SG70097A1 - Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface - Google Patents
Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interfaceInfo
- Publication number
- SG70097A1 SG70097A1 SG1998001826A SG1998001826A SG70097A1 SG 70097 A1 SG70097 A1 SG 70097A1 SG 1998001826 A SG1998001826 A SG 1998001826A SG 1998001826 A SG1998001826 A SG 1998001826A SG 70097 A1 SG70097 A1 SG 70097A1
- Authority
- SG
- Singapore
- Prior art keywords
- tool
- working liquid
- machining workpieces
- workpiece interface
- flushing working
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22040697A JPH1158234A (ja) | 1997-08-15 | 1997-08-15 | 研磨方法及び研磨装置 |
JP5319398A JP3845511B2 (ja) | 1998-03-05 | 1998-03-05 | 研削装置及び研削方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG70097A1 true SG70097A1 (en) | 2000-01-25 |
Family
ID=26393908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998001826A SG70097A1 (en) | 1997-08-15 | 1998-07-20 | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
Country Status (7)
Country | Link |
---|---|
US (1) | US6095899A (de) |
EP (2) | EP0897778A1 (de) |
KR (1) | KR100486137B1 (de) |
CN (1) | CN1126639C (de) |
MY (1) | MY120753A (de) |
SG (1) | SG70097A1 (de) |
TW (1) | TW434098B (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
JP3894526B2 (ja) * | 1998-07-06 | 2007-03-22 | 株式会社ディスコ | 切削装置 |
JP3485816B2 (ja) * | 1998-12-09 | 2004-01-13 | 太陽誘電株式会社 | ダイシング装置 |
JP2000254857A (ja) * | 1999-01-06 | 2000-09-19 | Tokyo Seimitsu Co Ltd | 平面加工装置及び平面加工方法 |
JP2002025961A (ja) * | 2000-07-04 | 2002-01-25 | Disco Abrasive Syst Ltd | 半導体ウエーハの研削方法 |
JP2002028073A (ja) * | 2000-07-13 | 2002-01-29 | Disco Abrasive Syst Ltd | 伸縮自在カーテン |
DE10055286A1 (de) * | 2000-11-08 | 2002-05-23 | Freiberger Compound Mat Gmbh | Vorrichtung und Verfahren zum Trennen von Werkstoffen |
JP4455750B2 (ja) * | 2000-12-27 | 2010-04-21 | 株式会社ディスコ | 研削装置 |
JP2004050313A (ja) * | 2002-07-17 | 2004-02-19 | Memc Japan Ltd | 研削用砥石および研削方法 |
US7115443B2 (en) * | 2002-08-05 | 2006-10-03 | Koninklijke Philips Electronics N.V. | Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
US7288465B2 (en) * | 2003-04-15 | 2007-10-30 | International Business Machines Corpoartion | Semiconductor wafer front side protection |
US7001827B2 (en) * | 2003-04-15 | 2006-02-21 | International Business Machines Corporation | Semiconductor wafer front side protection |
DE102007022603A1 (de) * | 2007-05-12 | 2008-11-13 | Kapp Gmbh | Hartfeinbearbeitungsmaschine |
ITBO20070504A1 (it) * | 2007-07-20 | 2009-01-21 | Marposs Spa | Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione |
JP5164559B2 (ja) * | 2007-12-27 | 2013-03-21 | 株式会社ディスコ | 研削装置 |
EP2522459B1 (de) * | 2010-01-13 | 2014-11-12 | A.L.M.T. Corp. | Superschleifkornrad, waferherstellungsverfahren und wafer |
CN102294659A (zh) * | 2010-06-25 | 2011-12-28 | 中国砂轮企业股份有限公司 | 可调动态平衡及排屑的研磨砂轮 |
CN102380822A (zh) * | 2010-09-01 | 2012-03-21 | 沈阳理工大学 | 一种金刚石膜的超高速复合抛光盘 |
TWI517935B (zh) * | 2013-04-16 | 2016-01-21 | 國立台灣科技大學 | 氣體添加硏磨液的供應系統及其方法 |
JP6255238B2 (ja) * | 2013-12-27 | 2017-12-27 | 株式会社ディスコ | 切削装置 |
JP6139420B2 (ja) * | 2014-01-10 | 2017-05-31 | 株式会社東芝 | 研磨装置および研磨方法 |
KR101530269B1 (ko) * | 2014-01-15 | 2015-06-23 | 주식회사 엘지실트론 | 웨이퍼 그라인딩 장치 |
CN104128888A (zh) * | 2014-07-25 | 2014-11-05 | 浙江博海金属制品科技有限公司 | 一种平面抛光机 |
KR20160125585A (ko) * | 2015-04-21 | 2016-11-01 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN104907896A (zh) * | 2015-06-07 | 2015-09-16 | 安徽格楠机械有限公司 | 一种适用于深井采油钻头研磨抛光机 |
ITUB20154914A1 (it) * | 2015-10-29 | 2017-04-29 | Ancora Spa | Dispositivo per la lavorazione di manufatti ceramici |
JP6700800B2 (ja) * | 2016-01-15 | 2020-05-27 | 株式会社ディスコ | ブレードカバー |
CN106158709B (zh) * | 2016-07-22 | 2018-09-11 | 江苏鲁汶仪器有限公司 | 一种晶圆切割装置和方法 |
KR101835986B1 (ko) | 2016-07-25 | 2018-03-07 | 시오 컴퍼니 리미티드 | 유체 공급관 |
JP6736404B2 (ja) * | 2016-07-26 | 2020-08-05 | 株式会社ディスコ | 研削装置 |
JP6844970B2 (ja) * | 2016-08-18 | 2021-03-17 | 株式会社ディスコ | 研磨装置 |
CN108068024A (zh) * | 2016-11-17 | 2018-05-25 | 上海域申光电科技有限公司 | 抛光盘 |
KR101838429B1 (ko) | 2017-01-09 | 2018-03-13 | 시오 컴퍼니 리미티드 | 유체 공급관 |
KR20190035412A (ko) | 2017-09-26 | 2019-04-03 | 시오 컴퍼니 리미티드 | 유체 공급관 |
JP6433041B1 (ja) | 2017-10-25 | 2018-12-05 | 株式会社塩 | 流体供給装置 |
US10460926B2 (en) | 2017-11-17 | 2019-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for chemical mechanical polishing process |
JP7096674B2 (ja) * | 2018-01-31 | 2022-07-06 | 株式会社ディスコ | 研削研磨装置及び研削研磨方法 |
CN109304649B (zh) * | 2018-10-13 | 2020-08-21 | 北京圣龙缘科技有限公司 | 一种无人机电子芯片制造装备 |
CN111070055A (zh) * | 2019-12-27 | 2020-04-28 | 科达半导体有限公司 | 一种超薄晶圆加工装置 |
CN112223093B (zh) * | 2020-06-19 | 2021-10-29 | 连云港华鼎车轮有限公司 | 一种汽车钢圈自动抛光设备 |
JP2022032667A (ja) * | 2020-08-13 | 2022-02-25 | 株式会社ディスコ | ウェーハの加工方法 |
EP4144480B1 (de) * | 2021-09-01 | 2024-01-31 | Siltronic AG | Verfahren zum schleifen von halbleiterscheiben |
CN114029851A (zh) * | 2021-11-24 | 2022-02-11 | 济源石晶光电频率技术有限公司 | 一种高基频晶片研磨工艺 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6017664B2 (ja) * | 1980-02-01 | 1985-05-04 | 株式会社 デイスコ | 研削ホィ−ル |
JPS5836064U (ja) * | 1981-08-31 | 1983-03-09 | 株式会社井上ジャパックス研究所 | 研削装置 |
US4663890A (en) * | 1982-05-18 | 1987-05-12 | Gmn Georg Muller Nurnberg Gmbh | Method for machining workpieces of brittle hard material into wafers |
JPS60259378A (ja) * | 1984-06-01 | 1985-12-21 | Hitachi Seiko Ltd | 研削機における研削液供給方法およびその装置 |
JPS62123737A (ja) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | ダイシング装置 |
AU637087B2 (en) * | 1989-03-24 | 1993-05-20 | Sumitomo Electric Industries, Ltd. | Apparatus for grinding semiconductor wafer |
JPH04216013A (ja) * | 1990-12-17 | 1992-08-06 | Tokyo Seimitsu Co Ltd | スライシングマシンの切断方法 |
US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
JPH05305561A (ja) * | 1992-05-01 | 1993-11-19 | Sumitomo Electric Ind Ltd | 窒化ケイ素系セラミックスの研削加工方法及びその加工製品 |
JP2828377B2 (ja) * | 1993-01-26 | 1998-11-25 | 株式会社牧野フライス製作所 | 研削加工方法および装置 |
JP3240545B2 (ja) * | 1994-06-01 | 2001-12-17 | 新東ブレーター株式会社 | 平面研磨機の研磨液供給装置 |
IT1278450B1 (it) * | 1994-10-27 | 1997-11-20 | Alberto Sardo | Perfezionamenti alle macchine rettilinee a profilo variabile per la lavorazione a bisello,a smusso,a filo piatto delle lastre di vetro |
JP2833552B2 (ja) * | 1995-10-19 | 1998-12-09 | 日本電気株式会社 | ウェハ研磨方法および研磨装置 |
US5667424A (en) * | 1996-09-25 | 1997-09-16 | Chartered Semiconductor Manufacturing Pte Ltd. | New chemical mechanical planarization (CMP) end point detection apparatus |
SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
-
1998
- 1998-07-20 SG SG1998001826A patent/SG70097A1/en unknown
- 1998-07-28 TW TW087112344A patent/TW434098B/zh not_active IP Right Cessation
- 1998-07-29 US US09/124,753 patent/US6095899A/en not_active Expired - Lifetime
- 1998-07-30 EP EP98114334A patent/EP0897778A1/de not_active Withdrawn
- 1998-07-30 EP EP01107409A patent/EP1110669A3/de not_active Withdrawn
- 1998-07-31 CN CN98116767A patent/CN1126639C/zh not_active Expired - Lifetime
- 1998-08-03 MY MYPI98003543A patent/MY120753A/en unknown
- 1998-08-07 KR KR10-1998-0032175A patent/KR100486137B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0897778A1 (de) | 1999-02-24 |
KR19990023450A (ko) | 1999-03-25 |
US6095899A (en) | 2000-08-01 |
EP1110669A3 (de) | 2001-12-05 |
EP1110669A2 (de) | 2001-06-27 |
KR100486137B1 (ko) | 2005-07-18 |
CN1126639C (zh) | 2003-11-05 |
CN1208682A (zh) | 1999-02-24 |
MY120753A (en) | 2005-11-30 |
TW434098B (en) | 2001-05-16 |
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