MY184960A - Dies prepeeling apparatus and method - Google Patents

Dies prepeeling apparatus and method

Info

Publication number
MY184960A
MY184960A MYPI2013702499A MYPI2013702499A MY184960A MY 184960 A MY184960 A MY 184960A MY PI2013702499 A MYPI2013702499 A MY PI2013702499A MY PI2013702499 A MYPI2013702499 A MY PI2013702499A MY 184960 A MY184960 A MY 184960A
Authority
MY
Malaysia
Prior art keywords
chamber
cover
semiconductor dies
prepeeling
base
Prior art date
Application number
MYPI2013702499A
Inventor
Tien Chiu Chin
Takiar Hem
Liu Ning
Zhang Jidong
Lu Zhong
Tai Enyong
ELIPARAKKAL Nadeer
Original Assignee
Sandisk Semiconductor Shanghai Co Ltd
Sandisk Information Tech Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sandisk Semiconductor Shanghai Co Ltd, Sandisk Information Tech Shanghai Co Ltd filed Critical Sandisk Semiconductor Shanghai Co Ltd
Publication of MY184960A publication Critical patent/MY184960A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

An apparatus and a method for prepeeling semiconductor dies from a dicing tape with the semiconductor dies attached thereon are disclosed. The apparatus comprises a chamber having a bottom base, a top opening and an annular sidewall extended upward from the periphery of the base. The side wall has a substantially flat top surface. The apparatus further comprises a cover disposed above the chamber. The cover has a central opening. The apparatus further comprises at least one inlet disposed in the base and a pressure regulator connected to the chamber via the at least one inlet. The dicing tape is disposed between the cover and the top surface of the sidewall to hermetically seal the top opening of the chamber. The semiconductor dies are located directly above the top opening of the chamber.
MYPI2013702499A 2011-06-21 2011-06-21 Dies prepeeling apparatus and method MY184960A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/076011 WO2012174707A1 (en) 2011-06-21 2011-06-21 Dies prepeeling apparatus and method

Publications (1)

Publication Number Publication Date
MY184960A true MY184960A (en) 2021-04-30

Family

ID=47421973

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013702499A MY184960A (en) 2011-06-21 2011-06-21 Dies prepeeling apparatus and method

Country Status (5)

Country Link
KR (1) KR20140027453A (en)
CN (1) CN103098170B (en)
MY (1) MY184960A (en)
SG (1) SG189309A1 (en)
WO (1) WO2012174707A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6319766B2 (en) * 2014-07-30 2018-05-09 リンテック株式会社 Adhesive sheet sticking method and sticking device
JP6627001B1 (en) * 2019-01-21 2019-12-25 株式会社東京精密 Wafer peeling cleaning equipment
KR20210028910A (en) 2019-09-05 2021-03-15 삼성전자주식회사 Ultraviolet ray irrdiation apparatus and method of manufacturing a semiconductor package using the apparatus
CN110690158B (en) * 2019-09-25 2022-03-22 云谷（固安）科技有限公司 Stripping device and stripping method
TWI790136B (en) * 2022-03-07 2023-01-11 梭特科技股份有限公司 Nozzle for hybrid bonding

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
US6204092B1 (en) * 1999-04-13 2001-03-20 Lucent Technologies, Inc. Apparatus and method for transferring semiconductor die to a carrier
US6277234B1 (en) * 1999-06-01 2001-08-21 Lucent Technologies, Inc. Method and apparatus for removing work pieces adhered to a support
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
JP4985513B2 (en) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 Method and apparatus for peeling electronic parts
US8470130B2 (en) * 2009-10-20 2013-06-25 Asm Assembly Automation Ltd Universal die detachment apparatus
JP2011091293A (en) * 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd Method for processing wafer

Also Published As

Publication number Publication date
SG189309A1 (en) 2013-05-31
CN103098170A (en) 2013-05-08
KR20140027453A (en) 2014-03-06
WO2012174707A1 (en) 2012-12-27
CN103098170B (en) 2016-11-02

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