SG74595A1 - Dram architecture with aligned data storage and bond pads - Google Patents

Dram architecture with aligned data storage and bond pads

Info

Publication number
SG74595A1
SG74595A1 SG1997002443A SG1997002443A SG74595A1 SG 74595 A1 SG74595 A1 SG 74595A1 SG 1997002443 A SG1997002443 A SG 1997002443A SG 1997002443 A SG1997002443 A SG 1997002443A SG 74595 A1 SG74595 A1 SG 74595A1
Authority
SG
Singapore
Prior art keywords
data storage
bond pads
aligned data
dram architecture
dram
Prior art date
Application number
SG1997002443A
Other languages
English (en)
Inventor
Masayuki Nakamura
Brent S Haukness
Takesada Akiba
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of SG74595A1 publication Critical patent/SG74595A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1072Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories
SG1997002443A 1996-07-11 1997-07-11 Dram architecture with aligned data storage and bond pads SG74595A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2156596P 1996-07-11 1996-07-11

Publications (1)

Publication Number Publication Date
SG74595A1 true SG74595A1 (en) 2000-08-22

Family

ID=21804930

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997002443A SG74595A1 (en) 1996-07-11 1997-07-11 Dram architecture with aligned data storage and bond pads

Country Status (6)

Country Link
US (1) US5995404A (de)
EP (1) EP0818787A3 (de)
JP (1) JPH10134564A (de)
KR (1) KR100499844B1 (de)
SG (1) SG74595A1 (de)
TW (1) TW357358B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966343A (en) * 1997-01-02 1999-10-12 Texas Instruments Incorporated Variable latency memory circuit
GB2348317B (en) * 1998-06-23 2001-03-07 Samsung Electronics Co Ltd An arrangement of data input/output circuits for use in a semiconductor memory device
JP2000182370A (ja) * 1998-12-16 2000-06-30 Toshiba Corp 半導体記憶装置
KR100327330B1 (ko) * 1998-12-17 2002-05-09 윤종용 램버스디램반도체장치
JP3557114B2 (ja) * 1998-12-22 2004-08-25 株式会社東芝 半導体記憶装置
US6457094B2 (en) 1999-01-22 2002-09-24 Winbond Electronics Corporation Memory array architecture supporting block write operation
US6157560A (en) * 1999-01-25 2000-12-05 Winbond Electronics Corporation Memory array datapath architecture
KR100408716B1 (ko) * 2001-06-29 2003-12-11 주식회사 하이닉스반도체 오토프리챠지 갭리스 보호회로를 가진 반도체 메모리소자의 오토프리챠지장치
JP3990125B2 (ja) 2001-08-29 2007-10-10 株式会社東芝 半導体メモリチップおよび半導体メモリ
DE10223726A1 (de) 2002-05-28 2003-12-24 Infineon Technologies Ag Integrierter Speicher in Prefetch-Architektur und Verfahren zum Betrieb eines integrierten Speichers
JP4267006B2 (ja) * 2006-07-24 2009-05-27 エルピーダメモリ株式会社 半導体記憶装置
JP2009009633A (ja) * 2007-06-27 2009-01-15 Elpida Memory Inc 半導体記憶装置
JP5419431B2 (ja) 2008-11-28 2014-02-19 ルネサスエレクトロニクス株式会社 半導体記憶装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3832328A1 (de) * 1988-09-23 1990-03-29 Broadcast Television Syst Speicheranordnung fuer digitale signale
US5315130A (en) * 1990-03-30 1994-05-24 Tactical Fabs, Inc. Very high density wafer scale device architecture
EP0544247A3 (en) * 1991-11-27 1993-10-20 Texas Instruments Inc Memory architecture
US5550394A (en) * 1993-06-18 1996-08-27 Texas Instruments Incorporated Semiconductor memory device and defective memory cell correction circuit
US5373470A (en) * 1993-03-26 1994-12-13 United Memories, Inc. Method and circuit for configuring I/O devices
JPH0785655A (ja) * 1993-09-16 1995-03-31 Mitsubishi Electric Corp 半導体記憶装置
JPH09509002A (ja) * 1993-12-07 1997-09-09 テキサス インスツルメンツ インコーポレイテッド フィールドメモリおよび関連技術の改善
KR0154601B1 (ko) * 1994-05-20 1998-12-01 기다오까 다까시 반도체 메모리 장치에서 전원공급 패드의 배열
JP3421441B2 (ja) * 1994-09-22 2003-06-30 東芝マイクロエレクトロニクス株式会社 ダイナミック型メモリ
JP3160480B2 (ja) * 1994-11-10 2001-04-25 株式会社東芝 半導体記憶装置
JP3486723B2 (ja) * 1995-08-29 2004-01-13 日本テキサス・インスツルメンツ株式会社 半導体メモリ装置
TW325566B (en) * 1996-01-31 1998-01-21 Toshiba Co Ltd Semiconductor integrated circuit (IC) device
US5802005A (en) * 1996-09-23 1998-09-01 Texas Instruments Incorporated Four bit pre-fetch sDRAM column select architecture

Also Published As

Publication number Publication date
KR100499844B1 (ko) 2006-04-21
KR980012545A (ko) 1998-04-30
EP0818787A2 (de) 1998-01-14
JPH10134564A (ja) 1998-05-22
US5995404A (en) 1999-11-30
EP0818787A3 (de) 1999-08-25
TW357358B (en) 1999-05-01

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