TW200516661A - Polishing element - Google Patents

Polishing element

Info

Publication number
TW200516661A
TW200516661A TW092131624A TW92131624A TW200516661A TW 200516661 A TW200516661 A TW 200516661A TW 092131624 A TW092131624 A TW 092131624A TW 92131624 A TW92131624 A TW 92131624A TW 200516661 A TW200516661 A TW 200516661A
Authority
TW
Taiwan
Prior art keywords
polishing
pad
sub
polishing element
platen
Prior art date
Application number
TW092131624A
Other languages
Chinese (zh)
Other versions
TWI227521B (en
Inventor
Teng-Chun Tsai
Chia-Rung Hsu
Art Yu
Gene Li
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW092131624A priority Critical patent/TWI227521B/en
Priority to US10/718,466 priority patent/US20050101233A1/en
Application granted granted Critical
Publication of TWI227521B publication Critical patent/TWI227521B/en
Publication of TW200516661A publication Critical patent/TW200516661A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Abstract

A polishing element comprising a polishing platen, a polishing sub-pad and a polishing pad is provided. The polishing sub-pad is set up over the polishing platen and the polishing pad is set up over the polishing sub-pad. A first surface of the polishing sub-pad interfaces with the polishing pad and a second surface of the polishing sub-pad interfaces with the platen. Either the first surface or the second surface of the polishing sub-pad is an undulating surface.
TW092131624A 2003-11-12 2003-11-12 Polishing element TWI227521B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092131624A TWI227521B (en) 2003-11-12 2003-11-12 Polishing element
US10/718,466 US20050101233A1 (en) 2003-11-12 2003-11-19 Polishing element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092131624A TWI227521B (en) 2003-11-12 2003-11-12 Polishing element

Publications (2)

Publication Number Publication Date
TWI227521B TWI227521B (en) 2005-02-01
TW200516661A true TW200516661A (en) 2005-05-16

Family

ID=34546507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092131624A TWI227521B (en) 2003-11-12 2003-11-12 Polishing element

Country Status (2)

Country Link
US (1) US20050101233A1 (en)
TW (1) TWI227521B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100721196B1 (en) 2005-05-24 2007-05-23 주식회사 하이닉스반도체 Polishing pad and using chemical mechanical polishing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5435772A (en) * 1993-04-30 1995-07-25 Motorola, Inc. Method of polishing a semiconductor substrate
JP3329644B2 (en) * 1995-07-21 2002-09-30 株式会社東芝 Polishing pad, polishing apparatus and polishing method
JP2865061B2 (en) * 1996-06-27 1999-03-08 日本電気株式会社 Polishing pad, polishing apparatus, and semiconductor device manufacturing method
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6666751B1 (en) * 2000-07-17 2003-12-23 Micron Technology, Inc. Deformable pad for chemical mechanical polishing

Also Published As

Publication number Publication date
US20050101233A1 (en) 2005-05-12
TWI227521B (en) 2005-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees