SG189309A1 - Dies prepeeling apparatus and method - Google Patents
Dies prepeeling apparatus and method Download PDFInfo
- Publication number
- SG189309A1 SG189309A1 SG2013026083A SG2013026083A SG189309A1 SG 189309 A1 SG189309 A1 SG 189309A1 SG 2013026083 A SG2013026083 A SG 2013026083A SG 2013026083 A SG2013026083 A SG 2013026083A SG 189309 A1 SG189309 A1 SG 189309A1
- Authority
- SG
- Singapore
- Prior art keywords
- chamber
- dicing tape
- semiconductor dies
- pressure
- base
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 claims abstract description 83
- 239000012530 fluid Substances 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 24
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2011/076011 WO2012174707A1 (en) | 2011-06-21 | 2011-06-21 | Dies prepeeling apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG189309A1 true SG189309A1 (en) | 2013-05-31 |
Family
ID=47421973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013026083A SG189309A1 (en) | 2011-06-21 | 2011-06-21 | Dies prepeeling apparatus and method |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR20140027453A (zh) |
| CN (1) | CN103098170B (zh) |
| MY (1) | MY184960A (zh) |
| SG (1) | SG189309A1 (zh) |
| WO (1) | WO2012174707A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6319766B2 (ja) * | 2014-07-30 | 2018-05-09 | リンテック株式会社 | 粘着シートの貼付方法および貼付装置 |
| JP6627001B1 (ja) * | 2019-01-21 | 2019-12-25 | 株式会社東京精密 | ウェーハ剥離洗浄装置 |
| KR20210028910A (ko) | 2019-09-05 | 2021-03-15 | 삼성전자주식회사 | 자외선 조사 장치 및 이를 이용한 반도체 패키지의 제조 방법 |
| CN110690158B (zh) * | 2019-09-25 | 2022-03-22 | 云谷（固安）科技有限公司 | 剥离装置及剥离方法 |
| TWI790136B (zh) * | 2022-03-07 | 2023-01-11 | 梭特科技股份有限公司 | 用於混合式接合的吸嘴結構 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
| US6204092B1 (en) * | 1999-04-13 | 2001-03-20 | Lucent Technologies, Inc. | Apparatus and method for transferring semiconductor die to a carrier |
| US6277234B1 (en) * | 1999-06-01 | 2001-08-21 | Lucent Technologies, Inc. | Method and apparatus for removing work pieces adhered to a support |
| US7665204B2 (en) * | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| JP4985513B2 (ja) * | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | 電子部品の剥離方法及び剥離装置 |
| US8470130B2 (en) * | 2009-10-20 | 2013-06-25 | Asm Assembly Automation Ltd | Universal die detachment apparatus |
| JP2011091293A (ja) * | 2009-10-26 | 2011-05-06 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
-
2011
- 2011-06-21 CN CN201180037753.4A patent/CN103098170B/zh not_active Expired - Fee Related
- 2011-06-21 KR KR1020147000513A patent/KR20140027453A/ko not_active Application Discontinuation
- 2011-06-21 MY MYPI2013702499A patent/MY184960A/en unknown
- 2011-06-21 SG SG2013026083A patent/SG189309A1/en unknown
- 2011-06-21 WO PCT/CN2011/076011 patent/WO2012174707A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN103098170A (zh) | 2013-05-08 |
| MY184960A (en) | 2021-04-30 |
| KR20140027453A (ko) | 2014-03-06 |
| WO2012174707A1 (en) | 2012-12-27 |
| CN103098170B (zh) | 2016-11-02 |
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