BR112012018071A2 - método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão - Google Patents

método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão

Info

Publication number
BR112012018071A2
BR112012018071A2 BR112012018071A BR112012018071A BR112012018071A2 BR 112012018071 A2 BR112012018071 A2 BR 112012018071A2 BR 112012018071 A BR112012018071 A BR 112012018071A BR 112012018071 A BR112012018071 A BR 112012018071A BR 112012018071 A2 BR112012018071 A2 BR 112012018071A2
Authority
BR
Brazil
Prior art keywords
conformable
nanocoat
low pressure
plasma process
pressure plasma
Prior art date
Application number
BR112012018071A
Other languages
English (en)
Inventor
Filip Legein
Original Assignee
Europlasma Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europlasma Nv filed Critical Europlasma Nv
Publication of BR112012018071A2 publication Critical patent/BR112012018071A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00—Halogenated polymers
    • B05D2506/10—Fluorinated polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
  • Materials For Medical Uses (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

patente de invenção: "método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão". a presente invenção refere-se a um nanorrevestimento conformável aplicado através de um processo de plasma de baixa pressão. a invenção também refere-se a um método para a fabricação de tal nanorrevestimento conformável sobre uma namoestrutura tridimensional, especificamente uma estrutura tridimensional que contenha elementos eletricamente condutores e não condutores.
BR112012018071A 2010-01-22 2011-01-21 método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão BR112012018071A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
PCT/EP2011/000242 WO2011089009A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process

Publications (1)

Publication Number Publication Date
BR112012018071A2 true BR112012018071A2 (pt) 2016-05-03

Family

ID=42289590

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012018071A BR112012018071A2 (pt) 2010-01-22 2011-01-21 método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão

Country Status (14)

Country Link
US (1) US20120308762A1 (pt)
EP (1) EP2525922A1 (pt)
JP (1) JP2013517382A (pt)
KR (1) KR20130000373A (pt)
CN (1) CN102821873A (pt)
AU (1) AU2011208879B2 (pt)
BE (1) BE1019159A5 (pt)
BR (1) BR112012018071A2 (pt)
CA (1) CA2786855A1 (pt)
CL (1) CL2012001954A1 (pt)
MX (1) MX2012008415A (pt)
NZ (1) NZ601365A (pt)
SG (1) SG182542A1 (pt)
WO (1) WO2011089009A1 (pt)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
GB2489761B (en) * 2011-09-07 2015-03-04 Europlasma Nv Surface coatings
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
TWI585233B (zh) * 2012-03-06 2017-06-01 辛柏朗有限公司 經塗佈之電總成
CN104334287A (zh) 2012-03-23 2015-02-04 Hzo股份有限公司 用于将保护覆层施加至电子装置组件的设备、系统以及方法
GB2494946B (en) * 2012-05-11 2013-10-09 Europlasma Nv Surface coatings
JP2014522543A (ja) 2012-06-18 2014-09-04 エイチズィーオー・インコーポレーテッド 完全に組み立てられている電子デバイスの内部表面へ保護被覆を塗工するためのシステム及び方法
EP2862428A4 (en) * 2012-06-18 2016-06-22 Hzo Inc DEVICES, SYSTEMS AND METHOD FOR PROTECTING ARRANGEMENTS OF ELECTRONIC DEVICES
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
AU2013328747A1 (en) * 2012-10-09 2015-05-28 Europlasma Nv Apparatus and method for applying surface coatings
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
EP2780935A4 (en) 2013-01-08 2015-11-11 Hzo Inc REMOVAL OF SELECTED PARTS FROM SUBSTRATE PROTECTIVE COATINGS
US9002041B2 (en) 2013-05-14 2015-04-07 Logitech Europe S.A. Method and apparatus for improved acoustic transparency
BE1021288B1 (nl) * 2013-10-07 2015-10-20 Europlasma Nv Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
CN104179011B (zh) * 2014-07-18 2016-08-24 青岛纺联控股集团有限公司 纺织品纳米等离子防水处理方法
CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
CN105047514B (zh) * 2015-07-27 2017-06-13 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
JP6593903B2 (ja) * 2016-01-19 2019-10-23 華為技術有限公司 電子デバイスのための防水方法および装置、並びに電子デバイス
US20200323707A1 (en) * 2016-04-29 2020-10-15 Jae-ho RHO Absorbent product having nano-coating layer, and manufacturing method therefor
US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
GB201610481D0 (en) * 2016-06-14 2016-08-03 Surface Innovations Ltd Coating
CN107058979B (zh) * 2017-01-23 2018-05-11 江苏菲沃泰纳米科技有限公司 一种防水耐电击穿涂层的制备方法
CN106868473B (zh) * 2017-01-23 2018-07-13 江苏菲沃泰纳米科技有限公司 一种梯度递减结构防液涂层的制备方法
US11742186B2 (en) 2017-05-21 2023-08-29 Jiangsu Favored Nanotechnology Co., LTD Multi-functional protective coating
CN107177835B (zh) * 2017-05-21 2018-06-19 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107217243B (zh) * 2017-05-21 2018-07-13 江苏菲沃泰纳米科技有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107904574A (zh) * 2017-10-27 2018-04-13 中国船舶重工集团公司第七二三研究所 一种基于海上复杂环境的纳米防护涂层涂覆方法
IT201900019760A1 (it) 2019-10-24 2021-04-24 Saati Spa Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento.
FI3880335T3 (fi) 2019-10-24 2023-05-02 Komposiittisuodatinmateriaalin valmistusmenetelmä ja tällä menetelmällä valmistettu komposiittisuodatinmateriaali
JP2022553710A (ja) 2019-10-24 2022-12-26 サーティ・エッセ・ピ・ア 複合フィルタ材の製造方法、及び該製造方法によって得られた複合フィルタ材
US20230242788A1 (en) * 2020-06-09 2023-08-03 Jiangsu Favored Nanotechnology Co., Ltd. Protective coating and preparation method therefor
CN113275217B (zh) * 2021-05-18 2022-06-24 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法
CN113365433B (zh) * 2021-06-07 2024-02-02 深圳奥拦科技有限责任公司 Pcba板表面派瑞林膜层的除去方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52116897A (en) * 1976-03-29 1977-09-30 Matsushita Electric Ind Co Ltd Forming transparent conductive film on organic substrate
JPS6047024B2 (ja) 1981-07-31 1985-10-19 日産自動車株式会社 プレス型における製品押出装置
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
US4606929A (en) * 1984-12-20 1986-08-19 Petrakov Vladimir P Method of ionized-plasma spraying and apparatus for performing same
EP0187595A3 (en) 1984-12-24 1987-09-30 Sangamo Weston, Inc. Protective coating for electrolytic capacitor
JPS6277463A (ja) * 1985-09-30 1987-04-09 Sumitomo Bakelite Co Ltd 耐熱性樹脂フイルム用真空ロ−ルコ−タ−
JPS63311794A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPH0196364A (ja) * 1987-10-07 1989-04-14 Teijin Ltd 高分子樹脂基板の水分除去方法
JPH02102038A (ja) * 1988-10-12 1990-04-13 Furukawa Alum Co Ltd 耐食性金属板
EP0492828A1 (en) 1990-12-26 1992-07-01 Dow Corning Corporation Mixture of adhesion additives useful in UV curable compositions and compositions containing same
JPH04296337A (ja) * 1991-03-26 1992-10-20 Matsushita Electric Works Ltd 高分子膜の製造方法
US5618619A (en) * 1994-03-03 1997-04-08 Monsanto Company Highly abrasion-resistant, flexible coatings for soft substrates
SG48462A1 (en) * 1995-10-26 1998-04-17 Ibm Lead protective coating composition process and structure thereof
JP4260907B2 (ja) * 1995-12-12 2009-04-30 東洋紡績株式会社 フィルム積層体
US5843239A (en) * 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6127038A (en) 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
DE10114897A1 (de) * 2001-03-26 2002-10-24 Infineon Technologies Ag Elektronisches Bauteil
CN100340595C (zh) * 2003-01-30 2007-10-03 欧洲等离子公司 在整个结构中具有开孔结构的制品表面上提供涂层的方法及该方法的应用
US7202172B2 (en) * 2003-12-05 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronic device having disposable spacer
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
JP4924038B2 (ja) * 2004-11-02 2012-04-25 旭硝子株式会社 フルオロカーボン膜の製造方法
GB2434369B (en) * 2006-01-20 2010-08-25 P2I Ltd Plasma coated electrical or electronic devices
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5223325B2 (ja) * 2007-12-21 2013-06-26 住友金属鉱山株式会社 金属被覆ポリエチレンナフタレート基板とその製造方法
GB0800305D0 (en) * 2008-01-09 2008-02-20 P2I Ltd Abatement apparatus and processing method

Also Published As

Publication number Publication date
US20120308762A1 (en) 2012-12-06
NZ601365A (en) 2015-03-27
BE1019159A5 (nl) 2012-04-03
CN102821873A (zh) 2012-12-12
SG182542A1 (en) 2012-08-30
AU2011208879B2 (en) 2015-12-17
KR20130000373A (ko) 2013-01-02
JP2013517382A (ja) 2013-05-16
EP2525922A1 (en) 2012-11-28
AU2011208879A1 (en) 2012-08-09
CL2012001954A1 (es) 2013-02-01
MX2012008415A (es) 2012-08-15
WO2011089009A1 (en) 2011-07-28
CA2786855A1 (en) 2011-07-28

Similar Documents

Publication Publication Date Title
BR112012018071A2 (pt) método para a aplicação de um nanorrevestimento conformável por meio de um processo de plasma de baixa pressão
BR112012025245A2 (pt) composição de poliolefina semicondutora compreendendo carga condutiva
BR112014016393A2 (pt) processo para produzir um sistema eletroluminescente conformado
BR112014012050A2 (pt) método para produção de uma escova de dentes que tem uma cavidade interna
KR101882035B1 (ko) 흑연 박리에 의한 그래핀 형성 방법
BR112013030830A2 (pt) processo de preparação de composto da fórmula (i) e estetrol obtido diretamente por meio do processo
SG157311A1 (en) Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby
MY170302A (en) Process for the preparation of an aqueous solution comprising at least one earth alkali hydrogen carbonate and its use
WO2011097470A3 (en) Photosensitive ink compositions and transparent conductors and method of using the same
BR112013032786A2 (pt) restauração dentária, método para a sua produção e lingote
BR112014013648A8 (pt) mancal deslizante
WO2013117588A3 (en) A thin film for a lead for brain applications
BR112014018032A2 (pt) método para produzir uma composição
BR112014024493A2 (pt) método para a produção enzimática de isoprenol usando mevalonato como substrato
BR112013001109A2 (pt) composição que contém galacto-oligossacarídeos e método para produzi-la
GB2503838A (en) Electrolytic exfoliation of graphite
BR112014024324A2 (pt) processo para fabricar um substrato de aço revestido recozido de recuperação para aplicações de embalagem e produto de aço de embalagem produzido desse modo
ZA201502681B (en) Composition for an organic gel and the pyrolysate thereof, production method thereof, electrode formed by the pyrolysate and supercapacitor containing same
BR112014004380A2 (pt) cabo compreendendo uma composição de polímero reticulável de silano
BR112014002068A2 (pt) método para preparação de grafeno funcionalizado
BR112015024859A2 (pt) processo e intermediários para a preparação de pregabalina
BR112014000574A2 (pt) processo para a produção de tc-99m
BR112013016353A2 (pt) processo de produção de hidrogênio
BR112014031936A2 (pt) reator e processo para preparar sulfureto de hidrogênio
BR112014031494A2 (pt) processo de fabricação por moldagem de uma espuma em liga de alumínio

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]