JPS6458631A - Container material molding equipment - Google Patents

Container material molding equipment

Info

Publication number
JPS6458631A
JPS6458631A JP62211611A JP21161187A JPS6458631A JP S6458631 A JPS6458631 A JP S6458631A JP 62211611 A JP62211611 A JP 62211611A JP 21161187 A JP21161187 A JP 21161187A JP S6458631 A JPS6458631 A JP S6458631A
Authority
JP
Japan
Prior art keywords
container material
frames
receiving part
seal receiving
supporting arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62211611A
Other languages
Japanese (ja)
Other versions
JPH0741891B2 (en
Inventor
Etsuo Shimamura
Sachinori Ito
Masayuki Kageyama
Isao Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP62211611A priority Critical patent/JPH0741891B2/en
Publication of JPS6458631A publication Critical patent/JPS6458631A/en
Publication of JPH0741891B2 publication Critical patent/JPH0741891B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Supplying Of Containers To The Packaging Station (AREA)
  • Making Paper Articles (AREA)

Abstract

PURPOSE:To peel container material positively when the container material has thermocompression-bonded on the supporting surface, by arranging a seal receiving part, which possesses a container material receiving surface, between a pair of frames of the supporting arm, and making this seal receiving part support the container material when it opposes to thermocompression bonding and cooling means, and making the seal receiving part in a dented state when it opposes to discharging means. CONSTITUTION:For the supporting arm 53, a seal receiving part 56 is arranged between a pair of frames 53a, 53a which are in parallel. This part 56 is pivotally supported on the supporting arm 53 via a supporting shaft 57, and is movable so that the container material receiving surface 56a can be approximately flush with the upper end surface of the frames 53a, 53a, and can give a denoted condition from these upper end surface of the frames 53a, 53a. At a cooling device 67, a cooling block decends, and ascends after obtaining a secure compression bonding state; at this time, the seal receiving part 56 decends and removes the container material receiving surface 56a from the container material 32, peels positively a part of the container material 32, which has been heat sealed to the surface 56a, and thus helps the container material 32 to be removed easily.
JP62211611A 1987-08-26 1987-08-26 Container material forming equipment Expired - Lifetime JPH0741891B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62211611A JPH0741891B2 (en) 1987-08-26 1987-08-26 Container material forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62211611A JPH0741891B2 (en) 1987-08-26 1987-08-26 Container material forming equipment

Publications (2)

Publication Number Publication Date
JPS6458631A true JPS6458631A (en) 1989-03-06
JPH0741891B2 JPH0741891B2 (en) 1995-05-10

Family

ID=16608627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62211611A Expired - Lifetime JPH0741891B2 (en) 1987-08-26 1987-08-26 Container material forming equipment

Country Status (1)

Country Link
JP (1) JPH0741891B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0768272B1 (en) * 1989-03-10 1995-07-26 Snow Brand Milk Products Co Ltd
JP2002001837A (en) * 2000-06-19 2002-01-08 Futagami Tekkosho:Kk Method for manufacturing deep and thin box
JP2009502672A (en) * 2006-02-10 2009-01-29 クルティコストルツィオーニ メッカニケ ソチエタ ペル アツィオーニ Blanks, boxes, devices, and methods for packaging elongated articles
JP2012509792A (en) * 2008-11-28 2012-04-26 エスアイジー テクノロジー アーゲー Method and apparatus for manufacturing a container-like composite package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0768272B1 (en) * 1989-03-10 1995-07-26 Snow Brand Milk Products Co Ltd
JP2002001837A (en) * 2000-06-19 2002-01-08 Futagami Tekkosho:Kk Method for manufacturing deep and thin box
JP2009502672A (en) * 2006-02-10 2009-01-29 クルティコストルツィオーニ メッカニケ ソチエタ ペル アツィオーニ Blanks, boxes, devices, and methods for packaging elongated articles
JP2012509792A (en) * 2008-11-28 2012-04-26 エスアイジー テクノロジー アーゲー Method and apparatus for manufacturing a container-like composite package

Also Published As

Publication number Publication date
JPH0741891B2 (en) 1995-05-10

Similar Documents

Publication Publication Date Title
JPH1065055A (en) Method for forming ball grid array
JPS6458631A (en) Container material molding equipment
JP2004200269A (en) Method and device for sealing and forming resin of electronic component
GR3007299T3 (en)
JP2831988B2 (en) Die cutting unit for molding plant for chocolate products, etc.
JPS6458695A (en) Drink dispenser
JPS57124599A (en) Powder molding method for magnetic material
JPS6418247A (en) Plastic sealed semiconductor device
JPS5527619A (en) Die bonding device
JPS5775434A (en) Resin sealing metal mold for semiconductor device
JPS57143833A (en) Manufacture of semiconductor device
EP0296672A3 (en) Jaw crusher
JPS53104171A (en) Mold for semiconductor device
JP3377433B2 (en) Molding equipment for resin sealing
JPH0621126A (en) Continuous semiconductor sealing apparatus
JPS6430237A (en) Manufacture of resin-sealed semiconductor device
JPH0966535A (en) Resin mold apparatus
JPS5717138A (en) Resin sealing device for semiconductor device
JPS6325011A (en) Method and mold device for transfer mold molding
JPS62267045A (en) Method and apparatus for detecting molten material dropping in precision casting
FR2399226A1 (en) Electric squeezer for citrous fruit - comprises juice collector with two spouts, and cone movably fixed in casing
JPH06151493A (en) Method of molding tape carrier package and transporting carrier used therefor
FR2623624B1 (en) METHOD AND DEVICE FOR DETERMINING THE FLOW CHARACTERISTICS OF A MATERIAL WITHIN A MOLD, DURING A MOLDING PROCESS
JPS6480031A (en) Manufacture of resin sealed semiconductor device
TW342319B (en) Process for producing a breast pad containing magnetic particles