SG178687A1 - Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system - Google Patents
Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system Download PDFInfo
- Publication number
- SG178687A1 SG178687A1 SG2011059060A SG2011059060A SG178687A1 SG 178687 A1 SG178687 A1 SG 178687A1 SG 2011059060 A SG2011059060 A SG 2011059060A SG 2011059060 A SG2011059060 A SG 2011059060A SG 178687 A1 SG178687 A1 SG 178687A1
- Authority
- SG
- Singapore
- Prior art keywords
- resin
- substrate
- cooling
- sealed
- sealed substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000001816 cooling Methods 0.000 title claims abstract description 162
- 238000007789 sealing Methods 0.000 title claims description 44
- 238000000034 method Methods 0.000 title claims description 36
- 238000000465 moulding Methods 0.000 claims description 16
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010190946A JP5411094B2 (ja) | 2010-08-27 | 2010-08-27 | 樹脂封止済基板の冷却装置、冷却方法及び搬送装置、並びに樹脂封止装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG178687A1 true SG178687A1 (en) | 2012-03-29 |
Family
ID=45820973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011059060A SG178687A1 (en) | 2010-08-27 | 2011-08-17 | Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5411094B2 (ja) |
| KR (1) | KR101614970B1 (ja) |
| CN (1) | CN102380937B (ja) |
| MY (1) | MY153473A (ja) |
| SG (1) | SG178687A1 (ja) |
| TW (1) | TWI542462B (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102626978B (zh) * | 2012-04-28 | 2014-06-25 | 天津博信汽车零部件有限公司 | 注塑成型塑料制品定型用下芯块及定型装置 |
| TWI602267B (zh) * | 2014-06-13 | 2017-10-11 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
| JP6284996B1 (ja) * | 2016-11-04 | 2018-02-28 | Ｔｏｗａ株式会社 | 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法 |
| CN106965355A (zh) * | 2017-05-12 | 2017-07-21 | 浙江帝仕电子科技有限公司 | 一种合模成型机 |
| JP6804409B2 (ja) * | 2017-08-04 | 2020-12-23 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
| JP6923423B2 (ja) * | 2017-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | 搬送装置、樹脂成形装置及び樹脂成形品の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143833A (en) * | 1981-02-27 | 1982-09-06 | Nec Corp | Manufacture of semiconductor device |
| JP2669698B2 (ja) * | 1989-10-16 | 1997-10-29 | アピックヤマダ株式会社 | モールドパッケージおよびリードフレームの反り防止装置 |
| JP3099707B2 (ja) * | 1995-11-30 | 2000-10-16 | 日本電気株式会社 | 半導体装置の樹脂封止装置 |
| JPH11329925A (ja) * | 1998-05-11 | 1999-11-30 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置および基板熱処理方法 |
| JP3837736B2 (ja) * | 2001-07-02 | 2006-10-25 | ウシオ電機株式会社 | レジスト硬化装置のワークステージ |
| JP4470199B2 (ja) * | 2003-09-25 | 2010-06-02 | Ｓｍｃ株式会社 | 半導体基板の温度調節装置 |
| JP4403960B2 (ja) * | 2004-12-15 | 2010-01-27 | 株式会社デンソー | 樹脂成形品の取出し装置 |
| JP4084844B2 (ja) * | 2005-09-27 | 2008-04-30 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP5156579B2 (ja) * | 2008-10-31 | 2013-03-06 | Ｔｏｗａ株式会社 | 基板の装着・取出装置 |
-
2010
- 2010-08-27 JP JP2010190946A patent/JP5411094B2/ja active Active
-
2011
- 2011-08-16 TW TW100129146A patent/TWI542462B/zh active
- 2011-08-17 SG SG2011059060A patent/SG178687A1/en unknown
- 2011-08-18 MY MYPI2011003881A patent/MY153473A/en unknown
- 2011-08-26 CN CN201110248224.0A patent/CN102380937B/zh active Active
- 2011-08-28 KR KR1020110086134A patent/KR101614970B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN102380937A (zh) | 2012-03-21 |
| TWI542462B (zh) | 2016-07-21 |
| TW201213081A (en) | 2012-04-01 |
| MY153473A (en) | 2015-02-13 |
| KR20120020089A (ko) | 2012-03-07 |
| JP5411094B2 (ja) | 2014-02-12 |
| CN102380937B (zh) | 2015-08-05 |
| KR101614970B1 (ko) | 2016-04-29 |
| JP2012045839A (ja) | 2012-03-08 |
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