AU2003255926A8 - Optoelectronic semiconductor device and method of manufacturing such a device - Google Patents

Optoelectronic semiconductor device and method of manufacturing such a device

Info

Publication number
AU2003255926A8
AU2003255926A8 AU2003255926A AU2003255926A AU2003255926A8 AU 2003255926 A8 AU2003255926 A8 AU 2003255926A8 AU 2003255926 A AU2003255926 A AU 2003255926A AU 2003255926 A AU2003255926 A AU 2003255926A AU 2003255926 A8 AU2003255926 A8 AU 2003255926A8
Authority
AU
Australia
Prior art keywords
manufacturing
optoelectronic semiconductor
semiconductor device
optoelectronic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003255926A
Other versions
AU2003255926A1 (en
Inventor
Anton P M Van Arendonk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of AU2003255926A1 publication Critical patent/AU2003255926A1/en
Publication of AU2003255926A8 publication Critical patent/AU2003255926A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
    • H01J3/14—Arrangements for focusing or reflecting ray or beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Light Receiving Elements (AREA)
AU2003255926A 2002-09-09 2003-08-11 Optoelectronic semiconductor device and method of manufacturing such a device Abandoned AU2003255926A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP02078668.7 2002-09-09
EP02078668 2002-09-09
PCT/IB2003/003645 WO2004023564A2 (en) 2002-09-09 2003-08-11 Optoelectronic semiconductor device and method of manufacturing such a device

Publications (2)

Publication Number Publication Date
AU2003255926A1 AU2003255926A1 (en) 2004-03-29
AU2003255926A8 true AU2003255926A8 (en) 2004-03-29

Family

ID=31970401

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003255926A Abandoned AU2003255926A1 (en) 2002-09-09 2003-08-11 Optoelectronic semiconductor device and method of manufacturing such a device

Country Status (8)

Country Link
US (1) US7351951B2 (en)
EP (1) EP1540740B1 (en)
JP (1) JP4510629B2 (en)
KR (1) KR20050038041A (en)
CN (1) CN100550430C (en)
AU (1) AU2003255926A1 (en)
TW (1) TW200417048A (en)
WO (1) WO2004023564A2 (en)

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KR20040068438A (en) * 2003-01-25 2004-07-31 삼성전자주식회사 Walking type robot and a moving method thereof
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
US7405761B2 (en) 2003-10-01 2008-07-29 Tessera North America, Inc. Thin camera having sub-pixel resolution
US8724006B2 (en) * 2004-01-26 2014-05-13 Flir Systems, Inc. Focal plane coding for digital imaging
US7773143B2 (en) * 2004-04-08 2010-08-10 Tessera North America, Inc. Thin color camera having sub-pixel resolution
US8049806B2 (en) * 2004-09-27 2011-11-01 Digitaloptics Corporation East Thin camera and associated methods
US8953087B2 (en) * 2004-04-08 2015-02-10 Flir Systems Trading Belgium Bvba Camera system and associated methods
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
TWI285417B (en) * 2005-10-17 2007-08-11 Taiwan Electronic Packaging Co Image chip package structure and packaging method thereof
CN100454566C (en) * 2005-12-01 2009-01-21 嘉田科技股份有限公司 Image sensing-detecting chip and circuit board combination
US9944031B2 (en) * 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
EP2111651A4 (en) * 2007-02-13 2011-08-17 3M Innovative Properties Co Led devices having lenses and methods of making same
US7911018B2 (en) * 2007-10-30 2011-03-22 Panasonic Corporation Optical device and method of manufacturing the same
US20090127644A1 (en) * 2007-11-16 2009-05-21 Anton Petrus M. VAN ARENDONK Semiconductor device comprising an image sensor, apparatus comprising such a semiconductor device and method of manufacturing such a semiconductor device
TWM403662U (en) * 2010-07-02 2011-05-11 Pixart Imaging Inc Sensing device and its image sensing module
CN102738183B (en) * 2011-04-12 2016-05-11 奇景光电股份有限公司 Wafer scale microelectronic imaging device
DE102011114641B4 (en) * 2011-09-30 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
US9847445B2 (en) * 2012-04-05 2017-12-19 Koninklijke Philips N.V. LED thin-film device partial singulation prior to substrate thinning or removal
US8791489B2 (en) * 2012-04-05 2014-07-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module
US9570648B2 (en) * 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
US20160104805A1 (en) * 2014-10-13 2016-04-14 Stmicroelectronics Pte Ltd Optical semiconductor device including blackened tarnishable bond wires and related methods
US9721837B2 (en) 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
RU2680983C1 (en) * 2018-02-05 2019-03-01 Российская Федерация, от имени которой выступает ФОНД ПЕРСПЕКТИВНЫХ ИССЛЕДОВАНИЙ Method of manufacturing a powerful photodetector

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Also Published As

Publication number Publication date
TW200417048A (en) 2004-09-01
JP4510629B2 (en) 2010-07-28
CN1682376A (en) 2005-10-12
WO2004023564A3 (en) 2005-01-13
KR20050038041A (en) 2005-04-25
EP1540740A2 (en) 2005-06-15
CN100550430C (en) 2009-10-14
AU2003255926A1 (en) 2004-03-29
EP1540740B1 (en) 2019-06-12
US7351951B2 (en) 2008-04-01
US20050258350A1 (en) 2005-11-24
JP2005538545A (en) 2005-12-15
WO2004023564A2 (en) 2004-03-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase