SG178687A1 - Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system - Google Patents

Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system Download PDF

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Publication number
SG178687A1
SG178687A1 SG2011059060A SG2011059060A SG178687A1 SG 178687 A1 SG178687 A1 SG 178687A1 SG 2011059060 A SG2011059060 A SG 2011059060A SG 2011059060 A SG2011059060 A SG 2011059060A SG 178687 A1 SG178687 A1 SG 178687A1
Authority
SG
Singapore
Prior art keywords
resin
substrate
cooling
sealed
sealed substrate
Prior art date
Application number
SG2011059060A
Other languages
English (en)
Inventor
Naoki Takada
Kohei Izutani
Keita Mizuma
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG178687A1 publication Critical patent/SG178687A1/en

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Health & Medical Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG2011059060A 2010-08-27 2011-08-17 Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system SG178687A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010190946A JP5411094B2 (ja) 2010-08-27 2010-08-27 樹脂封止済基板の冷却装置、冷却方法及び搬送装置、並びに樹脂封止装置

Publications (1)

Publication Number Publication Date
SG178687A1 true SG178687A1 (en) 2012-03-29

Family

ID=45820973

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011059060A SG178687A1 (en) 2010-08-27 2011-08-17 Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system

Country Status (6)

Country Link
JP (1) JP5411094B2 (ja)
KR (1) KR101614970B1 (ja)
CN (1) CN102380937B (ja)
MY (1) MY153473A (ja)
SG (1) SG178687A1 (ja)
TW (1) TWI542462B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102626978B (zh) * 2012-04-28 2014-06-25 天津博信汽车零部件有限公司 注塑成型塑料制品定型用下芯块及定型装置
TWI602267B (zh) * 2014-06-13 2017-10-11 矽品精密工業股份有限公司 封裝結構及其製法
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Towa株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
CN106965355A (zh) * 2017-05-12 2017-07-21 浙江帝仕电子科技有限公司 一种合模成型机
JP6804409B2 (ja) * 2017-08-04 2020-12-23 Towa株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6923423B2 (ja) * 2017-11-21 2021-08-18 Towa株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143833A (en) * 1981-02-27 1982-09-06 Nec Corp Manufacture of semiconductor device
JP2669698B2 (ja) * 1989-10-16 1997-10-29 アピックヤマダ株式会社 モールドパッケージおよびリードフレームの反り防止装置
JP3099707B2 (ja) * 1995-11-30 2000-10-16 日本電気株式会社 半導体装置の樹脂封止装置
JPH11329925A (ja) * 1998-05-11 1999-11-30 Dainippon Screen Mfg Co Ltd 基板熱処理装置および基板熱処理方法
JP3837736B2 (ja) * 2001-07-02 2006-10-25 ウシオ電機株式会社 レジスト硬化装置のワークステージ
JP4470199B2 (ja) * 2003-09-25 2010-06-02 Smc株式会社 半導体基板の温度調節装置
JP4403960B2 (ja) * 2004-12-15 2010-01-27 株式会社デンソー 樹脂成形品の取出し装置
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Towa株式会社 電子部品の樹脂封止成形方法及び装置
JP5156579B2 (ja) * 2008-10-31 2013-03-06 Towa株式会社 基板の装着・取出装置

Also Published As

Publication number Publication date
MY153473A (en) 2015-02-13
JP2012045839A (ja) 2012-03-08
JP5411094B2 (ja) 2014-02-12
TW201213081A (en) 2012-04-01
KR20120020089A (ko) 2012-03-07
CN102380937B (zh) 2015-08-05
KR101614970B1 (ko) 2016-04-29
CN102380937A (zh) 2012-03-21
TWI542462B (zh) 2016-07-21

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