SG115809A1 - Dicing die bonding film - Google Patents
Dicing die bonding filmInfo
- Publication number
- SG115809A1 SG115809A1 SG200501883A SG200501883A SG115809A1 SG 115809 A1 SG115809 A1 SG 115809A1 SG 200501883 A SG200501883 A SG 200501883A SG 200501883 A SG200501883 A SG 200501883A SG 115809 A1 SG115809 A1 SG 115809A1
- Authority
- SG
- Singapore
- Prior art keywords
- bonding film
- die bonding
- dicing die
- dicing
- film
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/20—Pins, blades, or sockets shaped, or provided with separate member, to retain co-operating parts together
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2491—Terminal blocks structurally associated with plugs or sockets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
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- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/815,420 US20050227064A1 (en) | 2004-04-01 | 2004-04-01 | Dicing die bonding film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG115809A1 true SG115809A1 (en) | 2005-10-28 |
Family
ID=34912672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200501883A SG115809A1 (en) | 2004-04-01 | 2005-03-29 | Dicing die bonding film |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050227064A1 (fr) |
EP (1) | EP1585170A3 (fr) |
JP (1) | JP4902965B2 (fr) |
KR (1) | KR20060045432A (fr) |
CN (1) | CN1680504A (fr) |
SG (1) | SG115809A1 (fr) |
TW (1) | TWI373503B (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
KR101204197B1 (ko) | 2003-06-06 | 2012-11-26 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체장치의 제조방법 |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US20070003758A1 (en) * | 2004-04-01 | 2007-01-04 | National Starch And Chemical Investment Holding Corporation | Dicing die bonding film |
KR100635053B1 (ko) | 2005-06-21 | 2006-10-16 | 도레이새한 주식회사 | 전자부품용 접착테이프 |
WO2007067393A2 (fr) * | 2005-12-05 | 2007-06-14 | Corning Cable Systems Llc | Gel de polyester adapte pour une utilisation avec des composants polycarbonate |
KR100593814B1 (ko) * | 2005-12-06 | 2006-06-28 | 에이스 인더스트리 주식회사 | 반도체 다이본딩용 점착테이프 |
CN101326051A (zh) * | 2005-12-15 | 2008-12-17 | 国家淀粉及化学投资控股公司 | 用于芯片堆叠的多层粘合膜 |
US20100019365A1 (en) * | 2006-09-12 | 2010-01-28 | Nitto Denko Corporation | Dicing/die bonding film |
KR100855786B1 (ko) * | 2006-12-15 | 2008-09-01 | 엘에스엠트론 주식회사 | 스택 패키지 스페이서용 다이 다이싱 필름 |
KR100844383B1 (ko) | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | 반도체 칩 적층용 접착 필름 |
JP4950777B2 (ja) * | 2007-06-20 | 2012-06-13 | 積水化学工業株式会社 | 接着シート、ダイシングダイボンディングテープ及び半導体装置の製造方法 |
EP2265682A1 (fr) * | 2008-03-31 | 2010-12-29 | Henkel Corporation | Film adhésif multicouche durcissable aux uv |
CN101402831B (zh) * | 2008-11-06 | 2012-05-30 | 烟台德邦科技有限公司 | 一种热活化胶膜及其制备方法 |
JP2011060848A (ja) * | 2009-09-07 | 2011-03-24 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置 |
JP6193663B2 (ja) * | 2013-07-26 | 2017-09-06 | 日東電工株式会社 | ダイシングテープ付きダイボンドフィルム、及び、半導体装置の製造方法 |
JP5908543B2 (ja) * | 2014-08-07 | 2016-04-26 | 日東電工株式会社 | 半導体装置の製造方法 |
US10832843B2 (en) | 2015-03-17 | 2020-11-10 | The University Of Houston System | Superconductor compositions |
CN110441115B (zh) * | 2019-09-09 | 2022-02-22 | 中国科学院电工研究所 | 一种多层膜x射线波带片的制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9780A (en) * | 1853-06-14 | Stove | ||
US35533A (en) * | 1862-06-10 | Improvement in coal-oil burners | ||
US16384A (en) * | 1857-01-13 | Improvement in locomotive-lamps | ||
US160337A (en) * | 1875-03-02 | Improvement in seal-locks | ||
JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
EP0571649A1 (fr) * | 1992-05-26 | 1993-12-01 | Nitto Denko Corporation | Film support pour le découpage et le montage de plaquettes de semi-conducteur et son utilisation dans un procédé de production de puces. |
JP2002256235A (ja) * | 2001-03-01 | 2002-09-11 | Hitachi Chem Co Ltd | 接着シート、半導体装置の製造方法および半導体装置 |
JP4067308B2 (ja) * | 2002-01-15 | 2008-03-26 | リンテック株式会社 | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP2004095844A (ja) * | 2002-08-30 | 2004-03-25 | Lintec Corp | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP4316253B2 (ja) * | 2003-02-18 | 2009-08-19 | リンテック株式会社 | ウエハダイシング・接着用シートおよび半導体装置の製造方法 |
JP4372463B2 (ja) * | 2003-06-16 | 2009-11-25 | リンテック株式会社 | 半導体装置の製造方法 |
-
2004
- 2004-04-01 US US10/815,420 patent/US20050227064A1/en not_active Abandoned
-
2005
- 2005-03-29 EP EP05006799A patent/EP1585170A3/fr not_active Withdrawn
- 2005-03-29 SG SG200501883A patent/SG115809A1/en unknown
- 2005-03-31 TW TW094110164A patent/TWI373503B/zh not_active IP Right Cessation
- 2005-03-31 JP JP2005100699A patent/JP4902965B2/ja not_active Expired - Fee Related
- 2005-04-01 KR KR1020050027607A patent/KR20060045432A/ko not_active Application Discontinuation
- 2005-04-01 CN CNA2005100697454A patent/CN1680504A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1585170A2 (fr) | 2005-10-12 |
JP4902965B2 (ja) | 2012-03-21 |
JP2005290381A (ja) | 2005-10-20 |
KR20060045432A (ko) | 2006-05-17 |
TW200613503A (en) | 2006-05-01 |
US20050227064A1 (en) | 2005-10-13 |
TWI373503B (en) | 2012-10-01 |
EP1585170A3 (fr) | 2006-02-08 |
CN1680504A (zh) | 2005-10-12 |
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