SG115831A1 - Polishing composition and polishing method - Google Patents

Polishing composition and polishing method

Info

Publication number
SG115831A1
SG115831A1 SG200502192A SG200502192A SG115831A1 SG 115831 A1 SG115831 A1 SG 115831A1 SG 200502192 A SG200502192 A SG 200502192A SG 200502192 A SG200502192 A SG 200502192A SG 115831 A1 SG115831 A1 SG 115831A1
Authority
SG
Singapore
Prior art keywords
polishing
composition
polishing composition
polishing method
Prior art date
Application number
SG200502192A
Other languages
English (en)
Inventor
Oh Junhui
Kawamura Atsunori
Matsuda Tsuyoshi
Hirano Tatsuhiko
Sakai Kenji
Hori Katsunobu
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG115831A1 publication Critical patent/SG115831A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200502192A 2004-03-24 2005-03-22 Polishing composition and polishing method SG115831A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004087261A JP4644434B2 (ja) 2004-03-24 2004-03-24 研磨用組成物

Publications (1)

Publication Number Publication Date
SG115831A1 true SG115831A1 (en) 2005-10-28

Family

ID=34858438

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502192A SG115831A1 (en) 2004-03-24 2005-03-22 Polishing composition and polishing method

Country Status (7)

Country Link
US (1) US7550388B2 (zh)
EP (1) EP1580248A1 (zh)
JP (1) JP4644434B2 (zh)
KR (1) KR101110719B1 (zh)
CN (2) CN1837320B (zh)
SG (1) SG115831A1 (zh)
TW (2) TWI466991B (zh)

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KR102209690B1 (ko) * 2014-06-27 2021-01-29 동우 화인켐 주식회사 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
MY186924A (en) * 2015-04-06 2021-08-26 Cmc Mat Inc Cmp composition and methods for polishing rigid disks
KR102463863B1 (ko) 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
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CN108250977B (zh) * 2016-12-28 2021-08-27 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
CN107474744A (zh) * 2017-08-04 2017-12-15 江苏云瀚股份有限公司 一种汽车用玻璃剥光剂及其制备方法
US11273120B2 (en) * 2019-11-18 2022-03-15 Actera Ingredients, Inc. Hair treatments
MX2023009458A (es) * 2021-02-19 2023-08-25 Procter & Gamble Composiciones para el cuidado bucal que comprenden peroxido y alumina.
CN115873508A (zh) * 2022-12-26 2023-03-31 博力思(天津)电子科技有限公司 去除速率高且表面粗糙度低的SiC衬底抛光液及抛光工艺

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Also Published As

Publication number Publication date
TWI447213B (zh) 2014-08-01
JP2005277043A (ja) 2005-10-06
TW200533735A (en) 2005-10-16
US7550388B2 (en) 2009-06-23
CN1837320A (zh) 2006-09-27
TWI466991B (zh) 2015-01-01
CN1837320B (zh) 2012-05-09
KR20060044569A (ko) 2006-05-16
JP4644434B2 (ja) 2011-03-02
TW201341516A (zh) 2013-10-16
CN101638556A (zh) 2010-02-03
KR101110719B1 (ko) 2012-02-29
EP1580248A1 (en) 2005-09-28
CN101638556B (zh) 2012-12-26
US20050215060A1 (en) 2005-09-29

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