SG137847A1 - Polishing pad - Google Patents

Polishing pad

Info

Publication number
SG137847A1
SG137847A1 SG200717610-0A SG2007176100A SG137847A1 SG 137847 A1 SG137847 A1 SG 137847A1 SG 2007176100 A SG2007176100 A SG 2007176100A SG 137847 A1 SG137847 A1 SG 137847A1
Authority
SG
Singapore
Prior art keywords
polishing pad
optionally
polishing
conductors
slurry
Prior art date
Application number
SG200717610-0A
Other languages
English (en)
Inventor
Jean Vangsness
Oscar Kai Chi Hsu
Alaka Potnis
Original Assignee
Freudenberg Nonwovens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freudenberg Nonwovens filed Critical Freudenberg Nonwovens
Publication of SG137847A1 publication Critical patent/SG137847A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
SG200717610-0A 2004-05-11 2005-05-04 Polishing pad SG137847A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/843,111 US7086932B2 (en) 2004-05-11 2004-05-11 Polishing pad

Publications (1)

Publication Number Publication Date
SG137847A1 true SG137847A1 (en) 2007-12-28

Family

ID=35310034

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200717611-8A SG137848A1 (en) 2004-05-11 2005-05-04 Polishing pad
SG200717610-0A SG137847A1 (en) 2004-05-11 2005-05-04 Polishing pad

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200717611-8A SG137848A1 (en) 2004-05-11 2005-05-04 Polishing pad

Country Status (8)

Country Link
US (4) US7086932B2 (zh)
EP (1) EP1755826B1 (zh)
JP (3) JP2007537050A (zh)
KR (1) KR101129905B1 (zh)
CN (1) CN101022918B (zh)
SG (2) SG137848A1 (zh)
TW (1) TWI293911B (zh)
WO (1) WO2005110675A2 (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI280175B (en) * 2004-02-17 2007-05-01 Skc Co Ltd Base pad of polishing pad and multi-layer pad comprising the same
US20070010175A1 (en) 2005-07-07 2007-01-11 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing same
WO2007016498A2 (en) * 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
TWI409136B (zh) 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
JP5027468B2 (ja) * 2006-09-15 2012-09-19 日本ミクロコーティング株式会社 プローブクリーニング用又はプローブ加工用シート、及びプローブ加工方法
US20080171493A1 (en) * 2007-01-12 2008-07-17 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing the same
US20110003536A1 (en) * 2007-01-12 2011-01-06 San Fang Chemical Industry Co., Ltd. Polishing Pad and Method of Producing the Same
JP5061694B2 (ja) * 2007-04-05 2012-10-31 信越半導体株式会社 研磨パッドの製造方法及び研磨パッド並びにウエーハの研磨方法
US9730395B2 (en) * 2007-07-11 2017-08-15 Gary R. Hartman Modular growing panel system and method for covering structures with vegetation
US8449357B2 (en) * 2007-10-05 2013-05-28 Chien-Min Sung Polymeric fiber CMP pad and associated methods
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
WO2009088945A1 (en) * 2007-12-31 2009-07-16 Innopad, Inc. Chemical-mechanical planarization pad
WO2009123659A1 (en) * 2008-04-01 2009-10-08 Innopad, Inc. Polishing pad with controlled void formation
US8684794B2 (en) * 2008-04-11 2014-04-01 Fns Tech Co., Ltd. Chemical mechanical planarization pad with void network
US20100092746A1 (en) * 2008-10-14 2010-04-15 Jean-Marie Coant Nonwoven material containing benefiting particles and method of making
TWI520812B (zh) * 2009-01-05 2016-02-11 音諾帕德股份有限公司 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
US8708162B2 (en) 2009-08-19 2014-04-29 Johns Manville Polymeric fiber webs with binder comprising salt of inorganic acid
US8651285B2 (en) 2009-08-19 2014-02-18 Johns Manville Performance polymeric fiber webs
JP6004941B2 (ja) * 2009-12-30 2016-10-12 スリーエム イノベイティブ プロパティズ カンパニー 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法
BR112013014582A2 (pt) 2010-12-14 2016-09-20 3M Innovative Properties Co artigo de polimento fibroso de peça única
EP2720830B1 (en) 2011-06-14 2017-07-26 3M Innovative Properties Company Self-contained fibrous buffing article
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
DE102013201663B4 (de) * 2012-12-04 2020-04-23 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
CN103252710B (zh) * 2013-04-08 2016-04-20 清华大学 用于超硬材料的化学机械平坦化抛光垫及制备、抛光方法
TWI551396B (zh) * 2013-10-03 2016-10-01 三芳化學工業股份有限公司 拋光墊及其製造方法
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US9737971B2 (en) * 2016-01-12 2017-08-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad, polishing layer analyzer and method
US11565366B2 (en) * 2016-06-01 2023-01-31 Fujibo Holdings, Inc. Polishing pad and method for producing the same, and method for producing polished product
EP3299123B1 (en) * 2016-09-23 2019-05-08 Carl Freudenberg KG Support for abrasive
EP3542957B1 (en) * 2016-11-16 2021-04-28 Teijin Frontier Co., Ltd. Polishing pad and method for manufacturing same
US20220058495A1 (en) * 2020-08-20 2022-02-24 Toyota Motor Engineering & Manufacturing North America, Inc. Rest stop recommendation system
CN112247830A (zh) * 2020-09-30 2021-01-22 南京华易泰电子科技有限公司 一种带式抛光垫

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607159A (en) * 1967-05-12 1971-09-21 Norton Co Saturated, resilient, flexible and porous abrasive laminate
US4255164A (en) * 1979-04-30 1981-03-10 Minnesota Mining And Manufacturing Company Fining sheet and method of making and using the same
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4789648A (en) * 1985-10-28 1988-12-06 International Business Machines Corporation Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
US4927432A (en) 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
JPS6392319A (ja) * 1987-04-30 1988-04-22 帝人株式会社 塗布及び払拭用の極細立毛織物
JP2668016B2 (ja) 1988-09-21 1997-10-27 スピードファム株式会社 ポリッシングパッド及びその製造方法
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
JPH05327367A (ja) 1992-05-26 1993-12-10 Mitsubishi Denki Eng Kk 電流・電圧変換回路
US5310455A (en) * 1992-07-10 1994-05-10 Lsi Logic Corporation Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JPH06221857A (ja) 1993-01-22 1994-08-12 Murata Mfg Co Ltd 振動ジャイロ
US5346516A (en) * 1993-09-16 1994-09-13 Tepco, Ltd. Non-woven abrasive material containing hydrogenated vegetable oils
US5632668A (en) * 1993-10-29 1997-05-27 Minnesota Mining And Manufacturing Company Method for the polishing and finishing of optical lenses
JPH08205213A (ja) 1995-01-27 1996-08-09 Oki Electric Ind Co Ltd 構内交換機
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP3149340B2 (ja) 1995-08-22 2001-03-26 ロデール・ニッタ株式会社 研磨用パッド
US5645736A (en) * 1995-12-29 1997-07-08 Symbios Logic Inc. Method for polishing a wafer
US5879226A (en) * 1996-05-21 1999-03-09 Micron Technology, Inc. Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US5795218A (en) 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
US5702292A (en) * 1996-10-31 1997-12-30 Micron Technology, Inc. Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
JPH10156705A (ja) 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US5916011A (en) 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
JPH10225864A (ja) 1997-02-17 1998-08-25 Sony Corp 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法
US5910471A (en) * 1997-03-07 1999-06-08 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
US6454633B1 (en) * 1997-04-04 2002-09-24 Rodel Holdings Inc. Polishing pads of flocked hollow fibers and methods relating thereto
WO1998050201A1 (en) * 1997-05-09 1998-11-12 Rodel Holdings, Inc. Mosaic polishing pads and methods relating thereto
TW375556B (en) * 1997-07-02 1999-12-01 Matsushita Electric Ind Co Ltd Method of polishing the wafer and finishing the polishing pad
US5919082A (en) * 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP3774302B2 (ja) * 1997-09-11 2006-05-10 株式会社クラレ 研磨用布帛
JPH1199479A (ja) * 1997-09-30 1999-04-13 Teijin Ltd 研磨パッド
JPH11138422A (ja) * 1997-11-05 1999-05-25 Speedfam Co Ltd 半導体基板の加工方法
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6315857B1 (en) * 1998-07-10 2001-11-13 Mosel Vitelic, Inc. Polishing pad shaping and patterning
JP4257687B2 (ja) * 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
JP2001001252A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6602111B1 (en) * 1999-07-16 2003-08-05 Seimi Chemical Co., Ltd. Abrasive
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
JP2001098425A (ja) * 1999-09-28 2001-04-10 Toray Ind Inc 研磨用複合繊維
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6733373B1 (en) * 2000-03-31 2004-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US6712681B1 (en) * 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6383066B1 (en) * 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6340325B1 (en) * 2000-06-29 2002-01-22 International Business Machines Corporation Polishing pad grooving method and apparatus
JP2002075934A (ja) * 2000-08-29 2002-03-15 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
US6503129B1 (en) * 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
AU2001297847A1 (en) * 2000-11-20 2002-12-23 Freudenberg Nonwovens, L.P. Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6663474B2 (en) * 2001-03-19 2003-12-16 United Microelectronics Corp. Apparatus and system of chemical mechanical polishing
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
US20030013397A1 (en) * 2001-06-27 2003-01-16 Rhoades Robert L. Polishing pad of polymer coating
JP2003094320A (ja) * 2001-09-25 2003-04-03 Toray Ind Inc 研磨布
US7374474B2 (en) * 2001-10-09 2008-05-20 Hitachi Chemical Co., Ltd. Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP
JP2003117808A (ja) 2001-10-15 2003-04-23 Mitsubishi Paper Mills Ltd 被研磨物保持用基材
US20030100250A1 (en) * 2001-10-29 2003-05-29 West Thomas E. Pads for CMP and polishing substrates
US20030083003A1 (en) * 2001-10-29 2003-05-01 West Thomas E. Polishing pads and manufacturing methods
JP3693037B2 (ja) * 2002-04-25 2005-09-07 東レ株式会社 磁気ディスク研磨用織物
JP2003311604A (ja) * 2002-04-26 2003-11-05 Chiyoda Kk 研磨パッド
JP2004111940A (ja) * 2002-08-26 2004-04-08 Tokyo Seimitsu Co Ltd 研磨パッド及びこれを用いた研磨装置、研磨方法
JP3988611B2 (ja) * 2002-10-09 2007-10-10 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005019669A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd 研磨パッド、研磨装置、及びウェハの研磨方法
US20070161324A1 (en) 2006-01-12 2007-07-12 Kevin Garrett Configurable stuffed toy having adjustable appendages

Also Published As

Publication number Publication date
US7086932B2 (en) 2006-08-08
US20060223424A1 (en) 2006-10-05
TW200609083A (en) 2006-03-16
KR101129905B1 (ko) 2012-03-23
JP2012081583A (ja) 2012-04-26
TWI293911B (en) 2008-03-01
CN101022918B (zh) 2012-09-19
US20050255794A1 (en) 2005-11-17
WO2005110675A3 (en) 2006-01-12
KR20070049112A (ko) 2007-05-10
JP2007537050A (ja) 2007-12-20
US20070161342A1 (en) 2007-07-12
EP1755826B1 (en) 2015-04-01
US7534163B2 (en) 2009-05-19
EP1755826A4 (en) 2008-01-23
US7357704B2 (en) 2008-04-15
EP1755826A2 (en) 2007-02-28
CN101022918A (zh) 2007-08-22
US20080146131A1 (en) 2008-06-19
WO2005110675A2 (en) 2005-11-24
SG137848A1 (en) 2007-12-28
JP2014123777A (ja) 2014-07-03

Similar Documents

Publication Publication Date Title
TW200609083A (en) Polishing pad
EP2292380A3 (en) A method for maintaining a hard, smooth floor surface comprising a polymer material
DE60219532D1 (de) Gesintertes, polykristallines zirkonia enthaltende schleifteilchen
EP2025454A3 (en) Improved chemical mechanical polishing pad and methods of making and using same
EP2025460A3 (en) Improved chemical mechanical polishing pad and methods of making and using same
UA88099C2 (ru) Способ и устройство для обработки твердой поверхности и машина для обработки поверхности пола
NZ586833A (en) Interface pad for use between an abrasive article and a support tool
TW200628262A (en) Polishing pad
WO2004071991A3 (en) Methods of making ceramics
MY135136A (en) Undulated pad conditioner and method of using same
EP1197296A3 (en) Pad conditioning disk
BRPI0510799B1 (pt) material abrasivo de pano nço tecido substancialmente elevado.
SG164366A1 (en) Methods and tool for maintenance of hard surfaces, and a method for manufacturing such a tool
TW200705376A (en) Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
WO2007016498A3 (en) Nonwoven polishing pads for chemical mechanical polishing
DE502005010069D1 (de) Schleifschuhbelag
TW200531784A (en) Chemical mechanical polishing pad
WO2003074227A3 (en) Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
TW200513346A (en) Polishing pad
TW200615368A (en) Polishing pad and method for manufacturing the polishing pad
TW200516661A (en) Polishing element