GR1006447B - Μεθοδος συγκολλησης - Google Patents

Μεθοδος συγκολλησης

Info

Publication number
GR1006447B
GR1006447B GR20060100518A GR20060100518A GR1006447B GR 1006447 B GR1006447 B GR 1006447B GR 20060100518 A GR20060100518 A GR 20060100518A GR 20060100518 A GR20060100518 A GR 20060100518A GR 1006447 B GR1006447 B GR 1006447B
Authority
GR
Greece
Prior art keywords
bonding
substrates
bonding technique
deviceresulting
plexiglass
Prior art date
Application number
GR20060100518A
Other languages
English (en)
Other versions
GR20060100518A (el
Inventor
Κωνσταντινος Μισιακος
Αγγελικη Τσερεπη
Μαρια-Ελενα Βλαχοπουλου
Original Assignee
Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος"
Κωνσταντινος Μισιακος
Αγγελικη Τσερεπη
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος", Κωνσταντινος Μισιακος, Αγγελικη Τσερεπη filed Critical Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος"
Priority to GR20060100518A priority Critical patent/GR1006447B/el
Priority to PCT/GR2007/000047 priority patent/WO2008032128A1/en
Publication of GR20060100518A publication Critical patent/GR20060100518A/el
Publication of GR1006447B publication Critical patent/GR1006447B/el

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/146—Glass in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/008—Presence of styrenic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/008—Presence of (meth)acrylic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/008—Presence of epoxy resin in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/008—Presence of polysiloxane in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)

Abstract

Η παρούσα εφεύρεση παρέχει μια διεργασία γρήγορη, χαμηλού κόστους και χαμηλής θερμοκρασίας για τη συγκόλληση μικρορευστομηχανικών διατάξεων που αποτελούνται από τουλάχιστον ένα πλαστικό υπόστρωμα, και η οποία διεργασία βασίζεται στην επιφανειακή τροποποίηση των υποστρωμάτων που συνιστούν τη διάταξη που καταλήγει στη μη αντιστρεπτή συγκόλληση των υποστρωμάτων. Πρόκειται για μια γενική μέθοδο συγκόλλησης γυμνών ή δομημένων υποστρωμάτων, όπου τουλάχιστον ένα από αυτά είναι πλέξιγκλας (plexiglass) (γνωστό επίσης ως πολυ(μεθακρυλικό μεθύλιο), (polymethylmethacrylate, PMMA), πολυστυρένιο (PS), ή εποξεικό πολυμερικό υπόστρωμα (όπως η εμπορική φωτοευαίσθητη ρητίνη SU (8)).
GR20060100518A 2006-09-15 2006-09-15 Μεθοδος συγκολλησης GR1006447B (el)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης
PCT/GR2007/000047 WO2008032128A1 (en) 2006-09-15 2007-08-14 Bonding technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης

Publications (2)

Publication Number Publication Date
GR20060100518A GR20060100518A (el) 2008-04-15
GR1006447B true GR1006447B (el) 2009-06-19

Family

ID=38752416

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης

Country Status (2)

Country Link
GR (1) GR1006447B (el)
WO (1) WO2008032128A1 (el)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100868769B1 (ko) 2007-06-07 2008-11-17 삼성전자주식회사 미세유체 칩 및 이의 제조방법
ITBO20070588A1 (it) * 2007-08-13 2009-02-14 Silicon Biosystems Spa Metodo per legare uno strato di silicone ad un substrato di polimero metacrilico
FR2946658B1 (fr) * 2009-06-11 2011-08-05 Commissariat Energie Atomique Dispositif microfluidique comportant deux couches hydrophobes assemblees l'une a l'autre et procede d'assemblage
US20120184046A1 (en) * 2009-09-30 2012-07-19 Micah Atkin Selective bond reduction in microfluidic devices
US9759718B2 (en) 2009-11-23 2017-09-12 Cyvek, Inc. PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use
US10065403B2 (en) 2009-11-23 2018-09-04 Cyvek, Inc. Microfluidic assay assemblies and methods of manufacture
US10022696B2 (en) 2009-11-23 2018-07-17 Cyvek, Inc. Microfluidic assay systems employing micro-particles and methods of manufacture
US9855735B2 (en) 2009-11-23 2018-01-02 Cyvek, Inc. Portable microfluidic assay devices and methods of manufacture and use
US9500645B2 (en) 2009-11-23 2016-11-22 Cyvek, Inc. Micro-tube particles for microfluidic assays and methods of manufacture
US9700889B2 (en) 2009-11-23 2017-07-11 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
EP2504701B1 (en) 2009-11-23 2017-09-13 Cyvek, Inc. Method and apparatus for performing assays
CN106552682B (zh) 2011-03-22 2020-06-19 西维克公司 微流体装置以及制造方法和用途
CN103183310B (zh) * 2011-12-27 2015-08-19 中国科学院理化技术研究所 一种微流控芯片的低温键合的方法
KR102070469B1 (ko) * 2012-03-08 2020-01-28 싸이벡, 아이엔씨 미세유체 분석 어셈블리 및 제조방법
JP5870813B2 (ja) * 2012-03-29 2016-03-01 スターライト工業株式会社 マイクロ化学デバイスの製造方法
CN102701145A (zh) * 2012-05-04 2012-10-03 南京大学 一种高质量的pdms-聚烯烃类塑料不可逆键合的方法
WO2014010299A1 (ja) * 2012-07-09 2014-01-16 ソニー株式会社 マイクロチップ及びマイクロチップの製造方法
CN105474018B (zh) * 2013-08-23 2018-01-23 株式会社朝日精细橡胶研究所 微量化学芯片和反应装置
US10228367B2 (en) 2015-12-01 2019-03-12 ProteinSimple Segmented multi-use automated assay cartridge
US10660217B2 (en) * 2017-05-30 2020-05-19 Jun Yang Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling
JP2019107857A (ja) * 2017-12-20 2019-07-04 東芝テック株式会社 薬液吐出装置及び薬液滴下装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10237280A1 (de) * 2002-08-14 2004-03-11 Micronas Holding Gmbh Verfahren zum Verbinden von Oberflächen, Halbleiter mit verbundenen Oberflächen sowie Bio-Chip und Bio-Sensor
US20050079364A1 (en) * 2003-10-08 2005-04-14 University Of Cincinnati Silane compositions and methods for bonding rubber to metals
EP1706467B1 (en) * 2004-10-13 2011-08-24 Rheonix, Inc. Laminated microfluidic structures and method for making
KR100590581B1 (ko) * 2005-05-10 2006-06-19 삼성전자주식회사 미세유동장치 및 그 제조방법

Also Published As

Publication number Publication date
WO2008032128A8 (en) 2008-05-22
WO2008032128A1 (en) 2008-03-20
GR20060100518A (el) 2008-04-15

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PG Patent granted
ML Lapse due to non-payment of fees

Effective date: 20170411