GR20060100518A - Μεθοδος συγκολλησης - Google Patents

Μεθοδος συγκολλησης

Info

Publication number
GR20060100518A
GR20060100518A GR20060100518A GR20060100518A GR20060100518A GR 20060100518 A GR20060100518 A GR 20060100518A GR 20060100518 A GR20060100518 A GR 20060100518A GR 20060100518 A GR20060100518 A GR 20060100518A GR 20060100518 A GR20060100518 A GR 20060100518A
Authority
GR
Greece
Prior art keywords
bonding
substrates
bonding technique
deviceresulting
plexiglass
Prior art date
Application number
GR20060100518A
Other languages
English (en)
Other versions
GR1006447B (el
Inventor
Κωνσταντινος Μισιακος
Αγγελικη Τσερεπη
Μαρια Βασιλοπουλου
Original Assignee
Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος"
Κωνσταντινος Μισιακος
Αγγελικη Τσερεπη
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος", Κωνσταντινος Μισιακος, Αγγελικη Τσερεπη filed Critical Εθνικο Κεντρο Ερευνας Φυσικων Επιστημων (Εκεφε) "Δημοκριτος"
Priority to GR20060100518A priority Critical patent/GR1006447B/el
Priority to PCT/GR2007/000047 priority patent/WO2008032128A1/en
Publication of GR20060100518A publication Critical patent/GR20060100518A/el
Publication of GR1006447B publication Critical patent/GR1006447B/el

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/146—Glass in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/008—Presence of styrenic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/008—Presence of (meth)acrylic polymer in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/008—Presence of epoxy resin in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/008—Presence of polysiloxane in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)

Abstract

Η παρούσα εφεύρεση παρέχει μια διεργασία γρήγορη,χαμηλού κόστους και χαμηλής θερμοκρασίας για τη συγκόλληση μικρορευστομηχανικών διατάξεων που αποτελούνται από τουλάχιστον ένα πλαστικό υπόστρωμα, και η οποία διεργασία βασίζεται στην επιφανειακή τροποποίηση των υποστρωμάτων που συνιστούν τη διάταξηπου καταλήγει στη μη αντιστρεπτή συγκόλληση των υποστρωμάτων. Πρόκειται για μια γενική μέθοδο συγκόλλησης γυμνών ή δομημένων υποστρωμάτων, όπου τουλάχιστον ένα από αυτά είναι πλέξιγκλας (plexiglass) (γνωστό επίσης ως πολυ(μεθακρυλικό μεθύλιο), (polymethylmethacrylate, PMMA), πολυστυρένιο (PS), ή εποξεικό πολυμερικό υπόστρωμα (όπως η εμπορική φωτοευαίσθητη ρητίνη SU (8)).
GR20060100518A 2006-09-15 2006-09-15 Μεθοδος συγκολλησης GR1006447B (el)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης
PCT/GR2007/000047 WO2008032128A1 (en) 2006-09-15 2007-08-14 Bonding technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης

Publications (2)

Publication Number Publication Date
GR20060100518A true GR20060100518A (el) 2008-04-15
GR1006447B GR1006447B (el) 2009-06-19

Family

ID=38752416

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20060100518A GR1006447B (el) 2006-09-15 2006-09-15 Μεθοδος συγκολλησης

Country Status (2)

Country Link
GR (1) GR1006447B (el)
WO (1) WO2008032128A1 (el)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100868769B1 (ko) * 2007-06-07 2008-11-17 삼성전자주식회사 미세유체 칩 및 이의 제조방법
ITBO20070588A1 (it) * 2007-08-13 2009-02-14 Silicon Biosystems Spa Metodo per legare uno strato di silicone ad un substrato di polimero metacrilico
FR2946658B1 (fr) * 2009-06-11 2011-08-05 Commissariat Energie Atomique Dispositif microfluidique comportant deux couches hydrophobes assemblees l'une a l'autre et procede d'assemblage
AU2010302952A1 (en) * 2009-09-30 2012-05-10 Mycrolab Diagnostics Pty Ltd Selective bond reduction in microfluidic devices
US9759718B2 (en) 2009-11-23 2017-09-12 Cyvek, Inc. PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use
US9500645B2 (en) 2009-11-23 2016-11-22 Cyvek, Inc. Micro-tube particles for microfluidic assays and methods of manufacture
US10065403B2 (en) 2009-11-23 2018-09-04 Cyvek, Inc. Microfluidic assay assemblies and methods of manufacture
US9855735B2 (en) 2009-11-23 2018-01-02 Cyvek, Inc. Portable microfluidic assay devices and methods of manufacture and use
WO2013134742A2 (en) 2012-03-08 2013-09-12 Cyvek, Inc Micro-tube particles for microfluidic assays and methods of manufacture
US9700889B2 (en) 2009-11-23 2017-07-11 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
US9651568B2 (en) 2009-11-23 2017-05-16 Cyvek, Inc. Methods and systems for epi-fluorescent monitoring and scanning for microfluidic assays
JP5701894B2 (ja) 2009-11-23 2015-04-15 サイヴェク・インコーポレイテッド アッセイを行う方法及び装置
CA2830533C (en) 2011-03-22 2020-02-18 Cyvek, Inc. Microfluidic devices and methods of manufacture and use
CN103183310B (zh) * 2011-12-27 2015-08-19 中国科学院理化技术研究所 一种微流控芯片的低温键合的方法
JP5870813B2 (ja) * 2012-03-29 2016-03-01 スターライト工業株式会社 マイクロ化学デバイスの製造方法
CN102701145A (zh) * 2012-05-04 2012-10-03 南京大学 一种高质量的pdms-聚烯烃类塑料不可逆键合的方法
SG11201500017YA (en) * 2012-07-09 2015-02-27 Sony Corp Microchip and method for producing manufacturing the same
EP3037826A4 (en) * 2013-08-23 2017-05-10 ASAHI FR R&D Co., Ltd. Microchemical chip and reaction device
US10228367B2 (en) 2015-12-01 2019-03-12 ProteinSimple Segmented multi-use automated assay cartridge
CN108777915B (zh) * 2017-05-30 2021-07-23 杨军 在多孔基底上制造高导电特性铜-纤维混合物的方法
JP2019107857A (ja) * 2017-12-20 2019-07-04 東芝テック株式会社 薬液吐出装置及び薬液滴下装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004017071A2 (de) * 2002-08-14 2004-02-26 Micronas Holding Gmbh Verfahren zum verbinden von oberflächen, halbleiter mit verbundenen oberflächen sowie bio-chip und bio-sensor
US20050079364A1 (en) * 2003-10-08 2005-04-14 University Of Cincinnati Silane compositions and methods for bonding rubber to metals
WO2006043922A1 (en) * 2004-10-13 2006-04-27 Kionix, Inc. Laminated microfluidic structures and method for making
US20060257627A1 (en) * 2005-05-10 2006-11-16 Shim Jeo-Young Microfluidic device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004017071A2 (de) * 2002-08-14 2004-02-26 Micronas Holding Gmbh Verfahren zum verbinden von oberflächen, halbleiter mit verbundenen oberflächen sowie bio-chip und bio-sensor
US20050079364A1 (en) * 2003-10-08 2005-04-14 University Of Cincinnati Silane compositions and methods for bonding rubber to metals
WO2006043922A1 (en) * 2004-10-13 2006-04-27 Kionix, Inc. Laminated microfluidic structures and method for making
US20060257627A1 (en) * 2005-05-10 2006-11-16 Shim Jeo-Young Microfluidic device and method of manufacturing the same

Also Published As

Publication number Publication date
GR1006447B (el) 2009-06-19
WO2008032128A8 (en) 2008-05-22
WO2008032128A1 (en) 2008-03-20

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Effective date: 20170411