SG182542A1 - Method for the application of a conformal nanocoating by means of a low pressure plasma process - Google Patents

Method for the application of a conformal nanocoating by means of a low pressure plasma process Download PDF

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Publication number
SG182542A1
SG182542A1 SG2012052296A SG2012052296A SG182542A1 SG 182542 A1 SG182542 A1 SG 182542A1 SG 2012052296 A SG2012052296 A SG 2012052296A SG 2012052296 A SG2012052296 A SG 2012052296A SG 182542 A1 SG182542 A1 SG 182542A1
Authority
SG
Singapore
Prior art keywords
coating
plasma
nanocoating
assembly
conformal
Prior art date
Application number
SG2012052296A
Other languages
English (en)
Inventor
Filip Legein
Anthony Vanlandeghem
Peter Martens
Original Assignee
Europlasma Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europlasma Nv filed Critical Europlasma Nv
Publication of SG182542A1 publication Critical patent/SG182542A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/62Plasma-deposition of organic layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32541Shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00Halogenated polymers
    • B05D2506/10Fluorinated polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141Plasma treatment
    • B05D3/142Pretreatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872Insulating conformal coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/23Sheet including cover or casing
    • Y10T428/239Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Medical Uses (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
SG2012052296A 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process SG182542A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
PCT/EP2011/000242 WO2011089009A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process

Publications (1)

Publication Number Publication Date
SG182542A1 true SG182542A1 (en) 2012-08-30

Family

ID=42289590

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012052296A SG182542A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process

Country Status (14)

Country Link
US (1) US20120308762A1 (https=)
EP (1) EP2525922A1 (https=)
JP (1) JP2013517382A (https=)
KR (1) KR20130000373A (https=)
CN (1) CN102821873A (https=)
AU (1) AU2011208879B2 (https=)
BE (1) BE1019159A5 (https=)
BR (1) BR112012018071A2 (https=)
CA (1) CA2786855A1 (https=)
CL (1) CL2012001954A1 (https=)
MX (1) MX2012008415A (https=)
NZ (1) NZ601365A (https=)
SG (1) SG182542A1 (https=)
WO (1) WO2011089009A1 (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
GB2489761B (en) * 2011-09-07 2015-03-04 Europlasma Nv Surface coatings
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
KR102046130B1 (ko) * 2012-03-06 2019-11-18 셈블란트 리미티드 코팅된 전기 어셈블리
EP2828004B1 (en) 2012-03-23 2019-11-20 hZo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
GB2494946B (en) * 2012-05-11 2013-10-09 Europlasma Nv Surface coatings
WO2013192209A2 (en) * 2012-06-18 2013-12-27 Hzo, Inc. Apparatuses, systems and methods for protecting electronic device assemblies
KR20150020574A (ko) 2012-06-18 2015-02-26 에이치제트오 인코포레이티드 완전히 조립된 전자 디바이스의 내부 표면에 보호 코팅을 제공하는 시스템 및 방법
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
CA2887871A1 (en) * 2012-10-09 2014-04-17 Europlasma Nv Apparatus and method for applying surface coatings
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
CN104994965A (zh) 2013-01-08 2015-10-21 Hzo股份有限公司 用于施涂保护性涂层的掩蔽基底
US9002041B2 (en) 2013-05-14 2015-04-07 Logitech Europe S.A. Method and apparatus for improved acoustic transparency
BE1021288B1 (nl) * 2013-10-07 2015-10-20 Europlasma Nv Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
CN104179011B (zh) * 2014-07-18 2016-08-24 青岛纺联控股集团有限公司 纺织品纳米等离子防水处理方法
CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
BE1023998B1 (nl) 2015-06-09 2017-10-26 P2I Ltd Coatings
CN105047514B (zh) * 2015-07-27 2017-06-13 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
CN107615900B (zh) * 2016-01-19 2019-12-24 华为技术有限公司 电子设备防水方法、装置及电子设备
CN109069320A (zh) * 2016-04-29 2018-12-21 卢载昊 形成有纳米涂层的吸收产品及制造方法
US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
GB201610481D0 (en) * 2016-06-14 2016-08-03 Surface Innovations Ltd Coating
CN107058979B (zh) * 2017-01-23 2018-05-11 江苏菲沃泰纳米科技有限公司 一种防水耐电击穿涂层的制备方法
CN106868473B (zh) * 2017-01-23 2018-07-13 江苏菲沃泰纳米科技有限公司 一种梯度递减结构防液涂层的制备方法
CN107217243B (zh) * 2017-05-21 2018-07-13 江苏菲沃泰纳米科技有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
US11270871B2 (en) 2017-05-21 2022-03-08 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating
CN107177835B (zh) * 2017-05-21 2018-06-19 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107904574A (zh) * 2017-10-27 2018-04-13 中国船舶重工集团公司第七二三研究所 一种基于海上复杂环境的纳米防护涂层涂覆方法
KR20220073739A (ko) 2019-10-24 2022-06-03 사아티 에스.피.에이. 복합 필터 매체의 제조 방법 및 이 방법으로 얻어지는 복합 필터 매체
JP7516401B2 (ja) 2019-10-24 2024-07-16 サーティ・エッセ・ピ・ア 複合フィルタ材を作成するための方法およびこの方法によって得られた複合フィルタ材
IT201900019760A1 (it) 2019-10-24 2021-04-24 Saati Spa Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento.
EP4163417A4 (en) * 2020-06-09 2024-07-31 Jiangsu Favored Nanotechnology Co., Ltd. PROTECTIVE COATING AND PREPARATION METHOD THEREFOR
CN113275217B (zh) * 2021-05-18 2022-06-24 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法
CN113365433B (zh) * 2021-06-07 2024-02-02 深圳奥拦科技有限责任公司 Pcba板表面派瑞林膜层的除去方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52116897A (en) * 1976-03-29 1977-09-30 Matsushita Electric Ind Co Ltd Forming transparent conductive film on organic substrate
JPS6047024B2 (ja) 1981-07-31 1985-10-19 日産自動車株式会社 プレス型における製品押出装置
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
US4606929A (en) * 1984-12-20 1986-08-19 Petrakov Vladimir P Method of ionized-plasma spraying and apparatus for performing same
EP0187595A3 (en) 1984-12-24 1987-09-30 Sangamo Weston, Inc. Protective coating for electrolytic capacitor
JPS6277463A (ja) * 1985-09-30 1987-04-09 Sumitomo Bakelite Co Ltd 耐熱性樹脂フイルム用真空ロ−ルコ−タ−
JPS63311794A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPH0196364A (ja) * 1987-10-07 1989-04-14 Teijin Ltd 高分子樹脂基板の水分除去方法
JPH02102038A (ja) * 1988-10-12 1990-04-13 Furukawa Alum Co Ltd 耐食性金属板
EP0492828A1 (en) 1990-12-26 1992-07-01 Dow Corning Corporation Mixture of adhesion additives useful in UV curable compositions and compositions containing same
JPH04296337A (ja) * 1991-03-26 1992-10-20 Matsushita Electric Works Ltd 高分子膜の製造方法
US5618619A (en) * 1994-03-03 1997-04-08 Monsanto Company Highly abrasion-resistant, flexible coatings for soft substrates
SG48462A1 (en) * 1995-10-26 1998-04-17 Ibm Lead protective coating composition process and structure thereof
JP4260907B2 (ja) * 1995-12-12 2009-04-30 東洋紡績株式会社 フィルム積層体
US5843239A (en) * 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6127038A (en) 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
DE10114897A1 (de) * 2001-03-26 2002-10-24 Infineon Technologies Ag Elektronisches Bauteil
MXPA05007915A (es) * 2003-01-30 2005-09-30 Europlasma Metodo para proporcionar un revestimiento sobre las superficies de un producto con una estructura de celda abierta a lo largo de su estructura y uso de tal metodo.
US7202172B2 (en) * 2003-12-05 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronic device having disposable spacer
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
KR20070102482A (ko) * 2004-11-02 2007-10-18 아사히 가라스 가부시키가이샤 플루오로카본막 및 그 제조 방법
GB2434369B (en) * 2006-01-20 2010-08-25 P2I Ltd Plasma coated electrical or electronic devices
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5223325B2 (ja) * 2007-12-21 2013-06-26 住友金属鉱山株式会社 金属被覆ポリエチレンナフタレート基板とその製造方法
GB0800305D0 (en) * 2008-01-09 2008-02-20 P2I Ltd Abatement apparatus and processing method

Also Published As

Publication number Publication date
EP2525922A1 (en) 2012-11-28
CA2786855A1 (en) 2011-07-28
US20120308762A1 (en) 2012-12-06
KR20130000373A (ko) 2013-01-02
JP2013517382A (ja) 2013-05-16
BR112012018071A2 (pt) 2016-05-03
WO2011089009A1 (en) 2011-07-28
AU2011208879A1 (en) 2012-08-09
MX2012008415A (es) 2012-08-15
CL2012001954A1 (es) 2013-02-01
AU2011208879B2 (en) 2015-12-17
CN102821873A (zh) 2012-12-12
BE1019159A5 (nl) 2012-04-03
NZ601365A (en) 2015-03-27

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