SG114530A1 - Method of manufacturing a semiconductor device - Google Patents

Method of manufacturing a semiconductor device

Info

Publication number
SG114530A1
SG114530A1 SG200200837A SG200200837A SG114530A1 SG 114530 A1 SG114530 A1 SG 114530A1 SG 200200837 A SG200200837 A SG 200200837A SG 200200837 A SG200200837 A SG 200200837A SG 114530 A1 SG114530 A1 SG 114530A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
SG200200837A
Other languages
English (en)
Inventor
Yamazaki Shunpei
Mitsuki Toru
Takano Tamae
Original Assignee
Semiconductor Energy Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001055383A external-priority patent/JP2002261007A/ja
Priority claimed from JP2001055436A external-priority patent/JP2002261008A/ja
Application filed by Semiconductor Energy Lab filed Critical Semiconductor Energy Lab
Publication of SG114530A1 publication Critical patent/SG114530A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66757Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
SG200200837A 2001-02-28 2002-02-18 Method of manufacturing a semiconductor device SG114530A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001055383A JP2002261007A (ja) 2001-02-28 2001-02-28 半導体装置の作製方法
JP2001055436A JP2002261008A (ja) 2001-02-28 2001-02-28 半導体装置の作製方法

Publications (1)

Publication Number Publication Date
SG114530A1 true SG114530A1 (en) 2005-09-28

Family

ID=26610350

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200505022-4A SG143975A1 (en) 2001-02-28 2002-02-18 Method of manufacturing a semiconductor device
SG200200837A SG114530A1 (en) 2001-02-28 2002-02-18 Method of manufacturing a semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200505022-4A SG143975A1 (en) 2001-02-28 2002-02-18 Method of manufacturing a semiconductor device

Country Status (6)

Country Link
US (2) US7160784B2 (zh)
KR (1) KR100856840B1 (zh)
CN (1) CN1248295C (zh)
MY (1) MY131900A (zh)
SG (2) SG143975A1 (zh)
TW (1) TW533463B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7294535B1 (en) 1998-07-15 2007-11-13 Semiconductor Energy Laboratory Co., Ltd. Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
US7153729B1 (en) * 1998-07-15 2006-12-26 Semiconductor Energy Laboratory Co., Ltd. Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
US7084016B1 (en) * 1998-07-17 2006-08-01 Semiconductor Energy Laboratory Co., Ltd. Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
US7282398B2 (en) * 1998-07-17 2007-10-16 Semiconductor Energy Laboratory Co., Ltd. Crystalline semiconductor thin film, method of fabricating the same, semiconductor device and method of fabricating the same
US6559036B1 (en) 1998-08-07 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US6770518B2 (en) * 2001-01-29 2004-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
SG114529A1 (en) * 2001-02-23 2005-09-28 Semiconductor Energy Lab Method of manufacturing a semiconductor device
SG143975A1 (en) * 2001-02-28 2008-07-29 Semiconductor Energy Lab Method of manufacturing a semiconductor device
US7964925B2 (en) * 2006-10-13 2011-06-21 Hewlett-Packard Development Company, L.P. Photodiode module and apparatus including multiple photodiode modules
CN1691277B (zh) * 2004-03-26 2010-05-26 株式会社半导体能源研究所 用于制造半导体器件的方法
US20060197088A1 (en) * 2005-03-07 2006-09-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US8575614B2 (en) * 2007-04-25 2013-11-05 Sharp Kabushiki Kaisha Display device
EP2009694A3 (en) * 2007-06-29 2017-06-21 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
KR100962610B1 (ko) 2008-03-17 2010-06-11 주식회사 티지솔라 열처리 방법
US8900715B2 (en) * 2008-06-11 2014-12-02 Infineon Technologies Ag Semiconductor device
WO2010016197A1 (ja) * 2008-08-04 2010-02-11 シャープ株式会社 液晶表示パネル
WO2013080248A1 (ja) 2011-11-29 2013-06-06 パナソニック株式会社 薄膜トランジスタアレイの製造方法、薄膜トランジスタアレイ及び表示装置
KR20140029987A (ko) * 2012-08-31 2014-03-11 삼성디스플레이 주식회사 캐리어 기판, 이의 제조방법 및 이를 이용한 플렉서블 디스플레이 장치의 제조방법
US20160265140A1 (en) * 2012-10-31 2016-09-15 Namiki Seimitsu Houseki Kabushiki Kaisha Single crystal substrate, manufacturing method for single crystal substrate, manufacturing method for single crystal substrate with multilayer film, and element manufacturing method
CN103996689B (zh) * 2013-02-18 2017-06-16 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
TWI505460B (zh) 2013-02-18 2015-10-21 Innolux Corp 有機發光二極體顯示裝置及其製造方法
US9768414B2 (en) 2013-02-18 2017-09-19 Innolux Corporation Display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163409A (ja) * 1992-11-19 1994-06-10 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US6066516A (en) * 1995-06-26 2000-05-23 Seiko Epson Corporation Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices
JP2000150890A (ja) * 1998-11-11 2000-05-30 Seiko Epson Corp 半導体装置の製造方法
JP2002076349A (ja) * 2000-08-28 2002-03-15 Seiko Epson Corp 半導体装置の製造方法
JP2002305148A (ja) * 2001-01-29 2002-10-18 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256681A (en) 1976-12-16 1981-03-17 Semix Incorporated Method of producing semicrystalline silicon
JPS6310573A (ja) 1986-07-02 1988-01-18 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2749181B2 (ja) 1990-05-11 1998-05-13 株式会社日立製作所 内燃機関の運転制御方法及びその電子制御装置
KR0171923B1 (ko) 1993-02-15 1999-02-01 순페이 야마자끼 반도체장치 제작방법
JP3562588B2 (ja) 1993-02-15 2004-09-08 株式会社半導体エネルギー研究所 半導体装置の製造方法
JP3662263B2 (ja) 1993-02-15 2005-06-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
TW241377B (zh) 1993-03-12 1995-02-21 Semiconductor Energy Res Co Ltd
US5481121A (en) 1993-05-26 1996-01-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having improved crystal orientation
JP3450376B2 (ja) 1993-06-12 2003-09-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5488000A (en) 1993-06-22 1996-01-30 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a thin film transistor using a nickel silicide layer to promote crystallization of the amorphous silicon layer
US5663077A (en) 1993-07-27 1997-09-02 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a thin film transistor in which the gate insulator comprises two oxide films
US5529937A (en) 1993-07-27 1996-06-25 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating thin film transistor
US5923962A (en) 1993-10-29 1999-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
TW264575B (zh) 1993-10-29 1995-12-01 Handotai Energy Kenkyusho Kk
JP3431041B2 (ja) 1993-11-12 2003-07-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3221473B2 (ja) 1994-02-03 2001-10-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3281756B2 (ja) * 1994-05-31 2002-05-13 三洋電機株式会社 半導体装置及びそれを用いた液晶パネル
JP3621151B2 (ja) 1994-06-02 2005-02-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6326248B1 (en) 1994-06-02 2001-12-04 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating semiconductor device
JP3778456B2 (ja) 1995-02-21 2006-05-24 株式会社半導体エネルギー研究所 絶縁ゲイト型薄膜半導体装置の作製方法
US5907770A (en) * 1995-07-19 1999-05-25 Semiconductor Energy Laboratory Co., Method for producing semiconductor device
JP3886554B2 (ja) * 1995-08-18 2007-02-28 株式会社半導体エネルギー研究所 レーザーアニール方法
US6902616B1 (en) 1995-07-19 2005-06-07 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for producing semiconductor device
JPH0990425A (ja) * 1995-09-19 1997-04-04 Sony Corp 表示装置
US5948496A (en) 1996-09-06 1999-09-07 Ricoh Company, Ltd. Optical recording medium
JPH1174536A (ja) 1997-01-09 1999-03-16 Sanyo Electric Co Ltd 半導体装置の製造方法
JP3346214B2 (ja) * 1997-03-26 2002-11-18 セイコーエプソン株式会社 結晶性半導体膜の製造方法、およびアニール装置および薄膜トランジスタの製造方法および液晶表示装置用アクティブマトリクス基板
JP3633229B2 (ja) 1997-09-01 2005-03-30 セイコーエプソン株式会社 発光素子の製造方法および多色表示装置の製造方法
US6014944A (en) 1997-09-19 2000-01-18 The United States Of America As Represented By The Secretary Of The Navy Apparatus for improving crystalline thin films with a contoured beam pulsed laser
JPH11109406A (ja) 1997-09-30 1999-04-23 Sanyo Electric Co Ltd 表示装置とその製造方法
JP2000114526A (ja) 1998-08-07 2000-04-21 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP4376331B2 (ja) 1998-08-07 2009-12-02 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6559036B1 (en) 1998-08-07 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP2000114173A (ja) 1998-08-07 2000-04-21 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2000114172A (ja) 1998-08-07 2000-04-21 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US6197623B1 (en) * 1998-10-16 2001-03-06 Seungki Joo Method for crystallizing amorphous silicon thin-film for use in thin-film transistors and thermal annealing apparatus therefor
TW543206B (en) 1999-06-28 2003-07-21 Semiconductor Energy Lab EL display device and electronic device
JP2001196699A (ja) 2000-01-13 2001-07-19 Sony Corp 半導体素子
US6770518B2 (en) * 2001-01-29 2004-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
SG114529A1 (en) * 2001-02-23 2005-09-28 Semiconductor Energy Lab Method of manufacturing a semiconductor device
JP2002329668A (ja) * 2001-02-23 2002-11-15 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
SG143975A1 (en) * 2001-02-28 2008-07-29 Semiconductor Energy Lab Method of manufacturing a semiconductor device
JP4024508B2 (ja) * 2001-10-09 2007-12-19 株式会社半導体エネルギー研究所 半導体装置の作製方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163409A (ja) * 1992-11-19 1994-06-10 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US6066516A (en) * 1995-06-26 2000-05-23 Seiko Epson Corporation Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices
JP2000150890A (ja) * 1998-11-11 2000-05-30 Seiko Epson Corp 半導体装置の製造方法
JP2002076349A (ja) * 2000-08-28 2002-03-15 Seiko Epson Corp 半導体装置の製造方法
JP2002305148A (ja) * 2001-01-29 2002-10-18 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法

Also Published As

Publication number Publication date
KR100856840B1 (ko) 2008-09-05
US20060276012A1 (en) 2006-12-07
KR20020070826A (ko) 2002-09-11
CN1373503A (zh) 2002-10-09
SG143975A1 (en) 2008-07-29
CN1248295C (zh) 2006-03-29
US7618904B2 (en) 2009-11-17
US7160784B2 (en) 2007-01-09
MY131900A (en) 2007-09-28
US20020119633A1 (en) 2002-08-29
TW533463B (en) 2003-05-21

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