JPS54125971A - Extra-hard mold - Google Patents

Extra-hard mold

Info

Publication number
JPS54125971A
JPS54125971A JP3296278A JP3296278A JPS54125971A JP S54125971 A JPS54125971 A JP S54125971A JP 3296278 A JP3296278 A JP 3296278A JP 3296278 A JP3296278 A JP 3296278A JP S54125971 A JPS54125971 A JP S54125971A
Authority
JP
Japan
Prior art keywords
cavity
ultra
hard alloy
block
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3296278A
Other languages
Japanese (ja)
Other versions
JPS6036100B2 (en
Inventor
Toshikatsu Tsunehiro
Nobuaki Ineya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3296278A priority Critical patent/JPS6036100B2/en
Publication of JPS54125971A publication Critical patent/JPS54125971A/en
Publication of JPS6036100B2 publication Critical patent/JPS6036100B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate growth of the resin flash as well as to facilitate the exfoliation for the lead frame which is resin-sealed the cavity formed by fitting the ultra- hard alloy cavity insert into the ultra-hard alloy cavity block.
CONSTITUTION: Ultra-hard alloy cavity insert 161 and 162 containing ejector pin hole 71 and 72 plus ejector pin escape 81 and 82 each are fitted into ultra-hard alloy cavity block 0 in order to form die cavity 41 and 42 respectively. At the same time, pressure sleeve 151 and 152 are provided at the lower side inside cavity 41 and 42 each. With the elasticity of sleeve 151 and 152, the fitting is reinforced between insert 161 and 162. Thus, the lead frame to which the semiconductor device is provided is placed on cavity block 0 thus formed via the guide pin, and the resin is injected from runner 50 provided at the center of block 0 and then permeated into cavity 41 and 42 to seal the frame up.
COPYRIGHT: (C)1979,JPO&Japio
JP3296278A 1978-03-24 1978-03-24 Carbide mold type Expired JPS6036100B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3296278A JPS6036100B2 (en) 1978-03-24 1978-03-24 Carbide mold type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3296278A JPS6036100B2 (en) 1978-03-24 1978-03-24 Carbide mold type

Publications (2)

Publication Number Publication Date
JPS54125971A true JPS54125971A (en) 1979-09-29
JPS6036100B2 JPS6036100B2 (en) 1985-08-19

Family

ID=12373536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3296278A Expired JPS6036100B2 (en) 1978-03-24 1978-03-24 Carbide mold type

Country Status (1)

Country Link
JP (1) JPS6036100B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350416U (en) * 1989-09-25 1991-05-16

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10970064B1 (en) 2020-07-28 2021-04-06 Bank Of America Corporation Dynamically updating a software program to resolve errors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350416U (en) * 1989-09-25 1991-05-16

Also Published As

Publication number Publication date
JPS6036100B2 (en) 1985-08-19

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