EP2862428A4 - Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique - Google Patents

Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique

Info

Publication number
EP2862428A4
EP2862428A4 EP13807362.2A EP13807362A EP2862428A4 EP 2862428 A4 EP2862428 A4 EP 2862428A4 EP 13807362 A EP13807362 A EP 13807362A EP 2862428 A4 EP2862428 A4 EP 2862428A4
Authority
EP
European Patent Office
Prior art keywords
apparatuses
systems
methods
electronic device
device assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13807362.2A
Other languages
German (de)
English (en)
Other versions
EP2862428A2 (fr
Inventor
Max Sorenson
Blake Stevens
Alan Rae
Marc Kenneth Chason
Dana Cox
James Kent Naylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HZO Inc
Original Assignee
HZO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/736,753 external-priority patent/US9426936B2/en
Priority claimed from US13/849,790 external-priority patent/US11060183B2/en
Application filed by HZO Inc filed Critical HZO Inc
Publication of EP2862428A2 publication Critical patent/EP2862428A2/fr
Publication of EP2862428A4 publication Critical patent/EP2862428A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
EP13807362.2A 2012-06-18 2013-06-18 Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique Withdrawn EP2862428A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261660808P 2012-06-18 2012-06-18
US13/736,753 US9426936B2 (en) 2012-01-10 2013-01-08 Systems for assembling electronic devices with internal moisture-resistant coatings
US201361615172P 2013-03-23 2013-03-23
US13/849,790 US11060183B2 (en) 2012-03-23 2013-03-25 Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
PCT/US2013/046371 WO2013192209A2 (fr) 2012-06-18 2013-06-18 Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique

Publications (2)

Publication Number Publication Date
EP2862428A2 EP2862428A2 (fr) 2015-04-22
EP2862428A4 true EP2862428A4 (fr) 2016-06-22

Family

ID=49769677

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13807362.2A Withdrawn EP2862428A4 (fr) 2012-06-18 2013-06-18 Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique

Country Status (2)

Country Link
EP (1) EP2862428A4 (fr)
WO (1) WO2013192209A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6754974B2 (ja) * 2017-06-16 2020-09-16 パナソニックＩｐマネジメント株式会社 設備要素修理管理システムおよび設備要素修理管理方法
JP2019003460A (ja) * 2017-06-16 2019-01-10 パナソニックＩｐマネジメント株式会社 設備要素保守管理システムおよび設備要素保守管理方法
WO2019239510A1 (fr) * 2018-06-13 2019-12-19 株式会社Ｆｕｊｉ Machine de travail de substrat

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016812A1 (fr) * 1992-02-27 1993-09-02 Dymax Corporation Procede et systeme d'application d'un revetement par pulverisation aux ultrasons
US6231673B1 (en) * 1999-01-22 2001-05-15 Mitsubishi Denki Kabushiki Kaisha Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device
US6621157B1 (en) * 1999-01-07 2003-09-16 Alphasem Ag Method and device for encapsulating an electronic component in particular a semiconductor chip
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
WO2010121190A1 (fr) * 2009-04-16 2010-10-21 Tp Solar, Inc. A Corporation Of Ca Fours de diffusion employant des systèmes de transport de masse ultra faible et procédés de traitement de diffusion rapide de tranches

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271953A (en) * 1991-02-25 1993-12-21 Delco Electronics Corporation System for performing work on workpieces
CA2622023A1 (fr) * 2005-10-14 2007-04-26 Advanced Plastics Technologies Luxembourg S.A. Procedes d'elaboration d'articles multicouche par applications de traitement de surface
US20090263581A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene and boron nitride
BE1019159A5 (nl) * 2010-01-22 2012-04-03 Europlasma Nv Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016812A1 (fr) * 1992-02-27 1993-09-02 Dymax Corporation Procede et systeme d'application d'un revetement par pulverisation aux ultrasons
US6621157B1 (en) * 1999-01-07 2003-09-16 Alphasem Ag Method and device for encapsulating an electronic component in particular a semiconductor chip
US6231673B1 (en) * 1999-01-22 2001-05-15 Mitsubishi Denki Kabushiki Kaisha Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
WO2010121190A1 (fr) * 2009-04-16 2010-10-21 Tp Solar, Inc. A Corporation Of Ca Fours de diffusion employant des systèmes de transport de masse ultra faible et procédés de traitement de diffusion rapide de tranches

Also Published As

Publication number Publication date
WO2013192209A2 (fr) 2013-12-27
EP2862428A2 (fr) 2015-04-22
WO2013192209A3 (fr) 2015-06-18

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