SG114530A1 - Method of manufacturing a semiconductor device - Google Patents
Method of manufacturing a semiconductor deviceInfo
- Publication number
- SG114530A1 SG114530A1 SG200200837A SG200200837A SG114530A1 SG 114530 A1 SG114530 A1 SG 114530A1 SG 200200837 A SG200200837 A SG 200200837A SG 200200837 A SG200200837 A SG 200200837A SG 114530 A1 SG114530 A1 SG 114530A1
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001055383A JP2002261007A (ja) | 2001-02-28 | 2001-02-28 | 半導体装置の作製方法 |
JP2001055436A JP2002261008A (ja) | 2001-02-28 | 2001-02-28 | 半導体装置の作製方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG114530A1 true SG114530A1 (en) | 2005-09-28 |
Family
ID=26610350
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200505022-4A SG143975A1 (en) | 2001-02-28 | 2002-02-18 | Method of manufacturing a semiconductor device |
SG200200837A SG114530A1 (en) | 2001-02-28 | 2002-02-18 | Method of manufacturing a semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200505022-4A SG143975A1 (en) | 2001-02-28 | 2002-02-18 | Method of manufacturing a semiconductor device |
Country Status (6)
Country | Link |
---|---|
US (2) | US7160784B2 (zh) |
KR (1) | KR100856840B1 (zh) |
CN (1) | CN1248295C (zh) |
MY (1) | MY131900A (zh) |
SG (2) | SG143975A1 (zh) |
TW (1) | TW533463B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7294535B1 (en) | 1998-07-15 | 2007-11-13 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same |
US7153729B1 (en) * | 1998-07-15 | 2006-12-26 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same |
US7084016B1 (en) * | 1998-07-17 | 2006-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same |
US7282398B2 (en) * | 1998-07-17 | 2007-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device and method of fabricating the same |
US6559036B1 (en) | 1998-08-07 | 2003-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
US6770518B2 (en) * | 2001-01-29 | 2004-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
SG114529A1 (en) * | 2001-02-23 | 2005-09-28 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
SG143975A1 (en) * | 2001-02-28 | 2008-07-29 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
US7964925B2 (en) * | 2006-10-13 | 2011-06-21 | Hewlett-Packard Development Company, L.P. | Photodiode module and apparatus including multiple photodiode modules |
CN1691277B (zh) * | 2004-03-26 | 2010-05-26 | 株式会社半导体能源研究所 | 用于制造半导体器件的方法 |
US20060197088A1 (en) * | 2005-03-07 | 2006-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
US8575614B2 (en) * | 2007-04-25 | 2013-11-05 | Sharp Kabushiki Kaisha | Display device |
EP2009694A3 (en) * | 2007-06-29 | 2017-06-21 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method thereof |
KR100962610B1 (ko) | 2008-03-17 | 2010-06-11 | 주식회사 티지솔라 | 열처리 방법 |
US8900715B2 (en) * | 2008-06-11 | 2014-12-02 | Infineon Technologies Ag | Semiconductor device |
WO2010016197A1 (ja) * | 2008-08-04 | 2010-02-11 | シャープ株式会社 | 液晶表示パネル |
WO2013080248A1 (ja) | 2011-11-29 | 2013-06-06 | パナソニック株式会社 | 薄膜トランジスタアレイの製造方法、薄膜トランジスタアレイ及び表示装置 |
KR20140029987A (ko) * | 2012-08-31 | 2014-03-11 | 삼성디스플레이 주식회사 | 캐리어 기판, 이의 제조방법 및 이를 이용한 플렉서블 디스플레이 장치의 제조방법 |
US20160265140A1 (en) * | 2012-10-31 | 2016-09-15 | Namiki Seimitsu Houseki Kabushiki Kaisha | Single crystal substrate, manufacturing method for single crystal substrate, manufacturing method for single crystal substrate with multilayer film, and element manufacturing method |
CN103996689B (zh) * | 2013-02-18 | 2017-06-16 | 群创光电股份有限公司 | 有机发光二极管显示装置及其制造方法 |
TWI505460B (zh) | 2013-02-18 | 2015-10-21 | Innolux Corp | 有機發光二極體顯示裝置及其製造方法 |
US9768414B2 (en) | 2013-02-18 | 2017-09-19 | Innolux Corporation | Display device |
Citations (5)
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JPH06163409A (ja) * | 1992-11-19 | 1994-06-10 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US6066516A (en) * | 1995-06-26 | 2000-05-23 | Seiko Epson Corporation | Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices |
JP2000150890A (ja) * | 1998-11-11 | 2000-05-30 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2002076349A (ja) * | 2000-08-28 | 2002-03-15 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2002305148A (ja) * | 2001-01-29 | 2002-10-18 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
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US4256681A (en) | 1976-12-16 | 1981-03-17 | Semix Incorporated | Method of producing semicrystalline silicon |
JPS6310573A (ja) | 1986-07-02 | 1988-01-18 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2749181B2 (ja) | 1990-05-11 | 1998-05-13 | 株式会社日立製作所 | 内燃機関の運転制御方法及びその電子制御装置 |
KR0171923B1 (ko) | 1993-02-15 | 1999-02-01 | 순페이 야마자끼 | 반도체장치 제작방법 |
JP3562588B2 (ja) | 1993-02-15 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
JP3662263B2 (ja) | 1993-02-15 | 2005-06-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TW241377B (zh) | 1993-03-12 | 1995-02-21 | Semiconductor Energy Res Co Ltd | |
US5481121A (en) | 1993-05-26 | 1996-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having improved crystal orientation |
JP3450376B2 (ja) | 1993-06-12 | 2003-09-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US5488000A (en) | 1993-06-22 | 1996-01-30 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a thin film transistor using a nickel silicide layer to promote crystallization of the amorphous silicon layer |
US5663077A (en) | 1993-07-27 | 1997-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a thin film transistor in which the gate insulator comprises two oxide films |
US5529937A (en) | 1993-07-27 | 1996-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating thin film transistor |
US5923962A (en) | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
TW264575B (zh) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
JP3431041B2 (ja) | 1993-11-12 | 2003-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3221473B2 (ja) | 1994-02-03 | 2001-10-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3281756B2 (ja) * | 1994-05-31 | 2002-05-13 | 三洋電機株式会社 | 半導体装置及びそれを用いた液晶パネル |
JP3621151B2 (ja) | 1994-06-02 | 2005-02-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6326248B1 (en) | 1994-06-02 | 2001-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating semiconductor device |
JP3778456B2 (ja) | 1995-02-21 | 2006-05-24 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型薄膜半導体装置の作製方法 |
US5907770A (en) * | 1995-07-19 | 1999-05-25 | Semiconductor Energy Laboratory Co., | Method for producing semiconductor device |
JP3886554B2 (ja) * | 1995-08-18 | 2007-02-28 | 株式会社半導体エネルギー研究所 | レーザーアニール方法 |
US6902616B1 (en) | 1995-07-19 | 2005-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Method and apparatus for producing semiconductor device |
JPH0990425A (ja) * | 1995-09-19 | 1997-04-04 | Sony Corp | 表示装置 |
US5948496A (en) | 1996-09-06 | 1999-09-07 | Ricoh Company, Ltd. | Optical recording medium |
JPH1174536A (ja) | 1997-01-09 | 1999-03-16 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JP3346214B2 (ja) * | 1997-03-26 | 2002-11-18 | セイコーエプソン株式会社 | 結晶性半導体膜の製造方法、およびアニール装置および薄膜トランジスタの製造方法および液晶表示装置用アクティブマトリクス基板 |
JP3633229B2 (ja) | 1997-09-01 | 2005-03-30 | セイコーエプソン株式会社 | 発光素子の製造方法および多色表示装置の製造方法 |
US6014944A (en) | 1997-09-19 | 2000-01-18 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus for improving crystalline thin films with a contoured beam pulsed laser |
JPH11109406A (ja) | 1997-09-30 | 1999-04-23 | Sanyo Electric Co Ltd | 表示装置とその製造方法 |
JP2000114526A (ja) | 1998-08-07 | 2000-04-21 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
JP4376331B2 (ja) | 1998-08-07 | 2009-12-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6559036B1 (en) | 1998-08-07 | 2003-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP2000114173A (ja) | 1998-08-07 | 2000-04-21 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2000114172A (ja) | 1998-08-07 | 2000-04-21 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US6197623B1 (en) * | 1998-10-16 | 2001-03-06 | Seungki Joo | Method for crystallizing amorphous silicon thin-film for use in thin-film transistors and thermal annealing apparatus therefor |
TW543206B (en) | 1999-06-28 | 2003-07-21 | Semiconductor Energy Lab | EL display device and electronic device |
JP2001196699A (ja) | 2000-01-13 | 2001-07-19 | Sony Corp | 半導体素子 |
US6770518B2 (en) * | 2001-01-29 | 2004-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
SG114529A1 (en) * | 2001-02-23 | 2005-09-28 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
JP2002329668A (ja) * | 2001-02-23 | 2002-11-15 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
SG143975A1 (en) * | 2001-02-28 | 2008-07-29 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
JP4024508B2 (ja) * | 2001-10-09 | 2007-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
2002
- 2002-02-18 SG SG200505022-4A patent/SG143975A1/en unknown
- 2002-02-18 SG SG200200837A patent/SG114530A1/en unknown
- 2002-02-25 TW TW091103314A patent/TW533463B/zh not_active IP Right Cessation
- 2002-02-25 US US10/081,767 patent/US7160784B2/en not_active Expired - Fee Related
- 2002-02-25 MY MYPI20020649A patent/MY131900A/en unknown
- 2002-02-27 KR KR1020020010470A patent/KR100856840B1/ko active IP Right Grant
- 2002-02-28 CN CNB021065586A patent/CN1248295C/zh not_active Expired - Fee Related
-
2006
- 2006-08-03 US US11/498,064 patent/US7618904B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06163409A (ja) * | 1992-11-19 | 1994-06-10 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US6066516A (en) * | 1995-06-26 | 2000-05-23 | Seiko Epson Corporation | Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices |
JP2000150890A (ja) * | 1998-11-11 | 2000-05-30 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2002076349A (ja) * | 2000-08-28 | 2002-03-15 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2002305148A (ja) * | 2001-01-29 | 2002-10-18 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100856840B1 (ko) | 2008-09-05 |
US20060276012A1 (en) | 2006-12-07 |
KR20020070826A (ko) | 2002-09-11 |
CN1373503A (zh) | 2002-10-09 |
SG143975A1 (en) | 2008-07-29 |
CN1248295C (zh) | 2006-03-29 |
US7618904B2 (en) | 2009-11-17 |
US7160784B2 (en) | 2007-01-09 |
MY131900A (en) | 2007-09-28 |
US20020119633A1 (en) | 2002-08-29 |
TW533463B (en) | 2003-05-21 |
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