SG142143A1 - Abrading plate and polishing method using the same - Google Patents
Abrading plate and polishing method using the sameInfo
- Publication number
- SG142143A1 SG142143A1 SG200407095-9A SG2004070959A SG142143A1 SG 142143 A1 SG142143 A1 SG 142143A1 SG 2004070959 A SG2004070959 A SG 2004070959A SG 142143 A1 SG142143 A1 SG 142143A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- abrasive particles
- abrading plate
- raised regions
- less
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 4
- 239000002245 particle Substances 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 4
- 239000011230 binding agent Substances 0.000 abstract 3
- 230000000994 depressogenic effect Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13443298 | 1998-04-28 | ||
JP15054698 | 1998-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG142143A1 true SG142143A1 (en) | 2008-05-28 |
Family
ID=26468552
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200104884A SG119138A1 (en) | 1998-04-28 | 1999-04-28 | Abrading plate and polishing method using the same |
SG200407095-9A SG142143A1 (en) | 1998-04-28 | 1999-04-28 | Abrading plate and polishing method using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200104884A SG119138A1 (en) | 1998-04-28 | 1999-04-28 | Abrading plate and polishing method using the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US6413149B1 (fr) |
EP (1) | EP0999013B1 (fr) |
KR (1) | KR100567981B1 (fr) |
DE (1) | DE69937181T2 (fr) |
SG (2) | SG119138A1 (fr) |
WO (1) | WO1999055493A1 (fr) |
Families Citing this family (56)
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JP3770752B2 (ja) | 1998-08-11 | 2006-04-26 | 株式会社日立製作所 | 半導体装置の製造方法及び加工装置 |
EP1077108B1 (fr) | 1999-08-18 | 2006-12-20 | Ebara Corporation | Procede et appareil de polissage |
US6616513B1 (en) | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
US20020016139A1 (en) * | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
JP3914964B2 (ja) * | 2000-09-21 | 2007-05-16 | 高橋金属株式会社 | 電解イオン水を混合した水溶性クーラント液及び製造装置 |
JP2002343756A (ja) * | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
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JP2003318140A (ja) * | 2002-04-26 | 2003-11-07 | Applied Materials Inc | 研磨方法及び装置 |
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US7226345B1 (en) | 2005-12-09 | 2007-06-05 | The Regents Of The University Of California | CMP pad with designed surface features |
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JP5617387B2 (ja) * | 2010-07-06 | 2014-11-05 | 富士電機株式会社 | 垂直磁気記録媒体用基板の製造方法、および、該製造方法により製造される垂直磁気記録媒体用基板 |
TWI613285B (zh) | 2010-09-03 | 2018-02-01 | 聖高拜磨料有限公司 | 粘結的磨料物品及形成方法 |
US9393669B2 (en) | 2011-10-21 | 2016-07-19 | Strasbaugh | Systems and methods of processing substrates |
US8968052B2 (en) | 2011-10-21 | 2015-03-03 | Strasbaugh | Systems and methods of wafer grinding |
WO2014033055A1 (fr) | 2012-08-27 | 2014-03-06 | Aktiebolaget Electrolux | Système de positionnement de robot |
US9457446B2 (en) | 2012-10-01 | 2016-10-04 | Strasbaugh | Methods and systems for use in grind shape control adaptation |
US9610669B2 (en) | 2012-10-01 | 2017-04-04 | Strasbaugh | Methods and systems for use in grind spindle alignment |
WO2014106157A1 (fr) * | 2012-12-31 | 2014-07-03 | Saint-Gobain Abrasives, Inc. | Article abrasif lié et procédé d'abrasion |
JP2016501735A (ja) * | 2012-12-31 | 2016-01-21 | サンーゴバン アブレイシブズ,インコーポレイティド | 結合研磨物品および研削方法 |
US9102039B2 (en) | 2012-12-31 | 2015-08-11 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of grinding |
US9833877B2 (en) | 2013-03-31 | 2017-12-05 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of grinding |
JP6198234B2 (ja) | 2013-04-15 | 2017-09-20 | アクティエボラゲット エレクトロラックス | 突出サイドブラシを備えたロボット真空掃除機 |
CN110448222A (zh) | 2013-04-15 | 2019-11-15 | 伊莱克斯公司 | 机器人真空吸尘器 |
US10209080B2 (en) | 2013-12-19 | 2019-02-19 | Aktiebolaget Electrolux | Robotic cleaning device |
WO2015090405A1 (fr) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Détection de gravissement d'obstacle d'un dispositif de nettoyage robotisé |
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WO2015090399A1 (fr) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Dispositif de nettoyage robotisé et procédé de reconnaissance de point de repère |
US9728415B2 (en) | 2013-12-19 | 2017-08-08 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of wafer thinning involving edge trimming and CMP |
WO2015090404A1 (fr) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Priorisation de zones de nettoyage |
US9811089B2 (en) | 2013-12-19 | 2017-11-07 | Aktiebolaget Electrolux | Robotic cleaning device with perimeter recording function |
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KR102325130B1 (ko) | 2014-07-10 | 2021-11-12 | 에이비 엘렉트로룩스 | 로봇 청소 장치에서 측정 에러를 검출하는 방법 |
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EP3230814B1 (fr) | 2014-12-10 | 2021-02-17 | Aktiebolaget Electrolux | Utilisation d'un capteur laser pour la détection d'un type de sol |
EP3229983B1 (fr) | 2014-12-12 | 2019-02-20 | Aktiebolaget Electrolux | Brosse latérale et appareil de nettoyage robotique |
EP3234714B1 (fr) | 2014-12-16 | 2021-05-12 | Aktiebolaget Electrolux | Feuille de route basée sur l'expérience pour un dispositif de nettoyage robotisé |
US10678251B2 (en) | 2014-12-16 | 2020-06-09 | Aktiebolaget Electrolux | Cleaning method for a robotic cleaning device |
KR102343513B1 (ko) | 2015-04-17 | 2021-12-28 | 에이비 엘렉트로룩스 | 로봇 청소 장치 및 로봇 청소 장치의 제어 방법 |
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CN108603935A (zh) | 2016-03-15 | 2018-09-28 | 伊莱克斯公司 | 机器人清洁设备以及机器人清洁设备进行陡壁检测的方法 |
WO2017194102A1 (fr) | 2016-05-11 | 2017-11-16 | Aktiebolaget Electrolux | Dispositif de nettoyage robotisé |
JP6680639B2 (ja) * | 2016-07-27 | 2020-04-15 | 株式会社ディスコ | 加工方法 |
JP6858529B2 (ja) * | 2016-10-14 | 2021-04-14 | 株式会社ディスコ | 保持テーブルの保持面形成方法、研削装置及び研削ホイール |
JP7243967B2 (ja) | 2017-06-02 | 2023-03-22 | アクチエボラゲット エレクトロルックス | ロボット清掃デバイスの前方の表面のレベル差を検出する方法 |
WO2019063066A1 (fr) | 2017-09-26 | 2019-04-04 | Aktiebolaget Electrolux | Commande de déplacement d'un dispositif de nettoyage robotique |
CN112259454B (zh) * | 2019-07-22 | 2024-04-12 | 华邦电子股份有限公司 | 化学机械研磨制程 |
CN114286736B (zh) * | 2019-08-27 | 2024-08-06 | 应用材料公司 | 化学机械抛光校正工具 |
KR102526513B1 (ko) * | 2021-05-26 | 2023-04-26 | 에스케이엔펄스 주식회사 | 연마패드 접착필름, 이를 포함하는 연마패드 적층체 및 웨이퍼의 연마방법 |
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-
1999
- 1999-04-28 SG SG200104884A patent/SG119138A1/en unknown
- 1999-04-28 US US09/446,764 patent/US6413149B1/en not_active Expired - Fee Related
- 1999-04-28 SG SG200407095-9A patent/SG142143A1/en unknown
- 1999-04-28 WO PCT/JP1999/002270 patent/WO1999055493A1/fr active IP Right Grant
- 1999-04-28 EP EP99917205A patent/EP0999013B1/fr not_active Expired - Lifetime
- 1999-04-28 KR KR1019997012348A patent/KR100567981B1/ko not_active IP Right Cessation
- 1999-04-28 DE DE69937181T patent/DE69937181T2/de not_active Expired - Lifetime
-
2001
- 2001-07-30 US US09/916,305 patent/US6942548B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10217103A (ja) * | 1997-02-07 | 1998-08-18 | Ebara Corp | 研磨用クロスのドレッサー及びその製造方法 |
JPH10315131A (ja) * | 1997-05-23 | 1998-12-02 | Hitachi Ltd | 半導体ウエハの研磨方法およびその装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0999013B1 (fr) | 2007-09-26 |
EP0999013A4 (fr) | 2004-07-14 |
SG119138A1 (en) | 2006-02-28 |
KR20010014244A (ko) | 2001-02-26 |
US6413149B1 (en) | 2002-07-02 |
KR100567981B1 (ko) | 2006-04-05 |
EP0999013A1 (fr) | 2000-05-10 |
WO1999055493A1 (fr) | 1999-11-04 |
DE69937181D1 (de) | 2007-11-08 |
DE69937181T2 (de) | 2008-06-19 |
US20020006768A1 (en) | 2002-01-17 |
US6942548B2 (en) | 2005-09-13 |
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