SG40883A1 - Apparatus for coating substrates in a vacuum - Google Patents

Apparatus for coating substrates in a vacuum

Info

Publication number
SG40883A1
SG40883A1 SG1996010302A SG1996010302A SG40883A1 SG 40883 A1 SG40883 A1 SG 40883A1 SG 1996010302 A SG1996010302 A SG 1996010302A SG 1996010302 A SG1996010302 A SG 1996010302A SG 40883 A1 SG40883 A1 SG 40883A1
Authority
SG
Singapore
Prior art keywords
chamber
cathodes
coating substrates
current source
vacuum
Prior art date
Application number
SG1996010302A
Other languages
English (en)
Inventor
Joachim Dr Szczyrbowski
Gotz Teschner
Original Assignee
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Ag filed Critical Leybold Ag
Publication of SG40883A1 publication Critical patent/SG40883A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
SG1996010302A 1995-10-06 1996-07-24 Apparatus for coating substrates in a vacuum SG40883A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19537212A DE19537212A1 (de) 1994-10-06 1995-10-06 Vorrichtung zum Beschichten von Substraten im Vakuum

Publications (1)

Publication Number Publication Date
SG40883A1 true SG40883A1 (en) 1997-06-14

Family

ID=7774164

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010302A SG40883A1 (en) 1995-10-06 1996-07-24 Apparatus for coating substrates in a vacuum

Country Status (12)

Country Link
US (1) US5807470A (zh)
EP (1) EP0767483B1 (zh)
JP (1) JP3442589B2 (zh)
KR (1) KR100235573B1 (zh)
CN (1) CN1074582C (zh)
AT (1) ATE183019T1 (zh)
BR (1) BR9605001A (zh)
CA (1) CA2184432C (zh)
DE (2) DE19537212A1 (zh)
ES (1) ES2134538T3 (zh)
SG (1) SG40883A1 (zh)
TW (1) TW413831B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19605932A1 (de) * 1996-02-17 1997-08-21 Leybold Systems Gmbh Verfahren zum Ablagern einer optisch transparenten und elektrisch leitenden Schicht auf einem Substrat aus durchscheinendem Werkstoff
DE19651615C1 (de) * 1996-12-12 1997-07-10 Fraunhofer Ges Forschung Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern
DE19651811B4 (de) * 1996-12-13 2006-08-31 Unaxis Deutschland Holding Gmbh Vorrichtung zum Belegen eines Substrats mit dünnen Schichten
DE19956733A1 (de) * 1999-11-25 2001-06-28 Fraunhofer Ges Forschung Verfahren zur Regelung von Sputterprozessen
DE10154229B4 (de) 2001-11-07 2004-08-05 Applied Films Gmbh & Co. Kg Einrichtung für die Regelung einer Plasmaimpedanz
US7298091B2 (en) * 2002-02-01 2007-11-20 The Regents Of The University Of California Matching network for RF plasma source
DE10306347A1 (de) * 2003-02-15 2004-08-26 Hüttinger Elektronik GmbH & Co. KG Leistungszufuhrregeleinheit
US6967305B2 (en) * 2003-08-18 2005-11-22 Mks Instruments, Inc. Control of plasma transitions in sputter processing systems
JP4658506B2 (ja) * 2004-03-31 2011-03-23 浩史 滝川 パルスアークプラズマ生成用電源回路及びパルスアークプラズマ処理装置
EP1720195B1 (de) * 2005-05-06 2012-12-12 HÜTTINGER Elektronik GmbH + Co. KG Arcunterdrückungsanordnung
EP2326151A1 (fr) 2009-11-24 2011-05-25 AGC Glass Europe Procédé et dispositif de polarisation d'une électrode DBD
WO2019004188A1 (ja) * 2017-06-27 2019-01-03 キヤノンアネルバ株式会社 プラズマ処理装置
KR102457976B1 (ko) * 2017-06-27 2022-10-25 캐논 아네르바 가부시키가이샤 플라스마 처리 장치
WO2019003309A1 (ja) 2017-06-27 2019-01-03 キヤノンアネルバ株式会社 プラズマ処理装置
KR102361377B1 (ko) * 2017-06-27 2022-02-10 캐논 아네르바 가부시키가이샤 플라스마 처리 장치
JP7471233B2 (ja) * 2018-05-06 2024-04-19 エーイーエス グローバル ホールディングス， プライベート リミテッド クレージングを低減させるための装置、システム、および方法
CN112292911A (zh) * 2018-06-26 2021-01-29 佳能安内华股份有限公司 等离子体处理装置、等离子体处理方法、程序和存储介质

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887005A (en) * 1987-09-15 1989-12-12 Rough J Kirkwood H Multiple electrode plasma reactor power distribution system
JPH01268869A (ja) * 1988-04-20 1989-10-26 Fuji Photo Film Co Ltd スパッタリング装置
DE3923661A1 (de) * 1989-07-18 1991-01-24 Leybold Ag Schaltungsanordnung fuer die anpassung der impedanz einer plasmastrecke an einen hochfrequenzgenerator
DE4042287C2 (de) * 1990-12-31 1999-10-28 Leybold Ag Vorrichtung zum reaktiven Aufstäuben von elektrisch isolierendem Werkstoff
DE4106770C2 (de) * 1991-03-04 1996-10-17 Leybold Ag Verrichtung zum reaktiven Beschichten eines Substrats
US5281321A (en) * 1991-08-20 1994-01-25 Leybold Aktiengesellschaft Device for the suppression of arcs
US5240584A (en) * 1991-11-07 1993-08-31 Leybold Aktiengesellschaft Apparatus for the reactive coating of a substrate
US5415757A (en) * 1991-11-26 1995-05-16 Leybold Aktiengesellschaft Apparatus for coating a substrate with electrically nonconductive coatings
DE4138794A1 (de) * 1991-11-26 1993-05-27 Leybold Ag Verfahren und vorrichtung zum beschichten eines substrats, insbesondere mit elektrisch nichtleitenden schichten
DE4237517A1 (de) * 1992-11-06 1994-05-11 Leybold Ag Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
US5512164A (en) * 1993-06-03 1996-04-30 The United States Of America As Represented By The United States Department Of Energy Method for sputtering with low frequency alternating current

Also Published As

Publication number Publication date
US5807470A (en) 1998-09-15
CN1074582C (zh) 2001-11-07
KR970023537A (ko) 1997-05-30
KR100235573B1 (ko) 1999-12-15
DE19537212A1 (de) 1996-04-11
ES2134538T3 (es) 1999-10-01
BR9605001A (pt) 1998-06-23
CA2184432A1 (en) 1997-04-07
EP0767483A1 (de) 1997-04-09
JPH09111449A (ja) 1997-04-28
CN1155748A (zh) 1997-07-30
DE59602601D1 (de) 1999-09-09
ATE183019T1 (de) 1999-08-15
EP0767483B1 (de) 1999-08-04
TW413831B (en) 2000-12-01
JP3442589B2 (ja) 2003-09-02
CA2184432C (en) 2006-01-24

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