TW200415217A - Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device - Google Patents
Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device Download PDFInfo
- Publication number
- TW200415217A TW200415217A TW092131710A TW92131710A TW200415217A TW 200415217 A TW200415217 A TW 200415217A TW 092131710 A TW092131710 A TW 092131710A TW 92131710 A TW92131710 A TW 92131710A TW 200415217 A TW200415217 A TW 200415217A
- Authority
- TW
- Taiwan
- Prior art keywords
- porous film
- film
- composition
- forming
- zeolite
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B39/00—Compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites; Their preparation; After-treatment, e.g. ion-exchange or dealumination
- C01B39/02—Crystalline aluminosilicate zeolites; Isomorphous compounds thereof; Direct preparation thereof; Preparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactants; After-treatment thereof
- C01B39/04—Crystalline aluminosilicate zeolites; Isomorphous compounds thereof; Direct preparation thereof; Preparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactants; After-treatment thereof using at least one organic template directing agent, e.g. an ionic quaternary ammonium compound or an aminated compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/665—Porous materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002329129A JP4170735B2 (ja) | 2002-11-13 | 2002-11-13 | ゼオライトゾルとその製造方法、多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁膜及び半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200415217A true TW200415217A (en) | 2004-08-16 |
Family
ID=32212017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092131710A TW200415217A (en) | 2002-11-13 | 2003-11-12 | Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7244657B2 (enExample) |
| JP (1) | JP4170735B2 (enExample) |
| CN (1) | CN100567150C (enExample) |
| TW (1) | TW200415217A (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7674390B2 (en) * | 2003-11-17 | 2010-03-09 | Intel Corporation | Zeolite—sol gel nano-composite low k dielectric |
| US7968471B2 (en) * | 2003-11-28 | 2011-06-28 | Nec Corporation | Porous insulating film, method for producing the same, and semiconductor device using the same |
| WO2005109475A2 (en) * | 2004-05-04 | 2005-11-17 | California Institute Of Technology | Zeolite films for low k applications |
| US20050274646A1 (en) * | 2004-06-14 | 2005-12-15 | Conocophillips Company | Catalyst for hydroprocessing of Fischer-Tropsch products |
| US20060081557A1 (en) | 2004-10-18 | 2006-04-20 | Molecular Imprints, Inc. | Low-k dielectric functional imprinting materials |
| US7303989B2 (en) * | 2004-11-22 | 2007-12-04 | Intel Corporation | Using zeolites to improve the mechanical strength of low-k interlayer dielectrics |
| US7468545B2 (en) * | 2005-05-06 | 2008-12-23 | Megica Corporation | Post passivation structure for a semiconductor device and packaging process for same |
| US8039921B2 (en) * | 2005-09-16 | 2011-10-18 | Nec Corporation | Wiring structure, semiconductor device and manufacturing method thereof |
| DE102006031772A1 (de) * | 2006-07-10 | 2008-01-17 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Sensorelements sowie Sensorelement |
| JP2008201833A (ja) | 2007-02-16 | 2008-09-04 | Shin Etsu Chem Co Ltd | 膜形成用組成物、低誘電率絶縁膜、低誘電率絶縁膜の形成方法及び半導体装置 |
| JP2008201832A (ja) * | 2007-02-16 | 2008-09-04 | Shin Etsu Chem Co Ltd | シロキサン重合体とその製造方法、該重合体を含有する多孔質膜形成用塗布液ならびに多孔質膜と、該多孔質膜を用いた半導体装置 |
| JP2008205008A (ja) * | 2007-02-16 | 2008-09-04 | Shin Etsu Chem Co Ltd | 半導体層間絶縁膜形成用組成物とその製造方法、膜形成方法と半導体装置 |
| JP4866290B2 (ja) * | 2007-04-03 | 2012-02-01 | 信越化学工業株式会社 | ゼオライト含有膜の製造方法 |
| CN101868760B (zh) * | 2007-11-21 | 2013-01-16 | 分子制模股份有限公司 | 用于纳米刻印光刻的多孔模板及方法、以及刻印层叠物 |
| JP5096233B2 (ja) | 2008-05-30 | 2012-12-12 | 信越化学工業株式会社 | 有機酸化ケイ素系微粒子及びその製造方法、多孔質膜形成用組成物、多孔質膜及びその形成方法、並びに半導体装置 |
| JP2009286935A (ja) * | 2008-05-30 | 2009-12-10 | Shin-Etsu Chemical Co Ltd | 有機酸化ケイ素微粒子及びその製造方法、多孔質膜形成用組成物、多孔質膜及びその形成方法、並びに半導体装置 |
| JP4883323B2 (ja) * | 2008-08-26 | 2012-02-22 | 信越化学工業株式会社 | 非水電解質二次電池負極材及びSi−O−Al複合体の製造方法、ならびに非水電解質二次電池負極及び非水電解質二次電池 |
| US20100072671A1 (en) * | 2008-09-25 | 2010-03-25 | Molecular Imprints, Inc. | Nano-imprint lithography template fabrication and treatment |
| US8470188B2 (en) * | 2008-10-02 | 2013-06-25 | Molecular Imprints, Inc. | Nano-imprint lithography templates |
| US20100104852A1 (en) * | 2008-10-23 | 2010-04-29 | Molecular Imprints, Inc. | Fabrication of High-Throughput Nano-Imprint Lithography Templates |
| WO2011094317A2 (en) * | 2010-01-26 | 2011-08-04 | Molecular Imprints, Inc. | Micro-conformal templates for nanoimprint lithography |
| TW201144091A (en) * | 2010-01-29 | 2011-12-16 | Molecular Imprints Inc | Ultra-compliant nanoimprint lithography templates |
| US8440772B2 (en) | 2011-04-28 | 2013-05-14 | Chevron Phillips Chemical Company Lp | Methods for terminating olefin polymerizations |
| US10273315B2 (en) | 2012-06-20 | 2019-04-30 | Chevron Phillips Chemical Company Lp | Methods for terminating olefin polymerizations |
| JP6459489B2 (ja) | 2014-03-11 | 2019-01-30 | 三菱マテリアル株式会社 | シリカ多孔質膜形成用液組成物及びその液組成物から形成されたシリカ多孔質膜 |
| US20160177063A1 (en) * | 2014-12-23 | 2016-06-23 | Behr Process Corporation | Seed Scavenging Technologies for Waterborne Paint Formulations |
| JP6979548B2 (ja) * | 2019-03-25 | 2021-12-15 | 日本碍子株式会社 | ゼオライト膜複合体の製造方法およびゼオライト膜複合体 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3677973A (en) * | 1970-03-16 | 1972-07-18 | Universal Oil Prod Co | Transalkylation of alklaromatic hydrocarbons in contact with a zeolite catalyst composition |
| IT1265320B1 (it) | 1993-12-22 | 1996-10-31 | Eniricerche Spa | Procedimento per la preparazione di silico-allumine amorfe cataliticamente attive |
| JPH09194298A (ja) | 1995-04-25 | 1997-07-29 | Rikagaku Kenkyusho | シリカ−界面活性剤ナノ複合体及びその製造方法 |
| US5792706A (en) * | 1996-06-05 | 1998-08-11 | Advanced Micro Devices, Inc. | Interlevel dielectric with air gaps to reduce permitivity |
| US6084096A (en) * | 1998-04-09 | 2000-07-04 | Air Products And Chemicals, Inc. | Triethylenediamine and piperazine synthesis using zeolite catalysts modified with a silicon-containing compound |
| JP2000044875A (ja) | 1998-05-18 | 2000-02-15 | Jsr Corp | 膜形成用組成物、膜の形成方法および低密度膜 |
| DE19829870A1 (de) * | 1998-07-03 | 2000-01-05 | Degussa | Mikro- und/oder mesoporöse zeolithische Materialien als Füllkomponenten in Dentalkompositen |
| ES2268881T3 (es) * | 1998-09-06 | 2007-03-16 | Leibniz-Institut Fur Neue Materialien Gemeinnutzige Gmbh | Metodo para la fabricacion de suspensiones y polvos a base de oxido de zinc y de indio y su utilizacion. |
| US6177381B1 (en) * | 1998-11-03 | 2001-01-23 | Uop Llc | Layered catalyst composition and processes for preparing and using the composition |
| JP3733824B2 (ja) | 1999-08-12 | 2006-01-11 | Jsr株式会社 | シリカ系被膜形成用塗布液の製造方法 |
| JP4524822B2 (ja) | 1999-10-29 | 2010-08-18 | 株式会社豊田中央研究所 | 高結晶性シリカメソ多孔体薄膜の製造方法 |
| US6685889B1 (en) * | 1999-12-14 | 2004-02-03 | Purdue Research Foundation | Photochemical catalysts and methods for their manufacture and use |
| US7098591B1 (en) * | 1999-12-17 | 2006-08-29 | Osram Opto Semiconductors Gmbh | Transparent electrode material for quality enhancement of OLED devices |
| JP2001203197A (ja) | 2000-01-21 | 2001-07-27 | Jsr Corp | 膜、および膜の形成方法 |
| HK1052183A1 (zh) * | 2000-03-10 | 2003-09-05 | Pharmacia Corporation | 制造tetrahydrobenzothiepines的方法 |
| US6440309B1 (en) * | 2000-05-17 | 2002-08-27 | Yoram Cohen | Ceramic-supported polymer (CSP) pervaporation membrane |
| WO2002007191A2 (en) * | 2000-07-13 | 2002-01-24 | The Regents Of The Universty Of California | Silica zeolite low-k dielectric thin films |
| CN1124978C (zh) | 2000-08-23 | 2003-10-22 | 中国石油化工股份有限公司 | 硅分子筛及其合成方法 |
| WO2002061765A1 (en) * | 2001-01-29 | 2002-08-08 | Jsr Corporation | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| CN1173885C (zh) | 2001-09-26 | 2004-11-03 | 复旦大学 | 纳米尺寸的均匀介孔氧化硅球分离剂的合成方法 |
| TWI338528B (enExample) * | 2002-07-19 | 2011-03-01 | Au Optronics Corp |
-
2002
- 2002-11-13 JP JP2002329129A patent/JP4170735B2/ja not_active Expired - Fee Related
-
2003
- 2003-11-07 US US10/703,854 patent/US7244657B2/en not_active Expired - Fee Related
- 2003-11-12 TW TW092131710A patent/TW200415217A/zh unknown
- 2003-11-13 CN CNB200310114941XA patent/CN100567150C/zh not_active Expired - Fee Related
-
2007
- 2007-01-11 US US11/652,297 patent/US7405459B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004161535A (ja) | 2004-06-10 |
| US20040091419A1 (en) | 2004-05-13 |
| US20070108593A1 (en) | 2007-05-17 |
| JP4170735B2 (ja) | 2008-10-22 |
| US7244657B2 (en) | 2007-07-17 |
| CN1519197A (zh) | 2004-08-11 |
| CN100567150C (zh) | 2009-12-09 |
| US7405459B2 (en) | 2008-07-29 |
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