TR201907253T4 - Kaynak yapılmış bölümü kontrol aparatı ve bunun kontrol yöntemi. - Google Patents

Kaynak yapılmış bölümü kontrol aparatı ve bunun kontrol yöntemi. Download PDF

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Publication number
TR201907253T4
TR201907253T4 TR2019/07253T TR201907253T TR201907253T4 TR 201907253 T4 TR201907253 T4 TR 201907253T4 TR 2019/07253 T TR2019/07253 T TR 2019/07253T TR 201907253 T TR201907253 T TR 201907253T TR 201907253 T4 TR201907253 T4 TR 201907253T4
Authority
TR
Turkey
Prior art keywords
workpieces
welding
laser beam
light
melt pool
Prior art date
Application number
TR2019/07253T
Other languages
English (en)
Turkish (tr)
Inventor
Kobayashi Hiroomi
Furukawa Masashi
uchida Keisuke
Shibata Yoshinori
Kawakita Atsushi
Kishi Hiroaki
Akamatsu Eiji
Iwamoto Yuta
Original Assignee
Toyota Jidosha Kk Also Trading As Toyota Motor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kk Also Trading As Toyota Motor Corporation filed Critical Toyota Jidosha Kk Also Trading As Toyota Motor Corporation
Publication of TR201907253T4 publication Critical patent/TR201907253T4/tr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • G01N33/205—Metals in liquid state, e.g. molten metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Quality & Reliability (AREA)
TR2019/07253T 2013-03-29 2014-03-28 Kaynak yapılmış bölümü kontrol aparatı ve bunun kontrol yöntemi. TR201907253T4 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013073202A JP5947740B2 (ja) 2013-03-29 2013-03-29 溶接部の検査装置とその検査方法

Publications (1)

Publication Number Publication Date
TR201907253T4 true TR201907253T4 (tr) 2019-06-21

Family

ID=50489352

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2019/07253T TR201907253T4 (tr) 2013-03-29 2014-03-28 Kaynak yapılmış bölümü kontrol aparatı ve bunun kontrol yöntemi.

Country Status (13)

Country Link
US (1) US9506862B2 (enExample)
EP (1) EP2978560B1 (enExample)
JP (1) JP5947740B2 (enExample)
KR (1) KR101731750B1 (enExample)
CN (1) CN105102173B (enExample)
BR (1) BR112015024617A2 (enExample)
CA (1) CA2908424C (enExample)
ES (1) ES2727634T3 (enExample)
MX (1) MX347097B (enExample)
RU (1) RU2635588C2 (enExample)
TR (1) TR201907253T4 (enExample)
WO (1) WO2014155191A2 (enExample)
ZA (1) ZA201507198B (enExample)

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KR102235761B1 (ko) * 2019-12-31 2021-04-02 한국과학기술원 3d 프린팅 공정의 펨토초 레이저 기반 초음파 계측 장치 및 이를 구비한 3d 프린팅 시스템
CN111380872B (zh) * 2020-03-18 2022-12-09 深圳科瑞技术股份有限公司 终端中框的等距轨迹规划方法、系统及控制器
WO2022004610A1 (ja) * 2020-06-29 2022-01-06 パナソニックＩｐマネジメント株式会社 レーザ溶接装置およびレーザ溶接方法
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WO2022181061A1 (ja) * 2021-02-25 2022-09-01 パナソニックＩｐマネジメント株式会社 推定モデル生成装置および加工状態推定装置
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Also Published As

Publication number Publication date
JP5947740B2 (ja) 2016-07-06
RU2015140714A (ru) 2017-05-05
CN105102173B (zh) 2016-11-30
ZA201507198B (en) 2016-12-21
KR101731750B1 (ko) 2017-04-28
CA2908424C (en) 2017-06-20
CA2908424A1 (en) 2014-10-02
US20160061727A1 (en) 2016-03-03
EP2978560B1 (en) 2019-04-24
ES2727634T3 (es) 2019-10-17
WO2014155191A2 (en) 2014-10-02
WO2014155191A8 (en) 2015-07-23
CN105102173A (zh) 2015-11-25
KR20150119961A (ko) 2015-10-26
JP2014195822A (ja) 2014-10-16
MX2015013690A (es) 2016-02-26
MX347097B (es) 2017-04-12
EP2978560A2 (en) 2016-02-03
WO2014155191A3 (en) 2014-12-04
RU2635588C2 (ru) 2017-11-14
US9506862B2 (en) 2016-11-29
BR112015024617A2 (pt) 2017-07-18

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