SG91792G - Glass-ceramics suitable for dielectric substrates - Google Patents

Glass-ceramics suitable for dielectric substrates

Info

Publication number
SG91792G
SG91792G SG917/92A SG91792A SG91792G SG 91792 G SG91792 G SG 91792G SG 917/92 A SG917/92 A SG 917/92A SG 91792 A SG91792 A SG 91792A SG 91792 G SG91792 G SG 91792G
Authority
SG
Singapore
Prior art keywords
glass
dielectric substrates
ceramics suitable
ceramics
dielectric
Prior art date
Application number
SG917/92A
Other languages
English (en)
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of SG91792G publication Critical patent/SG91792G/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/14—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)
SG917/92A 1986-10-27 1992-09-11 Glass-ceramics suitable for dielectric substrates SG91792G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/923,432 US4714687A (en) 1986-10-27 1986-10-27 Glass-ceramics suitable for dielectric substrates

Publications (1)

Publication Number Publication Date
SG91792G true SG91792G (en) 1992-12-04

Family

ID=25448682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG917/92A SG91792G (en) 1986-10-27 1992-09-11 Glass-ceramics suitable for dielectric substrates

Country Status (7)

Country Link
US (1) US4714687A (ko)
EP (1) EP0266029B1 (ko)
JP (1) JPS63117929A (ko)
KR (1) KR950008582B1 (ko)
DE (1) DE3778293D1 (ko)
HK (1) HK93692A (ko)
SG (1) SG91792G (ko)

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US4853349A (en) * 1988-05-26 1989-08-01 Corning Glass Works Glass-ceramics suitable for dielectric substrates
US5258335A (en) * 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5164342A (en) * 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US4927711A (en) * 1988-12-23 1990-05-22 Corning Incorporated Hybrid circuits and thick film dielectrics used therein
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US5108958A (en) * 1990-03-23 1992-04-28 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
US5213878A (en) * 1990-03-23 1993-05-25 Minnesota Mining And Manufacturing Company Ceramic composite for electronic applications
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US5277937A (en) * 1992-06-03 1994-01-11 Corning Incorporated Method for controlling the conductance of a heated cellular substrate
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JP4849702B2 (ja) 1999-07-06 2012-01-11 コニカミノルタオプト株式会社 結晶化ガラス
JP4158282B2 (ja) 1999-07-06 2008-10-01 コニカミノルタオプト株式会社 磁気ディスク用結晶化ガラス基板
JP4831854B2 (ja) 1999-07-06 2011-12-07 コニカミノルタオプト株式会社 結晶化ガラス組成物
JP4337176B2 (ja) 1999-07-06 2009-09-30 コニカミノルタオプト株式会社 ガラス組成
JP2001026458A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP2001026445A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP2001026440A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP4265036B2 (ja) 1999-07-14 2009-05-20 コニカミノルタオプト株式会社 結晶化ガラス組成物
JP4207316B2 (ja) 1999-07-14 2009-01-14 コニカミノルタオプト株式会社 結晶化ガラス組成物
JP2001026451A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP4265035B2 (ja) 1999-07-14 2009-05-20 コニカミノルタオプト株式会社 結晶化ガラス組成物
JP2001026454A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP2001026446A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP4284763B2 (ja) 1999-07-14 2009-06-24 コニカミノルタオプト株式会社 ガラス組成
JP2001026452A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
JP2001026456A (ja) 1999-07-14 2001-01-30 Minolta Co Ltd ガラス組成
US6303527B1 (en) 1999-10-18 2001-10-16 Corning Incorporated Transparent glass-ceramics based on alpha- and beta-willemite
EP1254080A1 (en) * 1999-10-18 2002-11-06 Corning Incorporated Transparent glass-ceramics based on alpha- and beta-willemite
AU8022700A (en) 1999-10-18 2001-04-30 Corning Incorporated Transparent lithium zinc magnesium orthosilicate glass-ceramics
US6818574B2 (en) 1999-12-16 2004-11-16 Tokuyama Corporation Jointed body of glass-ceramic and aluminum nitride sintered compact and method for producing the same
JP4273624B2 (ja) 2000-04-03 2009-06-03 コニカミノルタオプト株式会社 ガラス組成物
JP2001287934A (ja) 2000-04-03 2001-10-16 Minolta Co Ltd ガラス組成
JP2001287967A (ja) 2000-04-03 2001-10-16 Minolta Co Ltd ガラス組成
JP2001287931A (ja) 2000-04-03 2001-10-16 Minolta Co Ltd ガラス組成
JP4273625B2 (ja) 2000-04-03 2009-06-03 コニカミノルタオプト株式会社 ガラス組成物
JP4207358B2 (ja) 2000-04-03 2009-01-14 コニカミノルタオプト株式会社 ガラス組成
JP4273623B2 (ja) 2000-04-03 2009-06-03 コニカミノルタオプト株式会社 ガラス組成物
JP4224925B2 (ja) 2000-04-03 2009-02-18 コニカミノルタオプト株式会社 ガラス組成物
JP4300676B2 (ja) 2000-04-03 2009-07-22 コニカミノルタオプト株式会社 ガラス組成物
US6649550B2 (en) * 2000-11-17 2003-11-18 Nippon Electric Glass Co., Ltd. Glass ceramics dielectric material and sintered glass ceramics
JP3793560B2 (ja) * 2000-11-30 2006-07-05 京セラ株式会社 低温焼成磁器およびその製造方法
US6737374B2 (en) 2002-05-07 2004-05-18 Uop Llc Use of zeolites in preparing low temperature ceramics
US6881691B2 (en) 2002-05-07 2005-04-19 Uop Llc Use of zeolites in preparing low temperature ceramics
US6953756B2 (en) * 2002-10-25 2005-10-11 Kyocera Corporation Glass ceramic sintered body and wiring board using the sintered body
CN100383070C (zh) * 2006-02-24 2008-04-23 浙江大学 一种应用于内部激光着色并形成三维黑色图案的玻璃
JP5773128B2 (ja) * 2010-05-10 2015-09-02 日本電気硝子株式会社 耐火性フィラーの製造方法
KR101464996B1 (ko) * 2010-05-10 2014-11-25 니폰 덴키 가라스 가부시키가이샤 내화성 필러 및 이것을 사용한 밀봉 재료, 및 내화성 필러의 제조 방법
JP5139596B2 (ja) * 2011-05-23 2013-02-06 新電元工業株式会社 半導体接合保護用ガラス組成物、半導体装置の製造方法及び半導体装置
CN102781861B (zh) * 2011-05-26 2016-07-06 新电元工业株式会社 半导体接合保护用玻璃合成物、半导体装置及其制造方法
JP5184717B1 (ja) * 2012-01-31 2013-04-17 新電元工業株式会社 半導体接合保護用ガラス組成物、半導体装置の製造方法及び半導体装置
DE112012003178B4 (de) 2012-05-08 2022-12-08 Shindengen Electric Manufacturing Co., Ltd. Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung
JP7218531B2 (ja) * 2018-10-04 2023-02-07 日本電気硝子株式会社 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料
CN114634353B (zh) * 2020-12-16 2023-04-18 山东国瓷功能材料股份有限公司 一种低介低损耗近零温漂低温共烧陶瓷材料及其制备方法
WO2024004711A1 (ja) * 2022-06-29 2024-01-04 日本電気硝子株式会社 半導体素子被覆用ガラス、半導体素子被覆用材料、及び半導体素子被覆用焼結体

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Also Published As

Publication number Publication date
HK93692A (en) 1992-12-04
EP0266029A1 (en) 1988-05-04
EP0266029B1 (en) 1992-04-15
KR880005056A (ko) 1988-06-27
DE3778293D1 (de) 1992-05-21
JPS63117929A (ja) 1988-05-21
US4714687A (en) 1987-12-22
KR950008582B1 (ko) 1995-08-03

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