JPS5527619A - Die bonding device - Google Patents

Die bonding device

Info

Publication number
JPS5527619A
JPS5527619A JP10056878A JP10056878A JPS5527619A JP S5527619 A JPS5527619 A JP S5527619A JP 10056878 A JP10056878 A JP 10056878A JP 10056878 A JP10056878 A JP 10056878A JP S5527619 A JPS5527619 A JP S5527619A
Authority
JP
Japan
Prior art keywords
container
semiconductor
supported
supersonic
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10056878A
Other languages
Japanese (ja)
Inventor
Toru Tachikawa
Toshinobu Banjo
Eizo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10056878A priority Critical patent/JPS5527619A/en
Publication of JPS5527619A publication Critical patent/JPS5527619A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To insure perfect wax material bonding without causing damage to the terminals of semiconductor elements, by vibrating the side of a semiconductor device container at a frequency in the supersonic region.
CONSTITUTION: Shaft 10 is supported by bearing 11 at the lower part of heating device 5. Its lower part is integrated with supersonic oscillator 12, which is connected to supersonic wave generator 13. Consequently, when supersonic oscillator 12 oscillates vertically, semiconductor device container 1, which is supported by supporting mechanism 4, oscillates in the vertical direction due to the oscillation of heating device 5. By means of holder 6, semiconductor element 3 is supported, transported and mounted on container 1. By this, repeated displacement is given between element 3 and container without causing damage to terminal P of semiconductor element 3, and thereby, element 3 and waxing material 4, and waxing material 4 and semiconductor element device part 2 are brought into close contact and bonded perfectly.
COPYRIGHT: (C)1980,JPO&Japio
JP10056878A 1978-08-17 1978-08-17 Die bonding device Pending JPS5527619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10056878A JPS5527619A (en) 1978-08-17 1978-08-17 Die bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10056878A JPS5527619A (en) 1978-08-17 1978-08-17 Die bonding device

Publications (1)

Publication Number Publication Date
JPS5527619A true JPS5527619A (en) 1980-02-27

Family

ID=14277506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10056878A Pending JPS5527619A (en) 1978-08-17 1978-08-17 Die bonding device

Country Status (1)

Country Link
JP (1) JPS5527619A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161648A (en) * 1980-05-16 1981-12-12 Hitachi Ltd Heating block for pellet fitting device
JPS58215039A (en) * 1982-06-07 1983-12-14 Kumamoto Nippon Denki Kk Manufacturing device of semiconductor device
JPS59135736A (en) * 1983-01-24 1984-08-04 Rohm Co Ltd Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161648A (en) * 1980-05-16 1981-12-12 Hitachi Ltd Heating block for pellet fitting device
JPS58215039A (en) * 1982-06-07 1983-12-14 Kumamoto Nippon Denki Kk Manufacturing device of semiconductor device
JPS59135736A (en) * 1983-01-24 1984-08-04 Rohm Co Ltd Manufacture of semiconductor device

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