SG44626A1 - Method of bonding circuir boards - Google Patents

Method of bonding circuir boards

Info

Publication number
SG44626A1
SG44626A1 SG1996004470A SG1996004470A SG44626A1 SG 44626 A1 SG44626 A1 SG 44626A1 SG 1996004470 A SG1996004470 A SG 1996004470A SG 1996004470 A SG1996004470 A SG 1996004470A SG 44626 A1 SG44626 A1 SG 44626A1
Authority
SG
Singapore
Prior art keywords
light
electrodes
sensitive adhesive
adhesive layer
bonding
Prior art date
Application number
SG1996004470A
Other languages
English (en)
Inventor
Eiichi Ogawa
Hirosho Komano
Kazuaki Utsumi
Koji Matsui
Mitsuru Kimura
Toshimi Aoyama
Original Assignee
Nec Corp
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35539891A external-priority patent/JP2660943B2/ja
Priority claimed from JP4196255A external-priority patent/JP3050345B2/ja
Application filed by Nec Corp, Tokyo Ohka Kogyo Co Ltd filed Critical Nec Corp
Publication of SG44626A1 publication Critical patent/SG44626A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
SG1996004470A 1991-11-27 1992-11-26 Method of bonding circuir boards SG44626A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35539891A JP2660943B2 (ja) 1991-11-27 1991-11-27 回路基板の接着方法
JP4196255A JP3050345B2 (ja) 1992-06-29 1992-06-29 集積回路素子の接続方法

Publications (1)

Publication Number Publication Date
SG44626A1 true SG44626A1 (en) 1997-12-19

Family

ID=26509642

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996004470A SG44626A1 (en) 1991-11-27 1992-11-26 Method of bonding circuir boards

Country Status (4)

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EP0544294A3 (en) 1993-12-08
EP0544294B1 (de) 1996-02-28
EP0544294A2 (de) 1993-06-02
US5318651A (en) 1994-06-07
US5545281A (en) 1996-08-13
DE69208601D1 (de) 1996-04-04

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