SG54623A1 - Chamber design with isolation valve to preserve vacuum during maintenance - Google Patents

Chamber design with isolation valve to preserve vacuum during maintenance

Info

Publication number
SG54623A1
SG54623A1 SG1998000676A SG1998000676A SG54623A1 SG 54623 A1 SG54623 A1 SG 54623A1 SG 1998000676 A SG1998000676 A SG 1998000676A SG 1998000676 A SG1998000676 A SG 1998000676A SG 54623 A1 SG54623 A1 SG 54623A1
Authority
SG
Singapore
Prior art keywords
isolation valve
during maintenance
vacuum during
chamber design
preserve vacuum
Prior art date
Application number
SG1998000676A
Other languages
English (en)
Inventor
Robert E Davenport
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG54623A1 publication Critical patent/SG54623A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/04—Pressure vessels, e.g. autoclaves
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
SG1998000676A 1997-03-31 1998-03-31 Chamber design with isolation valve to preserve vacuum during maintenance SG54623A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/828,250 US6103069A (en) 1997-03-31 1997-03-31 Chamber design with isolation valve to preserve vacuum during maintenance

Publications (1)

Publication Number Publication Date
SG54623A1 true SG54623A1 (en) 1998-11-16

Family

ID=25251275

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000676A SG54623A1 (en) 1997-03-31 1998-03-31 Chamber design with isolation valve to preserve vacuum during maintenance

Country Status (6)

Country Link
US (1) US6103069A (zh)
EP (1) EP0869199A1 (zh)
JP (1) JPH1150229A (zh)
KR (1) KR19980080903A (zh)
SG (1) SG54623A1 (zh)
TW (1) TW373242B (zh)

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GB0127251D0 (en) * 2001-11-13 2002-01-02 Nordiko Ltd Apparatus
DE10215040B4 (de) * 2002-04-05 2019-02-21 Leybold Optics Gmbh Vorrichtung und Verfahren zum Be- und Entladen einer Vakuumkammer
JP4294976B2 (ja) * 2003-02-27 2009-07-15 東京エレクトロン株式会社 基板処理装置
US7300558B2 (en) * 2003-10-21 2007-11-27 Seagate Technology Llc Rapid cycle time gas burster
US20050092253A1 (en) * 2003-11-04 2005-05-05 Venkat Selvamanickam Tape-manufacturing system having extended operational capabilites
KR100530335B1 (ko) * 2003-12-24 2005-11-22 재단법인 포항산업과학연구원 플라즈마 멜트 스피너용 전극봉 연마 장치
EP1582832B1 (de) * 2004-03-15 2007-04-18 Applied Materials GmbH & Co. KG Vakuumbehandlungsanlage mit Umsetzbarem Wartungsventil
DE102004036170B4 (de) * 2004-07-26 2007-10-11 Schott Ag Vakuumbeschichtungsanlage und Verfahren zur Vakuumbeschichtung und deren Verwendung
US7780821B2 (en) * 2004-08-02 2010-08-24 Seagate Technology Llc Multi-chamber processing with simultaneous workpiece transport and gas delivery
KR100626791B1 (ko) * 2004-12-17 2006-09-25 두산메카텍 주식회사 진공장치용 히터
JP4923450B2 (ja) * 2005-07-01 2012-04-25 富士ゼロックス株式会社 バッチ処理支援装置および方法、プログラム
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US20070012558A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Magnetron sputtering system for large-area substrates
DE102005037822A1 (de) * 2005-08-08 2007-02-15 Systec System- Und Anlagentechnik Gmbh & Co.Kg Vakuumbeschichtung mit Kondensatentfernung
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US7588668B2 (en) 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
DE102005056324A1 (de) * 2005-11-25 2007-06-06 Aixtron Ag CVD-Reaktor mit auswechselbarer Prozesskammerdecke
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US20120152727A1 (en) * 2010-11-24 2012-06-21 Applied Materials, Inc. Alkali Metal Deposition System
CN102945788B (zh) * 2011-08-16 2015-04-15 北京北方微电子基地设备工艺研究中心有限责任公司 遮蔽装置及具有其的半导体处理设备
CN103031514B (zh) * 2011-09-30 2015-09-02 北京北方微电子基地设备工艺研究中心有限责任公司 遮蔽装置、具有其的pvd设备及pvd设备的控制方法
JP5787793B2 (ja) * 2012-03-05 2015-09-30 株式会社東芝 イオン源
WO2016040547A1 (en) * 2014-09-11 2016-03-17 Massachusetts Institute Of Technology Processing system for small substrates
BE1022682B1 (nl) * 2015-01-11 2016-07-14 Soleras Advanced Coatings Bvba Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem
EP3091561B1 (en) * 2015-05-06 2019-09-04 safematic GmbH Sputter unit
CN105047521B (zh) * 2015-09-21 2017-05-17 北京凯尔科技发展有限公司 一种保持质谱内部真空条件下更换离子源的质谱仪
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
JP7061896B2 (ja) 2018-03-02 2022-05-02 株式会社日立製作所 粒子線治療システムおよび粒子線治療システムの設備更新方法
US20200194234A1 (en) * 2018-12-17 2020-06-18 Lam Research Corporation Vacuum chamber opening system
KR102229688B1 (ko) * 2019-02-13 2021-03-18 프리시스 주식회사 밸브모듈 및 이를 포함하는 기판처리장치
TWI762230B (zh) * 2021-03-08 2022-04-21 天虹科技股份有限公司 遮擋機構及具有遮擋機構的基板處理腔室
CN115621110A (zh) * 2021-07-16 2023-01-17 长鑫存储技术有限公司 一种门阀装置、清洁方法和机械设备
US11933416B2 (en) 2021-07-16 2024-03-19 Changxin Memory Technologies, Inc. Gate valve device, cleaning method and mechanical apparatus

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JPS60262969A (ja) * 1984-06-11 1985-12-26 Tdk Corp スパツタタ−ゲツト装置
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JPH0733576B2 (ja) * 1989-11-29 1995-04-12 株式会社日立製作所 スパツタ装置、及びターゲツト交換装置、並びにその交換方法
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US5380414A (en) * 1993-06-11 1995-01-10 Applied Materials, Inc. Shield and collimator pasting deposition chamber with a wafer support periodically used as an acceptor
DE4408947C2 (de) * 1994-03-16 1997-03-13 Balzers Hochvakuum Vakuumbehandlungsanlage
JPH07335552A (ja) * 1994-06-08 1995-12-22 Tel Varian Ltd 処理装置

Also Published As

Publication number Publication date
US6103069A (en) 2000-08-15
JPH1150229A (ja) 1999-02-23
TW373242B (en) 1999-11-01
EP0869199A1 (en) 1998-10-07
KR19980080903A (ko) 1998-11-25

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