SG74011A1 - Coils for generating a plasma and for sputtering - Google Patents
Coils for generating a plasma and for sputteringInfo
- Publication number
- SG74011A1 SG74011A1 SG1997001437A SG1997001437A SG74011A1 SG 74011 A1 SG74011 A1 SG 74011A1 SG 1997001437 A SG1997001437 A SG 1997001437A SG 1997001437 A SG1997001437 A SG 1997001437A SG 74011 A1 SG74011 A1 SG 74011A1
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering
- coils
- plasma
- generating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64718496A | 1996-05-09 | 1996-05-09 | |
US64409696A | 1996-05-10 | 1996-05-10 | |
US68033596A | 1996-07-10 | 1996-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG74011A1 true SG74011A1 (en) | 2000-07-18 |
Family
ID=27417720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997001437A SG74011A1 (en) | 1996-05-09 | 1997-05-09 | Coils for generating a plasma and for sputtering |
Country Status (5)
Country | Link |
---|---|
US (3) | US6368469B1 (ja) |
EP (1) | EP0807954A1 (ja) |
JP (4) | JP4553992B2 (ja) |
KR (1) | KR100547404B1 (ja) |
SG (1) | SG74011A1 (ja) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6368469B1 (en) * | 1996-05-09 | 2002-04-09 | Applied Materials, Inc. | Coils for generating a plasma and for sputtering |
KR100489918B1 (ko) * | 1996-05-09 | 2005-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마발생및스퍼터링용코일 |
TW358964B (en) | 1996-11-21 | 1999-05-21 | Applied Materials Inc | Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma |
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US6077402A (en) * | 1997-05-16 | 2000-06-20 | Applied Materials, Inc. | Central coil design for ionized metal plasma deposition |
US6375810B2 (en) * | 1997-08-07 | 2002-04-23 | Applied Materials, Inc. | Plasma vapor deposition with coil sputtering |
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US6168690B1 (en) | 1997-09-29 | 2001-01-02 | Lam Research Corporation | Methods and apparatus for physical vapor deposition |
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US6231725B1 (en) * | 1998-08-04 | 2001-05-15 | Applied Materials, Inc. | Apparatus for sputtering material onto a workpiece with the aid of a plasma |
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US8696875B2 (en) | 1999-10-08 | 2014-04-15 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
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US10047430B2 (en) | 1999-10-08 | 2018-08-14 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
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US9659758B2 (en) * | 2005-03-22 | 2017-05-23 | Honeywell International Inc. | Coils utilized in vapor deposition applications and methods of production |
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US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US20080078326A1 (en) * | 2006-09-29 | 2008-04-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Pre-cleaning tool and semiconductor processing apparatus using the same |
US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
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JP5681206B2 (ja) * | 2009-12-18 | 2015-03-04 | オーチス エレベータ カンパニーOtis Elevator Company | 静電容量センサによる乗客コンベヤに関連する人の検知 |
RU2554085C2 (ru) * | 2013-09-20 | 2015-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Способ нагрева электродов и создания самостоятельного дугового разряда с поджигом от тонкой металлической проволочки в свободном пространстве в магнитном поле |
RU2577040C2 (ru) * | 2014-07-29 | 2016-03-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) | Магнитный гаситель самостоятельного дугового разряда |
CN105491780B (zh) * | 2014-10-01 | 2018-03-30 | 日新电机株式会社 | 等离子体产生用的天线及具备该天线的等离子体处理装置 |
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TW327236B (en) * | 1996-03-12 | 1998-02-21 | Varian Associates | Inductively coupled plasma reactor with faraday-sputter shield |
US6368469B1 (en) | 1996-05-09 | 2002-04-09 | Applied Materials, Inc. | Coils for generating a plasma and for sputtering |
US6254746B1 (en) * | 1996-05-09 | 2001-07-03 | Applied Materials, Inc. | Recessed coil for generating a plasma |
US5961793A (en) | 1996-10-31 | 1999-10-05 | Applied Materials, Inc. | Method of reducing generation of particulate matter in a sputtering chamber |
US6210539B1 (en) | 1997-05-14 | 2001-04-03 | Applied Materials, Inc. | Method and apparatus for producing a uniform density plasma above a substrate |
US6361661B2 (en) * | 1997-05-16 | 2002-03-26 | Applies Materials, Inc. | Hybrid coil design for ionized deposition |
US6042700A (en) * | 1997-09-15 | 2000-03-28 | Applied Materials, Inc. | Adjustment of deposition uniformity in an inductively coupled plasma source |
US6660134B1 (en) * | 1998-07-10 | 2003-12-09 | Applied Materials, Inc. | Feedthrough overlap coil |
US6238528B1 (en) | 1998-10-13 | 2001-05-29 | Applied Materials, Inc. | Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source |
-
1997
- 1997-05-06 US US08/851,946 patent/US6368469B1/en not_active Expired - Lifetime
- 1997-05-08 EP EP97303124A patent/EP0807954A1/en not_active Ceased
- 1997-05-09 JP JP15566597A patent/JP4553992B2/ja not_active Expired - Lifetime
- 1997-05-09 SG SG1997001437A patent/SG74011A1/en unknown
-
2002
- 2002-01-17 US US10/052,951 patent/US6783639B2/en not_active Expired - Lifetime
-
2004
- 2004-07-20 US US10/896,155 patent/US20040256217A1/en not_active Abandoned
- 2004-11-30 KR KR1020040099101A patent/KR100547404B1/ko not_active IP Right Cessation
-
2008
- 2008-06-11 JP JP2008153424A patent/JP5346178B2/ja not_active Expired - Lifetime
-
2013
- 2013-02-12 JP JP2013024199A patent/JP5751520B2/ja not_active Expired - Lifetime
- 2013-08-08 JP JP2013165082A patent/JP5751522B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6783639B2 (en) | 2004-08-31 |
JP2013117072A (ja) | 2013-06-13 |
JP5751520B2 (ja) | 2015-07-22 |
JPH1060638A (ja) | 1998-03-03 |
JP4553992B2 (ja) | 2010-09-29 |
US20040256217A1 (en) | 2004-12-23 |
US20020144901A1 (en) | 2002-10-10 |
JP5346178B2 (ja) | 2013-11-20 |
JP2013256719A (ja) | 2013-12-26 |
US6368469B1 (en) | 2002-04-09 |
JP5751522B2 (ja) | 2015-07-22 |
JP2009001902A (ja) | 2009-01-08 |
EP0807954A1 (en) | 1997-11-19 |
KR100547404B1 (ko) | 2006-01-31 |
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