201213081 六、發明說明： 【發明所屬之技術領域】 本發明關於一種用於冷卻樹脂密封基板的方法和系統 以及有關一種用於遞送此基板的系統，該樹脂密封基板係 藉由將裝配於一基板上的電子部件或相似元件進行樹脂密 封而形成。本發明亦關於一種用於將裝設在基板上的電子 元件或類似的元件樹脂密封的系統。 【先前技術】 具有由上模具和下模具組成的模具的一種樹脂密封系 統，習知被使用在將裝設於基板上的電子元件或類似元件 進行模製或是樹脂密封《不論上模具或下模具都具有用於 接收大量樹脂的模穴。在樹脂密封程序中，具有裝設於其 上的電子部件或相似元件的基板被夾在上模具和下模具之 間，而電子部件或相似元件則被容納於模穴中，隨後將已 在高溫下熔化的樹脂材料填充到模穴中並且固化。（此種 加工被稱為轉移模製（transfer m〇lding))。在樹脂材料固化 後，將樹脂密封基板從樹脂密封模具輪送指定用於後處理 的預定位置，例如將基板存放於一機架中或切割基板。 此種模製和樹脂密封加工需要一個用於在樹脂密封加 工之前和之後遞送基板的系統，文獻1中揭露了此種 遞送系統的例子。此遞送系統包括一可水準移動的遞送 盤，其可插人到上模具和下模具之間，或從上模具和下模 具之間移走’ -基板載體裝配於遞送盤的孔t，且在孔中 201213081 可垂直的移動。當可在基板載體的下側提供-可支樓樹脂 密封基板的基板支標部分時，也可在基板㈣的上側提供 在樹月曰密封加工之前設置基板的基板設置部分。一抽吸 支樓裝置用於通過基板載體低側的基板支樓部分内的抽吸 來支撐樹脂密封基板。 已、左說明的，電子部件或相似元件的樹脂密封是 =過將已在高溫下溶化的樹脂硬化來達成。因&，在樹脂 密封加工完成後，基板依然是熱的。樹脂材料的熱收縮係 數不同於基板材料的熱收縮係數。因&，如果將從模子中 移開的樹脂密封基板置放在空氣中，樹脂密封基板可能會 因為自然、冷卻而變f。樹脂密封基板的f曲會造成很多問 題比如，聲曲的基板不能平穩的存放於固持器内或不能 被準確的切割。 作為一種解決此問題的方案，專利文獻2中揭露了一 種防止f曲裝置。此裝置具有一提供於樹脂密封系統内的 散熱盤1過將模製和樹脂密封產品夾在散熱盤和基板設 P刀之間且在此種狀態下將其冷卻，來防止所述產品的 彎曲。 專利文獻 1 : JP-Α 201〇_1〇5326 專利文獻 2 : JP_A 3_129864 在專利文獻2所述的裝置中，必須在一段時間内採用 相當的壓力，以將樹脂密封基板保持在被夾在中間的狀 態。返可能會對產品造成非預期的影響，例如損壞在樹脂 在封部分内的電子部件或相似元件或造成樹脂密封基板外 201213081 部形狀的變形。 【發明内容】 本發明所欲解決的問題 本發明提供一種用於冷卻樹脂密封基板的方法和系統 來解決上述問題，所述樹脂密封基板上有經由模製或是樹 脂密合的電子部件或相似元件。所述方法或系統能夠在冷 卻樹脂密封基板時，減少對電子部件或相似組件的負面影 響’且還能防止基板的彎曲。本發明還提供了—種包括前 述的冷卻系統的用於遞送樹脂密封基板的系統，和一種包 括相同冷卻系統的樹脂密封系統。 用於解決問題的手段 根據本發明的第一態樣，一種旨在解決上述問題的冷 部樹脂密封基板的系統係為一種基板冷卻系統，其用於冷 部一樹脂密封基板，該基板係藉由樹脂密封模具將裝設在 基板上的電子部件進行模製和樹脂密，該系統包括： a) 一固持器，用於固持所述樹脂密封基板； b) 一吸引裝置，設於所述固持器内，用於將樹脂密封基 板吸引到所述固持器；和 冷卻。P >(牛，设置一位置處，該吸引裝置將樹脂密封 基板朝向該位置吸引，所述冷卻部件具有一與所述樹脂密 封基板緊密接觸的接觸面。 在用於冷卻根據本發明第一態樣的樹脂密封基板的系 201213081 統的其中形式中，所述吸捭驻要—& ^ % $ + 及持裝置包括一空氣抽吸裝置， 用於從樹脂密封基板和冷 p °p件的接觸面之間的空間抽吸 空氣。 在用於冷卻根據本發明 統的另一種形式中： 第一態樣的樹脂密封基板的系 所述吸引裝置包括： 一彈性支座，提供於冷卻部件之上，用於當樹脂密封 基板被吸持時，通過與樹脂密封基板接觸而在樹脂密封基 板和所述接觸面之間形成—個或多個封閉空間；和 一個或多個通孔，每個所述通孔提供於前述—個或多 個封閉空間㈣冷卻部件内，且穿過所述冷卻部件的厚度 方向；和 斤述二氣抽吸裝置通過所述一個或多個通孔從所述一 個或多個封閉空間抽吸空氣。 根據本發明第一態樣，用於冷卻樹脂密封基板的系統 的再一種形式中，所述系統進一步包括： d ) —冷卻裝置，用於冷卻所述冷卻部件。 根據本發明第一態樣，用於冷卻樹脂密封基板的系統 的另一種形式中，所述冷卻裝置為一用於將氣流輸送到冷 卻部件的鼓風機。 根據本發明第一態樣，用於冷卻樹脂密封基板的系統 的另一種形式中，所述冷卻部件具有一個或多個形成於所 述接觸面上的槽，且所述鼓風機向所述一個或多個槽中提 供氣流。 201213081 根據本發明第一態樣，用於冷卻樹脂密封基板的系統 的另一種形式中，所述冷卻裝置包括一連接到冷卻部件上 的帕爾帖裝置。 根據本發明第一態樣，用於冷卻樹脂密封基板的系統 的另一種形式中，所述冷卻部件的接觸面被設計以使樹脂 密封基板的樹脂密封部分可與其緊密接觸。 本發明的第二態樣提供了一種用於遞送樹脂密封基板 的基板遞送系、統，其特徵在於，包括前述任—個用於冷卻 根據本發明第一態樣的樹脂密封基板的系統。 本發明的第三態樣提供一種用於將安裝於基板上電子 部件進行模製和樹脂密封的樹 τ曰在封系統，该系統特徵在 於’其包括前述任一個用^、人，、 脂密封基板的系統。於冷幾本發明第-態樣的樹 =明的第四隸提供了—種詩冷料脂密封基板 法，該基板係藉由一樹脂密封模具而將裝設 在基本上的電子部件進行模製和樹 包括如下步驟·· 表風》亥方法 〜回付所述樹月旨 b)通過將被支#的_密封基板吸 所述樹脂密封基板與所述冷卻部件的=—卩。卩件以使 而對所述樹脂密封基板進行冷卻。緊讀觸’從 根據本發明第四態樣，用於冷卻樹 的一種形式令，所诚a”站 在封基板的方法 流到冷卻部件的步驟ΓΡ f脂密封基板的步驟包括輸送氣 201213081 根據本發明第 的另一種形式中， 脂密封基板的樹脂 接觸的步驟。 四態樣，用於冷卻樹脂密封基板的方法 所述冷卻樹脂密封基板的步驟包括使樹 被封部分與所述冷卻部件的接觸面緊密 根據本發明第四能 ^ „旌 〜、樣，用於冷卻樹脂密封基板的方法 的另一種形式中，沐、+,、λ ,、 述、7部樹脂密封基板的步驟在遞送所 返樹脂密封基板時進行。 本發明的功效 用於冷卻樹脂密封基板的方法和系統中，樹 1=基板被吸持到冷卻部件的接觸面，以使樹脂密封基 板與冷卻部件緊密接觸，藉此從基板上抽吸熱量。因此本 冷部過程的進行不會讓樹脂密封基板彎曲，該彎曲是因基 與樹月曰之熱收縮係、數不同而產生。相較于現有技術中， 在w加工過程中向樹脂密封基板施加很大的壓力，本技 蚜可使模製和祕脂密封的電子部件上的負面影響最小化。 技術中’如果使樹脂密封基板的基板部分緊密接 觸於冷卻部件的接觸面，對於模製和樹 =面影響將會有很大程度的降低。相比之下電= μ脂密封基板的樹脂密封部分緊密接觸於冷卻部件的接觸 面由於熱里可直接從熱狀態中的樹脂密封部分中抽吸 出，所以冷卻效果會得到進一步改善。 δ提供了一用於從樹脂密封基板和冷卻部件的接觸面 之間抽吸空氣的空氣抽吸裝£ ’樹脂密封基板和冷卻部件 201213081 之間的接觸將會更加緊密，因此防彎曲效果和冷卻效果將 會得到改善。當一個或多個封閉空間形成於樹脂密封基板 和接觸面之間，樹脂密封基板和冷卻部件之間的接觸將會 更緊密，如此設計吸持裝置以使其可通過空氣吸持裝置從 封閉空間吸收空氣。 提供的冷卻裝置將進一步改善樹脂密封基板的冷卻效 果。 此外，當將根據本發明的用於冷卻樹脂密封基板的系 統的、’Ό構用在用於遞送樹脂密封基板的系統或用於將裝配 於基板上的電子部件進行模製和樹脂密封的系統中，所獲 得的系統可在冷卻樹脂密封基板時或在樹脂密封加工之後 的一系列加工中冷卻樹脂基板時，更有效的遞送樹脂密封 基板。 【實施方式】 根據本發明的基板冷卻系統是一種用於對通過一樹脂 密封模子對裝配於基板上的電子部件進行模製和樹脂密封 而形成的樹脂密封基板進行冷卻的系統。在描述根據本發 明的基板冷卻系統之前，先參考圖丨對安裝於基板上的電 子部件或相似元件進行模製和樹脂密封的加工進行描述。 模製和樹脂密封加工是通過使用樹脂密封系統來完成的， 該樹脂密封系統具有由上模具丨〖和下模具12組成的模 子。在圖1所示的系統中’上模具u具有基板固定機構， 而下模具12具有用於接收大量樹脂的模穴13，上模具u201213081 VI. Description of the Invention: [Technical Field] The present invention relates to a method and system for cooling a resin sealing substrate and to a system for delivering the substrate, which is to be mounted on a substrate The upper electronic component or the like is formed by resin sealing. The invention also relates to a system for sealing a resin or similar component mounted on a substrate. [Prior Art] A resin sealing system having a mold composed of an upper mold and a lower mold, which is conventionally used for molding or resin-sealing electronic components or the like mounted on a substrate, regardless of the upper mold or the lower mold. The molds have mold cavities for receiving a large amount of resin. In the resin sealing process, a substrate having an electronic component or the like mounted thereon is sandwiched between an upper mold and a lower mold, and an electronic component or the like is housed in a cavity, which is then already at a high temperature. The molten resin material is filled into the cavity and solidified. (This type of processing is called transfer m〇lding). After the resin material is cured, the resin sealing substrate is transferred from the resin sealing mold to a predetermined position designated for post-processing, for example, the substrate is stored in a rack or the substrate is cut. Such molding and resin sealing processes require a system for delivering substrates before and after resin sealing, and an example of such a delivery system is disclosed in Document 1. The delivery system includes a level-movable delivery tray that can be inserted between the upper and lower molds or removed from between the upper and lower molds - the substrate carrier is fitted to the hole t of the delivery tray, and Hole 201213081 can move vertically. When the substrate support portion of the slab resin sealing substrate can be provided on the lower side of the substrate carrier, the substrate setting portion for arranging the substrate before the tree squeezing process can also be provided on the upper side of the substrate (4). A suction slab device is used to support the resin sealing substrate by suction in the substrate branch portion on the lower side of the substrate carrier. As already explained, the resin seal of an electronic component or the like is achieved by hardening a resin which has been melted at a high temperature. Due to &, after the resin sealing process is completed, the substrate is still hot. The heat shrinkage coefficient of the resin material is different from the heat shrinkage coefficient of the substrate material. Because &, if the resin sealing substrate removed from the mold is placed in the air, the resin sealing substrate may become f due to natural and cooling. The b-curve of the resin-sealed substrate causes many problems such as the substrate of the squeaky sound cannot be smoothly stored in the holder or cannot be accurately cut. As a solution to this problem, Patent Document 2 discloses an apparatus for preventing f-curve. The device has a heat dissipating disc 1 provided in a resin sealing system to sandwich the molding and resin sealing product between the heat dissipating disc and the substrate P knife and to cool it in this state to prevent bending of the product. . Patent Document 1: JP-Α 201〇_1〇5326 Patent Document 2: JP_A 3_129864 In the device described in Patent Document 2, it is necessary to apply a considerable pressure for a period of time to keep the resin sealing substrate sandwiched therebetween. status. The return may have unintended effects on the product, such as damage to the electronic components or similar components of the resin in the sealed portion or deformation of the shape of the 201213081 portion of the resin-sealed substrate. SUMMARY OF THE INVENTION Problems to be Solved by the Invention The present invention provides a method and system for cooling a resin sealing substrate having molded or resin-bonded electronic components or the like on the resin sealing substrate. element. The method or system is capable of reducing the negative impact on electronic components or similar components while cooling the resin to seal the substrate' and also preventing bending of the substrate. The present invention also provides a system for delivering a resin sealing substrate comprising the above-described cooling system, and a resin sealing system including the same cooling system. Means for Solving the Problem According to a first aspect of the present invention, a system for sealing a cold resin sealing substrate which solves the above problems is a substrate cooling system for a cold portion-resin sealing substrate, which is The electronic component mounted on the substrate is molded and resin-tight by a resin sealing mold, the system comprising: a) a holder for holding the resin sealing substrate; b) a suction device disposed at the holding Inside the device for attracting the resin sealing substrate to the holder; and cooling. P > (the cow, at a position where the suction device attracts the resin sealing substrate toward the position, the cooling member having a contact surface in close contact with the resin sealing substrate. In the form of the resin sealing substrate system 201213081, the suction station - & ^ % $ + and holding device comprises an air suction device for sealing the substrate from the resin and the cold p °p piece The space between the contact faces draws air. In another form for cooling according to the present invention: the first aspect of the resin sealing substrate, the suction device comprises: an elastic support provided to the cooling member Above, for forming one or more closed spaces between the resin sealing substrate and the contact surface by contact with the resin sealing substrate when the resin sealing substrate is held; and one or more through holes, each The through holes are provided in the aforementioned one or more enclosed space (four) cooling members and pass through the thickness direction of the cooling member; and the two air suction devices pass through the one or more through holes The one or more enclosed spaces draw air. According to a first aspect of the present invention, in a further aspect of the system for cooling a resin sealing substrate, the system further comprises: d) a cooling device for cooling the chamber Cooling component. According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling device is a blower for conveying a gas stream to the cooling member. According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling member has one or more grooves formed on the contact surface, and the blower is directed to the one or Airflow is provided in multiple slots. 201213081 According to a first aspect of the present invention, in another form of the system for cooling a resin sealing substrate, the cooling device includes a Peltier device connected to the cooling member. According to a first aspect of the present invention, in a system for cooling a resin sealing substrate, a contact surface of the cooling member is designed such that a resin sealing portion of the resin sealing substrate can be in close contact therewith. A second aspect of the present invention provides a substrate delivery system for delivering a resin sealing substrate, characterized by comprising any of the foregoing systems for cooling a resin sealing substrate according to the first aspect of the present invention. A third aspect of the present invention provides a tree sealing system for molding and resin-sealing an electronic component mounted on a substrate, the system characterized in that it includes any of the foregoing, a human, a grease seal The system of the substrate. In the fourth section of the invention, the fourth aspect of the invention provides a method for sealing a substrate by using a resin-sealing mold which is mounted on a substantially electronic component for molding. The system and the tree include the following steps: · The method of the wind and the method of returning the tree. The b) is obtained by sucking the resin sealing substrate and the cooling member of the sealed substrate. The member is configured to cool the resin sealing substrate. The step of "reading from the fourth aspect of the present invention for cooling a tree, the method of "sinking a" standing on the sealing substrate flows to the cooling member ΓΡ f the step of sealing the substrate includes conveying gas 201213081 according to In another form of the invention, the step of contacting the resin of the grease-sealed substrate. The four-phase method for cooling the resin-sealed substrate, the step of cooling the resin-sealing substrate, comprising: sealing the portion of the tree with the cooling member The contact surface is closely related to the fourth method of the present invention, in another form of the method for cooling the resin sealing substrate, the step of sealing the substrate by the resin, at the delivery station This is done when the resin is sealed to the substrate. EFFECT OF THE INVENTION In the method and system for cooling a resin sealing substrate, the tree 1 = the substrate is held by the contact surface of the cooling member to bring the resin sealing substrate into close contact with the cooling member, thereby drawing heat from the substrate. Therefore, the process of the cold portion does not cause the resin sealing substrate to be bent, and the bending is caused by the difference between the heat shrinkage system of the base and the tree. Compared to the prior art, a large pressure is applied to the resin sealing substrate during the w process, and the present technique can minimize the negative effects on the molded and secret-sealed electronic components. In the art, if the substrate portion of the resin-sealed substrate is brought into close contact with the contact surface of the cooling member, the influence on the molding and the tree surface will be greatly reduced. In contrast, the resin sealing portion of the electric = μ grease sealing substrate is in close contact with the contact surface of the cooling member, and since the heat can be directly sucked from the resin sealing portion in the hot state, the cooling effect is further improved. δ provides an air suction device for drawing air between the resin sealing substrate and the contact surface of the cooling member. The contact between the resin sealing substrate and the cooling member 201213081 will be closer, thus preventing bending and cooling. The effect will be improved. When one or more enclosed spaces are formed between the resin sealing substrate and the contact surface, the contact between the resin sealing substrate and the cooling member will be closer, so that the holding device is designed such that it can pass from the closed space through the air holding device Absorb air. The provided cooling device will further improve the cooling effect of the resin sealing substrate. Further, when the system for cooling a resin sealing substrate according to the present invention is used in a system for delivering a resin sealing substrate or a system for molding and resin sealing an electronic component mounted on a substrate Among them, the obtained system can more effectively deliver the resin sealing substrate when cooling the resin sealing substrate or cooling the resin substrate in a series of processes after the resin sealing process. [Embodiment] A substrate cooling system according to the present invention is a system for cooling a resin sealing substrate formed by molding and resin-sealing an electronic component mounted on a substrate by a resin sealing mold. Before describing the substrate cooling system according to the present invention, the processing of molding and resin sealing of an electronic component or the like mounted on a substrate will be described with reference to FIG. Molding and resin sealing processing is carried out by using a resin sealing system having a mold composed of an upper mold 丨 and a lower mold 12. In the system shown in Fig. 1, the upper mold u has a substrate fixing mechanism, and the lower mold 12 has a cavity 13 for receiving a large amount of resin, and the upper mold u
10 201213081 具有基板固定機構。贫其起m a ° 疋機構的範例包括藉由從上 方抽吸以用於吸引基板21的 棺田從上 等以用於m冓藉由嚙合或鉤合結構等 寺用於固持基板2 1的機構。 在樹脂密封系統中，首先 味能μ、 田时任至溫下的液態（或 =)的樹脂材料23注入到下模具12的模…時 有電子部件22的基板21固定於上模具W基板固 疋區#又（見圖i(a))。接下來 增加模穴13的溫度，將 …帛升到使其上表面到達接觸上模具11的下表面 :位置，且將兩個模具壓在一起（見圖1(b))。將此狀 、'保持數分鐘，以硬化模穴13内部的樹脂。如此，通過壓 縮模製的模製和樹脂密封加卫完成了，且可得到具有樹脂 密封電子元件22位於某杯91 ι·αα·* 、 上的產品。在模製和樹脂密 封加工完成之後，將下模具12向下移動，如圖丨⑴所示 的留下基板21固定在上模具u上。在以下描述中，將模 製的和樹脂密封的基板稱為樹脂密封基板21A，且將已硬化 的樹脂密封電子部件22的部分稱為樹脂密封部分24(見圖 1 ( d ))。應该注意的是，粉末狀或顆粒狀的固體材料可 用作樹脂材料23’在這種情況下，當下模具12的溫度增加 時’該材料將會熔化。 田凡成了裝設在基板上的電子部件或相似元件的樹脂 达封後，將樹脂法、封基板從樹脂密封系統中移除且遞送到 後處理，例如將基板存方於機架内或基板的切割。以下說 明顯示了具體實施例，其中用於冷卻根據本發明的樹脂密 封基板的系統係被應用至一基板遞送系統。 201213081 第一實施例 如圖2 ( a )所示’根據第一實施例用於遞送樹脂密封 基板的系統包括一用於遞送樹脂密封基板的遞送盤4〇，一 吸入單元30提供於遞送盤4〇之上’ 一用於水準移動遞送 盤40的遞送盤驅動結構（未示）’和一用於垂直移動吸入 單元3 0的吸入單元驅動機構。 吸入單元30的結構是參考圖3來描述的。圖3 ( a )是 吸入單元30的俯視圖，且圖3 ( b )是吸入單元30沿剖面 線A-A’的剖面圖。吸入單元3〇包括一冷卻部件3 1和一沿 著冷卻部件3 1的周邊延伸的框架形彈性支座部件32。冷卻 部件3 1由鋁製成，鋁為高導熱材料，具有足夠高於樹脂密 封部分的硬度。》卻部件31 #大小大概相當於樹脂密封基 板2 1A的樹脂密封部分24的下表面。冷卻部件3 1的上表 面作為樹脂密封部分24緊密接觸的接觸表面。冷卻部件3 1 具有穿過其厚度方向的通孔33a。彈性支座部件32從冷卻 部件的上表面（接觸面）稍微向上突出。一空氣抽吸裝 置33c通過空氣抽吸通道33b連接於通孔33a。 下文將描述根據第一實施例的用於遞送樹脂密封基板 的系統的操作。在樹脂密封基板21A通過樹脂密封系二模 製之後，操作遞送盤驅動機構將遞送盤4〇移動到上模具1 1 和下模具12之間的預定位置（見圖2⑷）。這個位置是冷 卻部件3 1的接觸面面向樹脂密封部分24的下表面的位 置。接下來，操作吸入單元驅動機構5〇,以將吸入單元= 12 201213081 提升到彈性支座32的上表面到達接觸樹脂密封部分24下 表面的水準高度（圖2 (b))。正如已經描述的，彈性支 座部件32從冷卻部件31的接觸面稍微向上突出。因此， 彈I1生支座。卩件32的上表面到達接觸樹脂密封部分24的下 表面所以，形成了由冷卻部件3丄的接觸面，彈性支座部 件32和樹脂密封部分24的下表面所包圍的封閉空間（I "在廷種狀態下’將空氣抽吸裝i 33C從通孔33&和空 轧抽吸通if 33b封閉空間中抽吸空氣。在開始空氣抽吸操 作的同時’中斷通過基板固定機構將基板2ι支撐在上模呈 η的操作。例如：在抽吸中若在基板21，皮支撐在上模具 1則《玄抽吸會停止。然後，彈性支座部件32逐漸地且有 彈性的改變其形狀’使樹脂密封基板^從上模具U移動 到冷部單i 30,直到樹脂密封❹24的下纟面到達接觸於 冷卻部件31的接觸面卩目_ 1^、、 見圖4(b))。可預先調整彈性支 座部件32的彈性特性，從接觸表面突出的程度和空氣吸持 裝置33C ^氣吸持強度，以使接觸面通過空氣吸入操作 可緊密接觸於樹脂密封部分24的下表面。儘管不_定需要 將封閉空間保持在一個高的真空狀態，也可進行更適合的 調整，以使封閉空間内保持高的真空狀態，從而可在樹脂10 201213081 has a substrate fixing mechanism. Examples of the lean mechanism include a mechanism for holding the substrate 21 by sucking from above, for absorbing the substrate 21 from the top for use in the temple by the meshing or hooking structure. . In the resin sealing system, first, the resin material 23 of the liquid material (or =) in the range of the energy, the time, and the temperature is injected into the mold of the lower mold 12, and the substrate 21 of the electronic component 22 is fixed to the upper mold W.疋区# again (see Figure i(a)). Next, the temperature of the cavity 13 is increased, so that the upper surface thereof is brought into contact with the lower surface of the upper mold 11 : position, and the two molds are pressed together (see Fig. 1 (b)). This shape, 'hold for a few minutes, to harden the resin inside the cavity 13. Thus, the molding by the compression molding and the resin sealing are completed, and a product having the resin-sealed electronic component 22 located on a certain cup 91 ι·αα·* can be obtained. After the molding and resin sealing processing is completed, the lower mold 12 is moved downward, and the remaining substrate 21 as shown in Fig. 1 (1) is fixed on the upper mold u. In the following description, the molded and resin-sealed substrate is referred to as a resin sealing substrate 21A, and the portion of the hardened resin-sealed electronic component 22 is referred to as a resin sealing portion 24 (see Fig. 1 (d)). It should be noted that a powdery or granular solid material can be used as the resin material 23'. In this case, when the temperature of the lower mold 12 is increased, the material will be melted. After Tian Fan becomes the resin of the electronic component or similar component mounted on the substrate, the resin method and the sealing substrate are removed from the resin sealing system and delivered to the post-processing, for example, the substrate is stored in the frame or the substrate. Cutting. The following description shows a specific embodiment in which a system for cooling a resin-sealed substrate according to the present invention is applied to a substrate delivery system. 201213081 First Embodiment As shown in FIG. 2(a), the system for delivering a resin sealing substrate according to the first embodiment includes a delivery tray 4 for delivering a resin sealing substrate, and an inhalation unit 30 is provided to the delivery tray 4 Above is a delivery tray drive structure (not shown) for leveling the delivery tray 40 and a suction unit drive mechanism for vertically moving the suction unit 30. The structure of the suction unit 30 is described with reference to FIG. Fig. 3 (a) is a plan view of the suction unit 30, and Fig. 3 (b) is a cross-sectional view of the suction unit 30 along the section line A-A'. The suction unit 3A includes a cooling member 31 and a frame-shaped elastic abutment member 32 extending along the periphery of the cooling member 31. The cooling member 31 is made of aluminum, which is a highly thermally conductive material having a hardness sufficiently higher than that of the resin sealing portion. The size of the member 31 # is approximately equivalent to the lower surface of the resin sealing portion 24 of the resin sealing substrate 2 1A. The upper surface of the cooling member 3 1 serves as a contact surface in which the resin sealing portion 24 is in close contact. The cooling member 3 1 has a through hole 33a passing through the thickness direction thereof. The elastic abutment member 32 slightly protrudes upward from the upper surface (contact surface) of the cooling member. An air suction device 33c is connected to the through hole 33a through the air suction passage 33b. The operation of the system for delivering a resin sealing substrate according to the first embodiment will be described below. After the resin sealing substrate 21A is molded by the resin sealing system, the delivery tray driving mechanism is moved to move the delivery tray 4 to a predetermined position between the upper mold 1 1 and the lower mold 12 (see Fig. 2 (4)). This position is a position where the contact face of the cooling member 31 faces the lower surface of the resin sealing portion 24. Next, the suction unit drive mechanism 5 is operated to raise the suction unit = 12 201213081 to the upper surface of the elastic holder 32 to reach the level of the lower surface of the contact resin sealing portion 24 (Fig. 2(b)). As has been described, the elastic abutment member 32 protrudes slightly upward from the contact surface of the cooling member 31. Therefore, the I1 live support. The upper surface of the weir 32 reaches the lower surface of the contact resin sealing portion 24, so that a closed space surrounded by the contact faces of the cooling member 3, the elastic abutment member 32 and the lower surface of the resin sealing portion 24 is formed (I " In the state of the invention, the air suction device i 33C is sucked from the through hole 33 & and the air rolling suction through if 33b enclosed space. At the same time as the air suction operation is started, the substrate 2 is interrupted by the substrate fixing mechanism. Supporting the operation of the upper mold in the form of η. For example, if the skin is supported on the upper mold 1 in the suction of the substrate 21, the sinus suction will stop. Then, the elastic support member 32 gradually and elastically changes its shape. 'The resin sealing substrate ^ is moved from the upper mold U to the cold portion i 30 until the lower jaw surface of the resin sealing jaw 24 reaches the contact surface contacting the cooling member 31, see Fig. 4(b)). The elastic characteristics of the elastic support member 32 can be adjusted in advance, the degree of protrusion from the contact surface, and the air suction device 33C gas suction strength so that the contact surface can be in close contact with the lower surface of the resin sealing portion 24 by the air suction operation. Although it is not necessary to maintain the closed space in a high vacuum state, a more suitable adjustment can be made to maintain a high vacuum in the enclosed space, thereby allowing resin
被封基板21Α和接觸面之間產生非常緊密的㈣H 保持如此緊密接觸的同時’操作吸入單元驅動機構50以降 低吸入單元30 (見圖2 ( c、、 „ ^ ’之後操作遞送盤驅動機構， 將樹脂密封基板21Α移動刭箱职 動到預定位置以用於後續加工或類 13 201213081 似加工。在此加工過程中，樹脂密封基板21A保持在與冷 卻部件31緊密接觸的狀態。這樣’本系統可在冷卻基板: 使不會使其f曲的同時，有效率的遞送樹脂密封基板幻八。 第二實施例 下文將描述種根據第二實施例的用於遞送樹脂密封 基板的系統。與第一實施例的不同之處在於吸入單元％的 結構。遞送盤40和吸入單元驅動機構5〇的結構與第一實 施例中的結構相同，在此不再描述。目” a)為吸入單元 30的俯視圖 且圖5 (b)為吸入單元3〇沿剖面線b_b，的 剖面圖。吸入單元30包括一冷卻部件31和六個彈性支座 部件32。冷卻部件31具有與樹脂密封部分24的下表面緊 密接觸的接觸面，具有六個穿過其厚度方向的通孔Da。如 圖5(b)所示’六個彈性支座部件32分別提供給六個通孔 32a。每個彈性支座部件32具有—插人通孔仏的圓柱形部 分32a和一連接到圓柱形部分323上部的碗形部分。碗 形部分32b從冷卻部件31的接觸面稍微向上突出，其上端 ::-個開口，其下端具有一通向圓柱形部分仏的一 空氣抽吸裝置33c通過空氣抽吸通道33b連接到通孔Μ” 下文將㈣根據第二實施例的用力遞送樹脂密封基板 的系統的操作。通過和第一實施例相似的操作促使彈性 支座部件32的上表面到達接觸於樹脂密封部分的下表 面。由於彈性支座部件32的碗形部> 32b從冷卻部件31 的接觸面猶微突出，所以碗形部》32b的上表面到達接觸The sealed substrate 21Α and the contact surface produce a very tight (four)H while maintaining such close contact while operating the suction unit drive mechanism 50 to lower the suction unit 30 (see Figure 2 (c, „^' after operating the delivery tray drive mechanism, The resin sealing substrate 21 is moved to a predetermined position for use in subsequent processing or processing. In this processing, the resin sealing substrate 21A is kept in close contact with the cooling member 31. Thus, the system The resin sealing substrate can be efficiently delivered while cooling the substrate without causing it to be curved. Second Embodiment Hereinafter, a system for delivering a resin sealing substrate according to the second embodiment will be described. An embodiment differs in the structure of the suction unit %. The structure of the delivery tray 40 and the suction unit drive mechanism 5 is the same as that of the first embodiment, and will not be described here. The "a) is the suction unit 30. Figure 5 (b) is a cross-sectional view of the suction unit 3 〇 along the section line b_b. The suction unit 30 includes a cooling member 31 and six elastic bearing members 32. The member 31 has a contact face in close contact with the lower surface of the resin sealing portion 24, and has six through holes Da passing through the thickness direction thereof. As shown in Fig. 5(b), the six elastic bearing members 32 are respectively provided to six. Each of the elastic abutment members 32 has a cylindrical portion 32a that is inserted into the through hole and a bowl portion that is connected to the upper portion of the cylindrical portion 323. The bowl portion 32b is slightly slightly from the contact surface of the cooling member 31. Projecting upwardly, the upper end thereof:: an opening having an air suction device 33c leading to the cylindrical portion 下 at the lower end thereof is connected to the through hole 通过 through the air suction passage 33b. hereinafter, (iv) force delivery according to the second embodiment The operation of the system of the resin sealing substrate. The operation of the elastic bearing member 32 is brought into contact with the lower surface of the resin sealing portion by an operation similar to that of the first embodiment. Since the bowl portion of the elastic holder member 32 > 32b The contact surface of the cooling member 31 is slightly protruded, so that the upper surface of the bowl portion 32b reaches the contact
14 201213081 於樹月旨密封部分24的τ表面。因此， 和樹脂密封部分24的τ _ Α 碗开> 部分32b (a) ) 0 的下表面圍繞而成的封閉空間（見圖6 在這種狀態下，和第一實施例相似 33通電以通過通孔3 字工軋抽吸裝置 吸空氣。與此Γ 吸通道336從封閉空間抽 汉二孔興此间時，中斷 ㈣模八11的基板固定機構的操作。 座部件32逐漸地且有彈性的 甲作 樹脂密封基板21A從上模1 u Λ 〜狀使 脂密封部…下表:到單元 (見圖6⑴）。與第冷卻部件31的接觸面 彈性支座料32㈣性純，從㈣表面突 氣抽吸裝置仪的空氣抽吸強度。隨後，通過和第：;： 例相似的操作，將樹脂密封基板21A遞送到預 用於後續加工。這樣，與第一實施例相似，本系統可在冷 :基板且使不會使其變曲的同時，有效率的遞送樹脂密封 基板2 1A。 “述帛一實施例中的系統使用六個彈性支座部件 2且從每個由彈性支座部件32的碗形部分32b和樹脂密 封部分24的下表面形成的封閉空間中抽吸空氣。在此種結 構中，六個封^間的總容積，t不用說每個封閉空間^ 容積’都將小於第-實施例中封閉空間的容積。因此，在 最初從封閉空間吸收空氣的操作完成之後，減少樹脂密封 邛刀24到達接觸冷卻部件3丨所需的時間是可能的。 應該注意的是，前述的任何一個實施例都僅僅是用來 15 201213081 說明本發明的例子，且都可在本發明的實質範圍内進行適 當的變化和改變。儘管前述實施例都是將根據本發明的用 於冷卻樹脂密封基板的系統作為基板遞送系統的一部分的 例子，但將所述系統構建成一個獨立的用於冷卻樹脂密封 基板的系統也自然是有可能的。 在前述實施財，才皮冷卻的樹脂密封基板是通過麗縮 模製所產生的產品。也可能使用根據本發明的用於冷卻樹 脂密封基板的“來冷料過其輯Μ法產生的樹脂密 封基板，例如傳遞模塑法。 另外，前述實施例假設了從基板固定於上模具且由下 模具接收樹脂材料的樹脂密封系統遞送樹脂密封基板的情 況。在從上、下模具的功能相反的樹脂密封系統中遞送樹 脂密封基板的情況下，前述系統也可顛倒使用。 另外，則述系統可改變為冷卻基板2丨而不是樹脂密封 基板24。 在别述實施例中，從樹脂密封基板到冷卻部件所產生 的熱量通過自然冷卻而釋放。除此之外，最好提供一用於 冷卻該冷卻部件的冷卻裝置。使用冷卻裝置可改善釋放從 樹脂密封基板到冷卻部件所產生的熱量的效率，1因此使 樹脂密封基板的冷卻更有效率。冷卻裝置的實施例包括— 用於遞送氣流到冷卻部件的鼓風機（例如一風扇或渦流 吕），一連接到冷卻部件的帕爾帖裝置等。當使用—遞送 氣流到冷卻部件的鼓風機時’空氣可被提供到冷卻部件的 與接觸面相反的一側。—優選實施例如圖7 ( a )(俯視圖） 201213081 和7 ( b )(沿剖面線c - c ’的剖面圖）所_ 且古^ j面圖）所7^ ’其中冷卻部件31 具有形成於接觸面上的槽34,且 八^ β 昱通過延些位於樹脂密封部 刀24和接觸面之間的槽34 七L +极货工乳。此系統可更有效 率的冷卻樹脂密封基板。也可在通 长逋過冷郃部件冷卻樹脂密 封基板之外，完成對未接觸料卻料的樹《封基板表 面的強制冷卻。 在前述實施例中，传用τ , 』Τ便用了 一用於從樹脂密封基板和冷 部部件的接觸面之間的空間抽吸空氣的裝置作為吸持裝 置。當基板是使用鋼類作為基礎材料的金屬基礎基板的情 況下’可使用磁性的吸持樹脂密封基板的裝置。 另外，在前述實施例中由鋁製成的冷卻部件，可由除 之外的其他材料製成，只要該材料是比樹脂材料具有 更高硬度的高導熱材料。 圖3所示的冷卻部件只有一個通孔。也可能根據被吸 引的樹脂密封基板的尺寸或其他因素來適當地增加通孔的 量同樣如圖5所示的通孔的數量和冷卻部件的彈性 支座部件的數量也可有適當的變化。 在如圖3所示的例子中，如此提供彈性支座部件，以 使其可沿冷卻部件的周邊形成-封閉空間。吸收單元的另 -種可能結構如圖8 ( a )(俯視圖）和圖8 ( b )(沿剖面 線D-D的剖面圖）所示，其中該單元被細分成更小的封閉 空間可從每個封閉空間分別抽吸空氣。 【圖式簡單說明】 17 201213081 圖1為將樹指密封電子部件或其類似元件組裝到基板 上過程示意圓。 圖2為遞送樹脂密封基板的加工的示意圖。 _圖3為用於本發明第一實施例中的抽吸單元結構的圖 不圖。 (接觸面）與 單元結構的圖 ^圖4為第—實施例中冷卻部件的上表面 十月曰密封σ卩分的下表面緊密接觸的操作圖示 一圖5為用於本發明第二實施例中的抽吸 示 〇 6為第二實施例中冷卻部件的表 樹脂密封部八沾丁主 取w、接觸面）j 刀的下表面緊密接觸的操作圖示。 圖7為抽吸早元的-種變化結構的圖示。 為抽吸早7L的另一種變化結構的圖示。 【主 要元件符號說明 11 上模具 12 下模具 13 模穴 21 基板 21A 樹脂密封基板 22 電子部件 23 樹脂材料 24 樹脂密封部分 30 吸入單元 18 201213081 31 冷卻部件 32 彈性支座部件 32a 圓柱形部分 32b 碗形部分 33a 通孔 33b 空氣抽吸通道 33c 空氣吸入裝置 34 槽 40 遞送盤 50 吸入單元驅動 1914 201213081 Yu Shuyue is the surface of the τ of the sealing portion 24. Therefore, an enclosed space surrounded by the lower surface of the τ _ 碗 bowl opening > portion 32b (a) ) 0 of the resin sealing portion 24 (see Fig. 6 in this state, similar to the first embodiment, 33 is energized to The air is sucked through the through-hole 3 word-drawing suction device, and the suction passage 336 is interrupted from the closed space, and the operation of the substrate fixing mechanism of the (4) die 8 11 is interrupted. The seat member 32 is gradually and elastic. The nail seals the substrate 21A from the upper mold 1 u Λ ~ like the grease seal ... the following table: to the unit (see Figure 6 (1)). The contact surface with the cooling member 31 elastic support material 32 (four) pure, from the (four) surface The air suction strength of the sudden air suction device. Subsequently, the resin sealing substrate 21A is delivered to the pre-processing for subsequent processing by a similar operation to the first: Thus, similarly to the first embodiment, the system can be The resin sealing substrate 21A is efficiently delivered while the substrate is cooled and not deformed. "The system in the first embodiment uses six elastic bearing members 2 and from each of the elastic bearings. The bowl portion 32b of the member 32 and the resin sealing portion 24 In the closed space formed by the surface, air is sucked. In this structure, the total volume of the six seals, t need not say that each closed space ^ volume ' will be smaller than the volume of the closed space in the first embodiment. After the operation of initially absorbing air from the enclosed space is completed, it is possible to reduce the time required for the resin sealing trowel 24 to reach the contact cooling member 3 。. It should be noted that any of the foregoing embodiments is only used for 15 201213081 The examples of the present invention are described, and may be appropriately changed and changed within the essential scope of the invention. Although the foregoing embodiments are examples of the system for cooling a resin sealing substrate according to the present invention as a part of the substrate delivery system. However, it is naturally possible to construct the system as a separate system for cooling the resin sealing substrate. In the foregoing implementation, the resin-sealed substrate which is cooled by the skin is a product produced by sizing molding. It is possible to use the resin sealing substrate produced by the method for cooling a resin sealing substrate according to the present invention. Further, the foregoing embodiment assumes a case where the resin sealing substrate is delivered from the resin sealing system in which the substrate is fixed to the upper mold and the resin material is received by the lower mold. In the resin sealing system from the opposite function of the upper and lower molds In the case of delivering a resin sealing substrate, the foregoing system can also be used upside down. In addition, the system can be changed to cool the substrate 2 instead of the resin sealing substrate 24. In other embodiments, the resin sealing substrate to the cooling member is produced. The heat is released by natural cooling. In addition, it is preferable to provide a cooling device for cooling the cooling member. The use of the cooling device improves the efficiency of releasing heat generated from the resin sealing substrate to the cooling member, The cooling of the resin sealing substrate is more efficient. Embodiments of the cooling device include - a blower (e.g., a fan or vortex) for delivering airflow to the cooling component, a Peltier device connected to the cooling component, and the like. When using - delivering airflow to the blower of the cooling component, air can be supplied to the opposite side of the cooling component from the contact surface. - a preferred embodiment such as Figure 7 (a) (top view) 201213081 and 7 (b) (a cross-sectional view along the section line c - c ') and an ancient figure 7 The groove 34 on the contact surface, and the ^ β 昱 昱 延 延 延 延 延 位于 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 This system seals the substrate with a more efficient cooling resin. It is also possible to complete the forced cooling of the unsealed tree in addition to the cooling of the resin-sealed substrate. In the foregoing embodiment, a means for sucking air from a space between the resin sealing substrate and the contact faces of the cold member is used as the holding means. When the substrate is a metal base substrate using steel as a base material, a device which can seal the substrate using a magnetic holding resin can be used. Further, the cooling member made of aluminum in the foregoing embodiment may be made of other materials than those as long as the material is a highly thermally conductive material having a higher hardness than the resin material. The cooling member shown in Fig. 3 has only one through hole. It is also possible to appropriately increase the amount of the through holes according to the size of the resin sealing substrate to be sucked or other factors. The number of the through holes as shown in Fig. 5 and the number of the elastic supporting members of the cooling member can also be appropriately changed. In the example shown in Fig. 3, the elastic abutment member is provided such that it can form a closed space along the periphery of the cooling member. Another possible structure of the absorption unit is shown in Figure 8 (a) (top view) and Figure 8 (b) (cross-sectional view along section line DD), wherein the unit is subdivided into smaller enclosed spaces from each The enclosed space draws air separately. [Simple description of the diagram] 17 201213081 Fig. 1 is a schematic circle for assembling a tree-finger sealed electronic component or the like to a substrate. 2 is a schematic view of a process of delivering a resin sealing substrate. Fig. 3 is a view showing the structure of the suction unit used in the first embodiment of the present invention. FIG. 4 is a view showing the operation of the upper surface of the upper surface of the cooling member in the first embodiment in close contact with the lower surface of the sealing member σ 卩. FIG. 5 is a second embodiment of the present invention. The suction 〇6 in the example is an operation diagram in which the lower surface of the surface resin sealing portion of the cooling member in the second embodiment is in close contact with the lower surface of the blade. Figure 7 is a graphical representation of the variation structure of the suction early element. An illustration of another variation of the structure that is as early as 7L. [Main component symbol description 11 Upper mold 12 Lower mold 13 Cavity 21 Substrate 21A Resin sealing substrate 22 Electronic component 23 Resin material 24 Resin sealing portion 30 Suction unit 18 201213081 31 Cooling member 32 Elastic support member 32a Cylindrical portion 32b Bowl shape Portion 33a through hole 33b air suction passage 33c air suction device 34 slot 40 delivery tray 50 suction unit drive 19