WO2009043614A3 - Mikrofluidisches bauelement sowie herstellungsverfahren - Google Patents

Mikrofluidisches bauelement sowie herstellungsverfahren Download PDF

Info

Publication number
WO2009043614A3
WO2009043614A3 PCT/EP2008/059847 EP2008059847W WO2009043614A3 WO 2009043614 A3 WO2009043614 A3 WO 2009043614A3 EP 2008059847 W EP2008059847 W EP 2008059847W WO 2009043614 A3 WO2009043614 A3 WO 2009043614A3
Authority
WO
WIPO (PCT)
Prior art keywords
producing
microfluidic component
same
polymer layer
component
Prior art date
Application number
PCT/EP2008/059847
Other languages
English (en)
French (fr)
Other versions
WO2009043614A2 (de
Inventor
Christian Maeurer
Johanna May
Original Assignee
Bosch Gmbh Robert
Christian Maeurer
Johanna May
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Christian Maeurer, Johanna May filed Critical Bosch Gmbh Robert
Priority to EP08786490A priority Critical patent/EP2203380A2/de
Priority to US12/679,636 priority patent/US8446021B2/en
Publication of WO2009043614A2 publication Critical patent/WO2009043614A2/de
Publication of WO2009043614A3 publication Critical patent/WO2009043614A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)

Abstract

Die Erfindung betrifft ein mikrofluidisches Bauelement (1) mit mindestens einer ersten Polymerschicht (2), die mit einer Mikrostruktur (5, 6) für mindestens ein Fluid versehen ist, und mit mindestens einer zweiten Polymerschicht (3). Erfindungsgemäß ist vorgesehen, dass auf der ersten und/oder der zweiten Polymerschicht (2, 3) mindestens ein Halbleiterbauelement (10) angeordnet ist. Ferner betrifft die Erfindung ein Herstellungsverfahren für ein derartiges mikrofluidisches Bauelement (1).
PCT/EP2008/059847 2007-09-27 2008-07-28 Mikrofluidisches bauelement sowie herstellungsverfahren WO2009043614A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08786490A EP2203380A2 (de) 2007-09-27 2008-07-28 Mikrofluidisches bauelement sowie herstellungsverfahren
US12/679,636 US8446021B2 (en) 2007-09-27 2008-07-28 Microfluidic component and method for manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007046305.9 2007-09-27
DE102007046305A DE102007046305A1 (de) 2007-09-27 2007-09-27 Mikrofluidisches Bauelement sowie Herstellungsverfahren

Publications (2)

Publication Number Publication Date
WO2009043614A2 WO2009043614A2 (de) 2009-04-09
WO2009043614A3 true WO2009043614A3 (de) 2009-06-04

Family

ID=40384323

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/059847 WO2009043614A2 (de) 2007-09-27 2008-07-28 Mikrofluidisches bauelement sowie herstellungsverfahren

Country Status (4)

Country Link
US (1) US8446021B2 (de)
EP (1) EP2203380A2 (de)
DE (1) DE102007046305A1 (de)
WO (1) WO2009043614A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008042196A1 (de) 2008-09-18 2010-03-25 Robert Bosch Gmbh Verfahren zum Herstellen eines mikrofluidischen Bauelementes sowie mikrofluidisches Bauelement
DE102010014873B4 (de) * 2010-04-10 2016-05-19 Drägerwerk AG & Co. KGaA Beatmungsvorrichtung
DE102011076693A1 (de) 2011-05-30 2012-12-06 Robert Bosch Gmbh Mikrofluidische Vorrichtung mit elektronischem Bauteil und Federelement
EP3481539A4 (de) 2016-07-06 2020-02-26 Precision Nanosystems Inc Intelligentes mikrofluidisches mischinstrument und patronen
DE102016124059B4 (de) * 2016-07-25 2019-12-19 Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. Vorrichtung für die mikrofluidik
DE102017205978B4 (de) * 2017-04-07 2021-11-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrofluidisches System zur Kultivierung von oder der Analyse an lebenden Zellen oder Biomolekülen sowie ein Verfahren zu seiner Herstellung
DE102021208425A1 (de) 2021-08-04 2023-02-09 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zur Herstellung von Lab-on-Chip-Kartuschen

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021090A1 (en) * 1995-12-05 1997-06-12 Gamera Bioscience Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system with on-board informatics
WO1999019717A1 (en) * 1997-10-15 1999-04-22 Aclara Biosciences, Inc. Laminate microstructure device and method for making same
US20070007240A1 (en) * 2005-05-25 2007-01-11 The Regents Of The University Of Michigan Wafer-level, polymer-based encapsulation for microstructure devices
WO2007054710A2 (en) * 2005-11-11 2007-05-18 Molecular Vision Limited Microfluidic device
WO2007079530A1 (en) * 2006-01-12 2007-07-19 Mycrolab Pty Ltd New instrumentation systems and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885470A (en) * 1997-04-14 1999-03-23 Caliper Technologies Corporation Controlled fluid transport in microfabricated polymeric substrates
WO1998000705A1 (en) * 1996-06-28 1998-01-08 Caliper Technologies Corporation Electropipettor and compensation means for electrophoretic bias
US5882465A (en) * 1997-06-18 1999-03-16 Caliper Technologies Corp. Method of manufacturing microfluidic devices
US7497994B2 (en) * 1998-02-24 2009-03-03 Khushroo Gandhi Microfluidic devices and systems incorporating cover layers
CA2399027C (en) 2000-01-31 2010-06-22 Joel S. Rossier Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
US7060227B2 (en) * 2001-08-06 2006-06-13 Sau Lan Tang Staats Microfluidic devices with raised walls
FR2881363B1 (fr) * 2005-02-02 2008-03-14 Commissariat Energie Atomique Dispositif d'analyses biologiques avec detecteur integre

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021090A1 (en) * 1995-12-05 1997-06-12 Gamera Bioscience Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system with on-board informatics
WO1999019717A1 (en) * 1997-10-15 1999-04-22 Aclara Biosciences, Inc. Laminate microstructure device and method for making same
US20070007240A1 (en) * 2005-05-25 2007-01-11 The Regents Of The University Of Michigan Wafer-level, polymer-based encapsulation for microstructure devices
WO2007054710A2 (en) * 2005-11-11 2007-05-18 Molecular Vision Limited Microfluidic device
WO2007079530A1 (en) * 2006-01-12 2007-07-19 Mycrolab Pty Ltd New instrumentation systems and methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LEE HARTLEY ET AL: "Hybrid Integration of an Active Pixel Sensor and Microfluidics for Cytometry on a Chip", IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS PART I: REGULAR PAPERS, IEEE SERVICE CENTER, NEW YORK, NY, US, vol. 54, no. 1, 1 January 2007 (2007-01-01), pages 99 - 110, XP011155720, ISSN: 1057-7122 *

Also Published As

Publication number Publication date
US8446021B2 (en) 2013-05-21
US20100201005A1 (en) 2010-08-12
WO2009043614A2 (de) 2009-04-09
DE102007046305A1 (de) 2009-04-02
EP2203380A2 (de) 2010-07-07

Similar Documents

Publication Publication Date Title
WO2009043614A3 (de) Mikrofluidisches bauelement sowie herstellungsverfahren
WO2009029436A3 (en) Polymer gel structure and method for producing same
WO2007124209A3 (en) Stressor integration and method thereof
WO2008135905A3 (en) A photosensitive device and a method of manufacturing a photosensitive device
WO2009067140A3 (en) Fin-jfet
WO2007120697A3 (en) Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
WO2009058180A3 (en) Self-assembly technique applicable to large areas and nanofabrication
WO2007014930A3 (de) Polyammonium-polysiloxancopolymere
WO2008086282A3 (en) Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
WO2004099068A3 (en) Nanofiber surfaces for use in enhanced surface area applications
WO2009083146A3 (de) Verfahren zum erzeugen einer mikrostruktur
WO2010139342A8 (en) Lens and method for manufacturing same
WO2008118228A3 (en) Articles comprising a fibrous support
WO2011041410A3 (en) Regenerative hydraulic systems and methods of use
EP2528002A3 (de) Definierte Glycoproteinprodukte und entsprechende Verfahren
EP2100987A4 (de) Oberflächenbehandelte kupferfolie, oberflächenbehandelte kupferfolie mit sehr dünner primerharzschicht, verfahren zur herstellung der oberflächenbehandelten kupferfolie und verfahren zur herstellung der oberflächenbehandelten kupferfolie mit sehr dünner primerharzschicht
WO2009049958A3 (de) Verbund aus mindestens zwei halbleitersubstraten sowie herstellungsverfahren
EP2159840A3 (de) Halbleiterbauelement mit Luftbrücken-Verdrahtung und Verfahren zur dessen Herstellung
WO2005105276A3 (en) Device with a membrane on a carrier, as well as a method for manufacturing such a membrane
WO2010042284A3 (en) Microfluidic control systems
GR20060100518A (el) Μεθοδος συγκολλησης
WO2007024186A3 (en) Interconnects and heat dissipators based on nanostructures
WO2006121908A3 (en) Impregnated polymer compositions and devices using them
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
WO2007112279A3 (en) Resonators

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08786490

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008786490

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12679636

Country of ref document: US