SG112986A1 - A process for producing a semiconductor device - Google Patents

A process for producing a semiconductor device

Info

Publication number
SG112986A1
SG112986A1 SG200407496A SG200407496A SG112986A1 SG 112986 A1 SG112986 A1 SG 112986A1 SG 200407496 A SG200407496 A SG 200407496A SG 200407496 A SG200407496 A SG 200407496A SG 112986 A1 SG112986 A1 SG 112986A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
producing
sticking
image
fixing
Prior art date
Application number
SG200407496A
Other languages
English (en)
Inventor
Misumi Sadahito
Matsumura Takeshi
Hosokawa Kazuhito
Kondou Hiroyuki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG112986A1 publication Critical patent/SG112986A1/en

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Classifications

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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200407496A 2003-12-19 2004-12-17 A process for producing a semiconductor device SG112986A1 (en)

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JP2005223244A (ja) * 2004-02-09 2005-08-18 Tokyo Seimitsu Co Ltd チップの飛び出し位置検出方法
US8236614B2 (en) 2005-02-21 2012-08-07 Nitto Denko Corporation Semiconductor device manufacturing method
JP2007063333A (ja) * 2005-08-29 2007-03-15 Nippon Steel Chem Co Ltd 半導体素子固定用フィルム状接着剤、それを用いた半導体装置、及び、その半導体装置の製造方法
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
JP2007258317A (ja) * 2006-03-22 2007-10-04 Shin Etsu Chem Co Ltd 半導体装置の製造方法
JP4979063B2 (ja) * 2006-06-15 2012-07-18 日東電工株式会社 半導体装置の製造方法
US20080054429A1 (en) * 2006-08-25 2008-03-06 Bolken Todd O Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers
US20090001611A1 (en) * 2006-09-08 2009-01-01 Takeshi Matsumura Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
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