SG177129A1 - Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane - Google Patents

Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane Download PDF

Info

Publication number
SG177129A1
SG177129A1 SG2011087228A SG2011087228A SG177129A1 SG 177129 A1 SG177129 A1 SG 177129A1 SG 2011087228 A SG2011087228 A SG 2011087228A SG 2011087228 A SG2011087228 A SG 2011087228A SG 177129 A1 SG177129 A1 SG 177129A1
Authority
SG
Singapore
Prior art keywords
wafer
etch stop
micro
stop layer
vias
Prior art date
Application number
SG2011087228A
Other languages
English (en)
Inventor
Lior Shiv
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of SG177129A1 publication Critical patent/SG177129A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0242—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes from the back sides of the chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H10W20/211—Through-semiconductor vias, e.g. TSVs
    • H10W20/212—Top-view shapes or dispositions, e.g. top-view layouts of the vias
    • H10W20/2125—Top-view shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Weting (AREA)
SG2011087228A 2006-09-26 2007-09-25 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane SG177129A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84804306P 2006-09-26 2006-09-26
US11/669,664 US7531445B2 (en) 2006-09-26 2007-01-31 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

Publications (1)

Publication Number Publication Date
SG177129A1 true SG177129A1 (en) 2012-01-30

Family

ID=39225475

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011087228A SG177129A1 (en) 2006-09-26 2007-09-25 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

Country Status (10)

Country Link
US (3) US7531445B2 (https=)
EP (3) EP2750176A3 (https=)
JP (1) JP5313903B2 (https=)
KR (1) KR101423749B1 (https=)
CN (1) CN101517729B (https=)
DK (1) DK2082422T3 (https=)
MY (1) MY145677A (https=)
SG (1) SG177129A1 (https=)
TW (1) TWI376016B (https=)
WO (1) WO2008038158A2 (https=)

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US8598695B2 (en) 2010-07-23 2013-12-03 Tessera, Inc. Active chip on carrier or laminated chip having microelectronic element embedded therein
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Also Published As

Publication number Publication date
EP2750177A2 (en) 2014-07-02
WO2008038158A2 (en) 2008-04-03
CN101517729A (zh) 2009-08-26
EP2082422B1 (en) 2014-11-26
HK1137565A1 (en) 2010-07-30
KR101423749B1 (ko) 2014-08-01
JP2010505259A (ja) 2010-02-18
WO2008038158B1 (en) 2008-11-27
US20090191704A1 (en) 2009-07-30
TW200832615A (en) 2008-08-01
DK2082422T3 (en) 2014-12-08
TWI376016B (en) 2012-11-01
US20080076195A1 (en) 2008-03-27
US7531445B2 (en) 2009-05-12
MY145677A (en) 2012-03-15
EP2750176A2 (en) 2014-07-02
KR20090076899A (ko) 2009-07-13
WO2008038158A3 (en) 2008-08-28
US7662710B2 (en) 2010-02-16
US7732240B2 (en) 2010-06-08
EP2750176A3 (en) 2014-07-16
EP2750177A3 (en) 2014-10-22
CN101517729B (zh) 2011-08-10
EP2082422A2 (en) 2009-07-29
US20100015734A1 (en) 2010-01-21
JP5313903B2 (ja) 2013-10-09

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