DE60301313D1 - Epoxidharzzusammensetzung - Google Patents

Epoxidharzzusammensetzung

Info

Publication number
DE60301313D1
DE60301313D1 DE60301313T DE60301313T DE60301313D1 DE 60301313 D1 DE60301313 D1 DE 60301313D1 DE 60301313 T DE60301313 T DE 60301313T DE 60301313 T DE60301313 T DE 60301313T DE 60301313 D1 DE60301313 D1 DE 60301313D1
Authority
DE
Germany
Prior art keywords
epoxy resin
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60301313T
Other languages
English (en)
Other versions
DE60301313T2 (de
Inventor
Satoshi Idemura
Masao Yamada
Koichi Fujimoto
Katsuji Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Publication of DE60301313D1 publication Critical patent/DE60301313D1/de
Application granted granted Critical
Publication of DE60301313T2 publication Critical patent/DE60301313T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60301313T 2002-10-31 2003-10-29 Epoxidharzzusammensetzung Expired - Lifetime DE60301313T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002317672 2002-10-31
JP2002317672 2002-10-31

Publications (2)

Publication Number Publication Date
DE60301313D1 true DE60301313D1 (de) 2005-09-22
DE60301313T2 DE60301313T2 (de) 2006-06-01

Family

ID=32089574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60301313T Expired - Lifetime DE60301313T2 (de) 2002-10-31 2003-10-29 Epoxidharzzusammensetzung

Country Status (6)

Country Link
US (1) US7141627B2 (de)
EP (1) EP1416007B1 (de)
KR (1) KR101003802B1 (de)
CN (1) CN100336864C (de)
DE (1) DE60301313T2 (de)
TW (1) TWI325870B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009044415A1 (en) * 2007-10-02 2009-04-09 Ferrania Technologies S.P.A. Polymeric film and optical device comprising said film
KR101065212B1 (ko) * 2009-05-20 2011-09-19 한국생산기술연구원 열팽창 특성이 개선된 에폭시 수지 복합체
CN102039701A (zh) * 2009-10-19 2011-05-04 台光电子材料股份有限公司 半固化胶片及金属箔基板
CN106085168B (zh) * 2010-04-16 2018-10-16 Swimc有限公司 用于包装制品的涂料组合物以及涂布方法
US8669333B2 (en) * 2010-07-02 2014-03-11 Dic Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
CN103347963B (zh) 2011-02-07 2017-05-10 威士伯采购公司 容器和其它制品用涂料组合物和涂布方法
KR102093405B1 (ko) 2012-08-09 2020-03-25 에스더블유아이엠씨 엘엘씨 용기 코팅 시스템
CN108528954B (zh) 2012-08-09 2020-05-12 Swimc有限公司 用于容器和其它物品的组合物以及使用相同组合物的方法
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
TWI572665B (zh) * 2012-10-17 2017-03-01 Dainippon Ink & Chemicals 活性酯樹脂、環氧樹脂組成物、其硬化物、預浸體、 電路基板以及積層膜
US9963544B2 (en) * 2013-06-10 2018-05-08 Dic Corporation Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film
CN106536624B (zh) 2014-04-14 2019-11-19 宣伟投资管理有限公司 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法
KR102268342B1 (ko) * 2014-06-30 2021-06-23 디아이씨 가부시끼가이샤 에폭시 수지, 경화성 수지 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 빌드업 필름, 빌드업 기판, 섬유 강화 복합 재료, 및 섬유 강화 성형품
US20150376447A1 (en) * 2014-06-30 2015-12-31 Nippon Steel & Sumikin Chemical Co., Ltd. Curable resin composition containing aromatic polyester, and cured article thereof
KR101515485B1 (ko) * 2014-11-20 2015-04-30 주식회사 신아티앤씨 에폭시용 경화제 및 이의 제조방법
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
US10741464B2 (en) * 2016-07-06 2020-08-11 Dic Corporation Active ester resin and cured product thereof
KR101738968B1 (ko) * 2016-09-23 2017-05-23 주식회사 신아티앤씨 에폭시용 경화제 및 이의 제조방법
TWI813766B (zh) 2018-09-18 2023-09-01 日商Ｄｉｃ股份有限公司 活性酯樹脂製造用原料組成物、活性酯樹脂及其製造方法、以及熱硬化性樹脂組成物及其硬化物
TW202138424A (zh) * 2020-02-17 2021-10-16 日商東洋紡股份有限公司 芳香族聚酯及其製造方法
JP7475794B2 (ja) * 2021-05-12 2024-04-30 信越化学工業株式会社 封止用樹脂組成物及び半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124057A (en) * 1978-03-22 1979-09-26 Furukawa Electric Co Ltd:The Thermosetting polyester resin composition
DE3122641A1 (de) 1981-06-06 1982-12-23 Herberts Gmbh, 5600 Wuppertal Kathodisch abscheidbares waessriges elektrotauchlack-ueberzugsmittel
JPS63295620A (ja) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
GB9027793D0 (en) 1990-12-21 1991-02-13 Ucb Sa Polyester-amides containing terminal carboxyl groups
JPH0551517A (ja) 1991-08-23 1993-03-02 Hitachi Chem Co Ltd 熱硬化性樹脂組成物
US5637653A (en) * 1995-05-02 1997-06-10 Dainippon Ink And Chemicals, Incorporated Polymer blend materials composed of an aromatic polyamide and a soluble polyamide
JP4588834B2 (ja) * 2000-04-06 2010-12-01 パナソニック電工株式会社 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
JP2002012650A (ja) 2000-06-30 2002-01-15 Dainippon Ink & Chem Inc 低誘電性材料用エポキシ樹脂組成物
JP2002356544A (ja) 2001-03-30 2002-12-13 Dainippon Ink & Chem Inc 低誘電性電子材料および電子材料用樹脂組成物
JP2003171542A (ja) 2001-09-28 2003-06-20 Dainippon Ink & Chem Inc 液晶ポリエステル樹脂組成物
JP4273720B2 (ja) 2002-08-20 2009-06-03 Ｄｉｃ株式会社 エポキシ樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
CN1521210A (zh) 2004-08-18
KR101003802B1 (ko) 2010-12-24
KR20040038746A (ko) 2004-05-08
US7141627B2 (en) 2006-11-28
CN100336864C (zh) 2007-09-12
EP1416007A1 (de) 2004-05-06
US20040110908A1 (en) 2004-06-10
TW200420597A (en) 2004-10-16
DE60301313T2 (de) 2006-06-01
EP1416007B1 (de) 2005-08-17
TWI325870B (en) 2010-06-11

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Legal Events

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8364 No opposition during term of opposition