SG91268A1 - Method and apparatus for grinding a workpiece - Google Patents

Method and apparatus for grinding a workpiece

Info

Publication number
SG91268A1
SG91268A1 SG200001880A SG200001880A SG91268A1 SG 91268 A1 SG91268 A1 SG 91268A1 SG 200001880 A SG200001880 A SG 200001880A SG 200001880 A SG200001880 A SG 200001880A SG 91268 A1 SG91268 A1 SG 91268A1
Authority
SG
Singapore
Prior art keywords
workpiece
grinding
Prior art date
Application number
SG200001880A
Other languages
English (en)
Inventor
Nukui Mitsuru
Murai Shirou
Takata Michihiro
Okuyama Tetsuo
Kaga Muneaki
Wada Toyotaka
Original Assignee
Nippei Toyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11091947A external-priority patent/JP2000288885A/ja
Priority claimed from JP22001999A external-priority patent/JP2001038588A/ja
Application filed by Nippei Toyama Corp filed Critical Nippei Toyama Corp
Publication of SG91268A1 publication Critical patent/SG91268A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200001880A 1999-03-31 2000-03-31 Method and apparatus for grinding a workpiece SG91268A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11091947A JP2000288885A (ja) 1999-03-31 1999-03-31 円形薄板のエッジ研削装置
JP22001999A JP2001038588A (ja) 1999-08-03 1999-08-03 ワークの研削方法及び研削装置

Publications (1)

Publication Number Publication Date
SG91268A1 true SG91268A1 (en) 2002-09-17

Family

ID=26433379

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200001880A SG91268A1 (en) 1999-03-31 2000-03-31 Method and apparatus for grinding a workpiece

Country Status (7)

Country Link
US (1) US6332834B1 (de)
EP (1) EP1043120A1 (de)
KR (1) KR20000076987A (de)
CN (1) CN1268420A (de)
MY (1) MY141458A (de)
SG (1) SG91268A1 (de)
TW (1) TW434116B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19857364A1 (de) * 1998-12-11 2000-06-29 Junker Erwin Maschf Gmbh Verfahren und Schleifmaschine zur Prozeßführung beim Schälschleifen eines Werkstückes
JP2001259978A (ja) * 2000-03-07 2001-09-25 Three M Innovative Properties Co ガラス板の端部を面取りする方法
JP2002329687A (ja) * 2001-05-02 2002-11-15 Speedfam Co Ltd デバイスウエハの外周研磨装置及び研磨方法
JP4481667B2 (ja) * 2004-02-02 2010-06-16 株式会社ディスコ 切削方法
JP4730944B2 (ja) * 2004-06-04 2011-07-20 コマツＮｔｃ株式会社 多頭研削盤及び多頭研削盤を用いた研削方法
JP5401757B2 (ja) * 2006-11-30 2014-01-29 株式会社ジェイテクト 加工装置
EP1952945B1 (de) * 2007-01-30 2010-09-15 Ebara Corporation Poliervorrichtung
CN104108058A (zh) * 2013-04-17 2014-10-22 上海京美电脑机械有限公司 修边研磨装置
CN103302564B (zh) * 2013-05-29 2015-12-02 广东一鼎科技有限公司 一种提高磨边机效率的方法
CN103537960B (zh) * 2013-10-28 2016-01-27 瑞安市源码科技有限公司 一种用于加工回转面的磨光机
CN105196056A (zh) * 2014-06-17 2015-12-30 上海运城制版有限公司 数控车削、粗磨、精磨同步加工机床
CN106239271B (zh) * 2016-08-31 2017-12-12 江苏同庆车辆配件有限公司 一种用于铁路货车零件的研磨方法
CN107097298B (zh) * 2017-05-02 2022-08-19 浙江童园玩具有限公司 圆块加工工艺及其加工设备
JP7028607B2 (ja) * 2017-11-06 2022-03-02 株式会社ディスコ 切削装置
CN108081032B (zh) * 2017-11-28 2020-05-08 上海交通大学 多自由度的工件表面柔性加工装置及方法
KR102041475B1 (ko) * 2018-04-03 2019-11-07 주식회사 한국엔에스디 씨엔씨 연삭기 및 이를 이용한 연삭휠 영점세팅방법
CN110561224A (zh) * 2019-09-25 2019-12-13 安徽新境界自动化技术有限公司 一种循环送料式自动化打磨设备
CN111958386A (zh) * 2020-08-19 2020-11-20 安徽荣程玻璃制品有限公司 一种夹胶钢化玻璃及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793101A (en) * 1986-10-22 1988-12-27 Bbc Brown Boveri Ag Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer
DE4325518A1 (de) * 1993-07-29 1995-02-02 Wacker Chemitronic Verfahren zur Glättung der Kante von Halbleiterscheiben
EP0759339A1 (de) * 1995-03-07 1997-02-26 Kao Corporation Fasenbearbeitungsvorrichtung für ein substrat
EP0868968A2 (de) * 1997-03-31 1998-10-07 Nippei Toyama Corporation Schleifmaschine und Verfahren

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60228063A (ja) * 1984-04-20 1985-11-13 Matsushita Electric Ind Co Ltd 曲面創成研磨装置
JPS6322259A (ja) 1986-07-10 1988-01-29 Hitachi Cable Ltd 半導体ウエハ加工方法および加工装置
JPH07104612B2 (ja) 1986-10-31 1995-11-13 キヤノン株式会社 非磁性黒色重合トナー及びその製造方法
JPH04129656A (ja) 1990-09-19 1992-04-30 Kawasaki Steel Corp 半導体ウエハの面取加工装置
JP3256808B2 (ja) 1991-04-30 2002-02-18 東芝セラミックス株式会社 半導体ウエーハの周縁ポリシング装置
US5490811A (en) * 1991-06-12 1996-02-13 Shin-Etsu Handotai Co., Ltd. Apparatus for chamfering notch of wafer
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
JP3436391B2 (ja) 1993-07-27 2003-08-11 スピードファム株式会社 エッジポリッシャ
GB9315843D0 (en) * 1993-07-30 1993-09-15 Litton Uk Ltd Improved machine tool
JPH0760642A (ja) * 1993-08-30 1995-03-07 Rikagaku Kenkyusho 電解ドレッシング研削方法及び装置
JPH0783266A (ja) * 1993-09-14 1995-03-28 Nippon Seiko Kk スライド機構用電気粘性流体ダンパ
JPH07205001A (ja) * 1993-11-16 1995-08-08 Tokyo Seimitsu Co Ltd ウェーハ面取り機
JPH09168953A (ja) 1995-12-16 1997-06-30 M Tec Kk 半導体ウェーハのエッジ研摩方法及び装置
JP3510036B2 (ja) 1996-02-22 2004-03-22 株式会社ルネサステクノロジ 半導体装置の製造方法
JPH1044008A (ja) * 1996-05-27 1998-02-17 Nippon Seiko Kk 球体の研磨方法及び装置並びに環状溝成形方法
US5816897A (en) * 1996-09-16 1998-10-06 Corning Incorporated Method and apparatus for edge finishing glass
JPH1133918A (ja) 1997-07-16 1999-02-09 Nikon Corp 磁気記録媒体用基板の内外径加工用砥石及び内外径加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793101A (en) * 1986-10-22 1988-12-27 Bbc Brown Boveri Ag Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer
DE4325518A1 (de) * 1993-07-29 1995-02-02 Wacker Chemitronic Verfahren zur Glättung der Kante von Halbleiterscheiben
EP0759339A1 (de) * 1995-03-07 1997-02-26 Kao Corporation Fasenbearbeitungsvorrichtung für ein substrat
EP0868968A2 (de) * 1997-03-31 1998-10-07 Nippei Toyama Corporation Schleifmaschine und Verfahren

Also Published As

Publication number Publication date
KR20000076987A (ko) 2000-12-26
TW434116B (en) 2001-05-16
CN1268420A (zh) 2000-10-04
US6332834B1 (en) 2001-12-25
EP1043120A1 (de) 2000-10-11
MY141458A (en) 2010-04-30

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