawa Electric Co Ltd:The Thermosetting polyester resin composition
DE3122641A1 (de) * 1981-06-06 1982-12-23 Herberts Gmbh, 5600 Wuppertal Kathodisch abscheidbares waessriges elektrotauchlack-ueberzugsmittel
JPS63295620A (ja) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
GB9027793D0 (en) * 1990-12-21 1991-02-13 Ucb Sa Polyester-amides containing terminal carboxyl groups
JPH0551517A (ja) 1991-08-23 1993-03-02 Hitachi Chem Co Ltd 熱硬化性樹脂組成物
US5637653A (en) * 1995-05-02 1997-06-10 Dainippon Ink And Chemicals, Incorporated Polymer blend materials composed of an aromatic polyamide and a soluble polyamide
JP4588834B2 (ja) * 2000-04-06 2010-12-01 パナソニック電工株式会社 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
JP2002012650A (ja) 2000-06-30 2002-01-15 Dainippon Ink & Chem Inc 低誘電性材料用エポキシ樹脂組成物
JP2002356544A (ja) 2001-03-30 2002-12-13 Dainippon Ink & Chem Inc 低誘電性電子材料および電子材料用樹脂組成物
JP2003171542A (ja) 2001-09-28 2003-06-20 Dainippon Ink & Chem Inc 液晶ポリエステル樹脂組成物
JP4273720B2 (ja) 2002-08-20 2009-06-03 Ｄｉｃ株式会社 エポキシ樹脂組成物およびその硬化物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600676B (zh) * 2013-06-10 2017-10-01 Ｄｉｃ股份有限公司 含有磷原子的活性酯樹脂及其製造方法、環氧樹脂組成物、其硬化物、預浸體、電路基板及增層膜
TWI636071B (zh) * 2016-09-23 2018-09-21 新亞Ｔ＆Ｃ公司 環氧樹脂用固化劑及其製備方法

Also Published As

Publication number Publication date
DE60301313T2 (de) 2006-06-01
DE60301313D1 (de) 2005-09-22
EP1416007B1 (en) 2005-08-17
CN100336864C (zh) 2007-09-12
EP1416007A1 (en) 2004-05-06
TWI325870B (en) 2010-06-11
CN1521210A (zh) 2004-08-18
KR101003802B1 (ko) 2010-12-24
US7141627B2 (en) 2006-11-28
KR20040038746A (ko) 2004-05-08
US20040110908A1 (en) 2004-06-10

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