SG72810A1 - Control apparatus and control method - Google Patents

Control apparatus and control method

Info

Publication number
SG72810A1
SG72810A1 SG1998001002A SG1998001002A SG72810A1 SG 72810 A1 SG72810 A1 SG 72810A1 SG 1998001002 A SG1998001002 A SG 1998001002A SG 1998001002 A SG1998001002 A SG 1998001002A SG 72810 A1 SG72810 A1 SG 72810A1
Authority
SG
Singapore
Prior art keywords
control
control method
control apparatus
Prior art date
Application number
SG1998001002A
Other languages
English (en)
Inventor
Kazuyuki Asano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG72810A1 publication Critical patent/SG72810A1/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
SG1998001002A 1997-05-06 1998-05-04 Control apparatus and control method SG72810A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11594297A JP3393035B2 (ja) 1997-05-06 1997-05-06 制御装置及び半導体製造装置

Publications (1)

Publication Number Publication Date
SG72810A1 true SG72810A1 (en) 2000-05-23

Family

ID=14674996

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001002A SG72810A1 (en) 1997-05-06 1998-05-04 Control apparatus and control method

Country Status (7)

Country Link
US (1) US6258169B1 (zh)
EP (1) EP0877308A3 (zh)
JP (1) JP3393035B2 (zh)
KR (1) KR100628618B1 (zh)
CN (1) CN100361032C (zh)
SG (1) SG72810A1 (zh)
TW (1) TW384438B (zh)

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JP4323588B2 (ja) * 1998-07-21 2009-09-02 キヤノン株式会社 編集方法、デバイス製造方法およびコンピュータ
US6556949B1 (en) 1999-05-18 2003-04-29 Applied Materials, Inc. Semiconductor processing techniques
US6303395B1 (en) 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US6456894B1 (en) 1999-06-01 2002-09-24 Applied Materials, Inc. Semiconductor processing techniques
US6408220B1 (en) 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
JP4545252B2 (ja) * 1999-09-01 2010-09-15 東京エレクトロン株式会社 半導体製造装置
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6952656B1 (en) 2000-04-28 2005-10-04 Applied Materials, Inc. Wafer fabrication data acquisition and management systems
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6641746B2 (en) * 2001-09-28 2003-11-04 Agere Systems, Inc. Control of semiconductor processing
TWI224381B (en) * 2001-12-31 2004-11-21 Tokyo Electron Ltd Method of detecting, identifying and correcting process performance
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
JP3856125B2 (ja) * 2002-05-10 2006-12-13 東京エレクトロン株式会社 処理方法及び処理装置
US6797067B1 (en) * 2002-05-17 2004-09-28 Macronix International Co., Ltd. Implanter tool process parameter auto pre-setup system
WO2004046835A2 (en) 2002-11-15 2004-06-03 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
KR100605218B1 (ko) 2003-05-30 2006-07-31 엘지전자 주식회사 홈 네트워크 시스템
KR100638017B1 (ko) * 2003-05-30 2006-10-23 엘지전자 주식회사 네트워크 디바이스
US20060176928A1 (en) * 2005-02-08 2006-08-10 Tokyo Electron Limited Substrate processing apparatus, control method adopted in substrate processing apparatus and program
US20060174835A1 (en) * 2005-02-10 2006-08-10 Misako Saito Vacuum processing apparatus and method of using the same
CN100585607C (zh) * 2005-02-25 2010-01-27 朗姆研究公司 配置等离子体群集工具的方法
US7162317B2 (en) * 2005-02-25 2007-01-09 Lam Research Corporation Methods and apparatus for configuring plasma cluster tools
US7353379B2 (en) * 2005-02-25 2008-04-01 Lam Research Corporation Methods for configuring a plasma cluster tool
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
US9889239B2 (en) 2007-03-23 2018-02-13 Allegiance Corporation Fluid collection and disposal system and related methods
CA2681734A1 (en) 2007-03-23 2008-10-02 Allegiance Corporation Fluid collection and disposal system having interchangeable collection and other features and methods relating thereto
US20090212014A1 (en) * 2008-02-27 2009-08-27 Tokyo Electron Limited Method and system for performing multiple treatments in a dual-chamber batch processing system
CN103215572B (zh) * 2012-01-19 2016-12-14 北京北方微电子基地设备工艺研究中心有限责任公司 半导体设备工艺控制方法和半导体设备工艺控制装置
CN103838202B (zh) * 2012-11-27 2016-12-21 中芯国际集成电路制造(上海)有限公司 参数控制方法和参数控制系统
CN103399563B (zh) * 2013-08-16 2016-06-15 安徽科技学院 干燥塔控制器
TWI602608B (zh) * 2015-03-06 2017-10-21 旺矽科技股份有限公司 吸附式乾燥設備
CN106737122A (zh) * 2016-12-28 2017-05-31 武汉新芯集成电路制造有限公司 一种研磨控制方法以及晶圆研磨系统

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JPH06244261A (ja) 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ
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US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix

Also Published As

Publication number Publication date
EP0877308A2 (en) 1998-11-11
KR19980086788A (ko) 1998-12-05
CN1199192A (zh) 1998-11-18
CN100361032C (zh) 2008-01-09
US20010001386A1 (en) 2001-05-24
EP0877308A3 (en) 2000-08-23
JP3393035B2 (ja) 2003-04-07
KR100628618B1 (ko) 2007-01-31
US6258169B1 (en) 2001-07-10
JPH10308335A (ja) 1998-11-17
TW384438B (en) 2000-03-11

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