JPS57143833A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57143833A
JPS57143833A JP2908581A JP2908581A JPS57143833A JP S57143833 A JPS57143833 A JP S57143833A JP 2908581 A JP2908581 A JP 2908581A JP 2908581 A JP2908581 A JP 2908581A JP S57143833 A JPS57143833 A JP S57143833A
Authority
JP
Japan
Prior art keywords
resin
molded
mold
lead frame
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2908581A
Other languages
Japanese (ja)
Inventor
Mikio Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2908581A priority Critical patent/JPS57143833A/en
Publication of JPS57143833A publication Critical patent/JPS57143833A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent resin from deforming, by providing a structure to induce cooling gas between a mold for hermetic resin and a molded resin. CONSTITUTION:A lead frame 3 which mounts a semiconductor element 1 and furnishes an electrode mounting 2 is set to a carrier 5. Next, the carrier 5 is loaded to the lower case 7 of a hermetic resin mold. Next, the upper 9 and lower cases 7 of mold are contacted and pressurized. Hermatic resin is supplied and tightened. As soon as the resin is molded and the upper 9 and lower cases 7 are opened, a gas pressure switch 6 is input. A lead frame 14 is cooled by clean gas through a carrier gas inlet 4. Next, a knockout pin 15 at the bottom of a cavity 13 pushes up the molded resin. At the same time, clean gas flows into the cavity from a gas inlet 8. The molded lead frame is cooled.
JP2908581A 1981-02-27 1981-02-27 Manufacture of semiconductor device Pending JPS57143833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2908581A JPS57143833A (en) 1981-02-27 1981-02-27 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2908581A JPS57143833A (en) 1981-02-27 1981-02-27 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57143833A true JPS57143833A (en) 1982-09-06

Family

ID=12266504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2908581A Pending JPS57143833A (en) 1981-02-27 1981-02-27 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57143833A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149141A (en) * 1985-12-23 1987-07-03 Toshiba Mach Co Ltd Cooling apparatus for molded ic part
JPH0236039U (en) * 1988-09-01 1990-03-08
JP2012045839A (en) * 2010-08-27 2012-03-08 Towa Corp Cooling device of resin sealed substrate, cooling method, feed device, and resin sealing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149141A (en) * 1985-12-23 1987-07-03 Toshiba Mach Co Ltd Cooling apparatus for molded ic part
JPH0236039U (en) * 1988-09-01 1990-03-08
JP2012045839A (en) * 2010-08-27 2012-03-08 Towa Corp Cooling device of resin sealed substrate, cooling method, feed device, and resin sealing device

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