EP2862428A4 - Apparatuses, systems and methods for protecting electronic device assemblies - Google Patents
Apparatuses, systems and methods for protecting electronic device assembliesInfo
- Publication number
- EP2862428A4 EP2862428A4 EP13807362.2A EP13807362A EP2862428A4 EP 2862428 A4 EP2862428 A4 EP 2862428A4 EP 13807362 A EP13807362 A EP 13807362A EP 2862428 A4 EP2862428 A4 EP 2862428A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- apparatuses
- systems
- methods
- electronic device
- device assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261660808P | 2012-06-18 | 2012-06-18 | |
US13/736,753 US9426936B2 (en) | 2012-01-10 | 2013-01-08 | Systems for assembling electronic devices with internal moisture-resistant coatings |
US201361615172P | 2013-03-23 | 2013-03-23 | |
US13/849,790 US11060183B2 (en) | 2012-03-23 | 2013-03-25 | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
PCT/US2013/046371 WO2013192209A2 (en) | 2012-06-18 | 2013-06-18 | Apparatuses, systems and methods for protecting electronic device assemblies |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2862428A2 EP2862428A2 (en) | 2015-04-22 |
EP2862428A4 true EP2862428A4 (en) | 2016-06-22 |
Family
ID=49769677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13807362.2A Withdrawn EP2862428A4 (en) | 2012-06-18 | 2013-06-18 | Apparatuses, systems and methods for protecting electronic device assemblies |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2862428A4 (en) |
WO (1) | WO2013192209A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6754974B2 (en) * | 2017-06-16 | 2020-09-16 | パナソニックIpマネジメント株式会社 | Equipment element repair management system and equipment element repair management method |
JP2019003460A (en) * | 2017-06-16 | 2019-01-10 | パナソニックIpマネジメント株式会社 | Facility element maintenance management system and facility element maintenance management method |
JP7035184B2 (en) * | 2018-06-13 | 2022-03-14 | 株式会社Fuji | Anti-board work machine |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993016812A1 (en) * | 1992-02-27 | 1993-09-02 | Dymax Corporation | Ultrasonic spray coating system and method |
US6231673B1 (en) * | 1999-01-22 | 2001-05-15 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
US6621157B1 (en) * | 1999-01-07 | 2003-09-16 | Alphasem Ag | Method and device for encapsulating an electronic component in particular a semiconductor chip |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
WO2010121190A1 (en) * | 2009-04-16 | 2010-10-21 | Tp Solar, Inc. A Corporation Of Ca | Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5271953A (en) * | 1991-02-25 | 1993-12-21 | Delco Electronics Corporation | System for performing work on workpieces |
US20070087131A1 (en) * | 2005-10-14 | 2007-04-19 | Hutchinson Gerald A | Methods of forming multilayer articles by surface treatment applications |
US20090263581A1 (en) * | 2008-04-16 | 2009-10-22 | Northeast Maritime Institute, Inc. | Method and apparatus to coat objects with parylene and boron nitride |
BE1019159A5 (en) * | 2010-01-22 | 2012-04-03 | Europlasma Nv | METHOD FOR DEPOSITING A EQUIVALENT NANOCOATING BY A LOW-PRESSURE PLASMA PROCESS |
-
2013
- 2013-06-18 EP EP13807362.2A patent/EP2862428A4/en not_active Withdrawn
- 2013-06-18 WO PCT/US2013/046371 patent/WO2013192209A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993016812A1 (en) * | 1992-02-27 | 1993-09-02 | Dymax Corporation | Ultrasonic spray coating system and method |
US6621157B1 (en) * | 1999-01-07 | 2003-09-16 | Alphasem Ag | Method and device for encapsulating an electronic component in particular a semiconductor chip |
US6231673B1 (en) * | 1999-01-22 | 2001-05-15 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
WO2010121190A1 (en) * | 2009-04-16 | 2010-10-21 | Tp Solar, Inc. A Corporation Of Ca | Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing |
Also Published As
Publication number | Publication date |
---|---|
WO2013192209A2 (en) | 2013-12-27 |
EP2862428A2 (en) | 2015-04-22 |
WO2013192209A3 (en) | 2015-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20141222 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SORENSON, MAX Inventor name: NAYLOR, JAMES, KENT Inventor name: COX, DANA Inventor name: CHASON, MARC, KENNETH Inventor name: RAE, ALAN Inventor name: STEVENS, BLAKE |
|
R17D | Deferred search report published (corrected) |
Effective date: 20150618 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: NAYLOR, JAMES, KENT Inventor name: SORENSON, MAX Inventor name: CHASON, MARC, KENNETH Inventor name: COX, DANA Inventor name: STEVENS, BLAKE Inventor name: RAE, ALAN |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20160520 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 13/00 20060101AFI20160513BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/67 20060101AFI20190830BHEP |
|
INTG | Intention to grant announced |
Effective date: 20191010 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20200221 |