SG11202011259WA - Dicing/die-bonding double functioning film and method for producing same, and method for manufacturing semiconductor device - Google Patents
Dicing/die-bonding double functioning film and method for producing same, and method for manufacturing semiconductor deviceInfo
- Publication number
- SG11202011259WA SG11202011259WA SG11202011259WA SG11202011259WA SG11202011259WA SG 11202011259W A SG11202011259W A SG 11202011259WA SG 11202011259W A SG11202011259W A SG 11202011259WA SG 11202011259W A SG11202011259W A SG 11202011259WA SG 11202011259W A SG11202011259W A SG 11202011259WA
- Authority
- SG
- Singapore
- Prior art keywords
- dicing
- die
- semiconductor device
- manufacturing semiconductor
- producing same
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
- H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
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- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Element Separation (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/019179 WO2019220599A1 (ja) | 2018-05-17 | 2018-05-17 | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法 |
PCT/JP2019/019574 WO2019221246A1 (ja) | 2018-05-17 | 2019-05-16 | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202011259WA true SG11202011259WA (en) | 2020-12-30 |
Family
ID=68539983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202011259WA SG11202011259WA (en) | 2018-05-17 | 2019-05-16 | Dicing/die-bonding double functioning film and method for producing same, and method for manufacturing semiconductor device |
Country Status (6)
Country | Link |
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JP (1) | JP6789500B2 (ko) |
KR (1) | KR102278942B1 (ko) |
CN (1) | CN112219264B (ko) |
SG (1) | SG11202011259WA (ko) |
TW (1) | TWI778263B (ko) |
WO (2) | WO2019220599A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7409029B2 (ja) | 2019-11-15 | 2024-01-09 | 株式会社レゾナック | 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法 |
JP7409030B2 (ja) | 2019-11-15 | 2024-01-09 | 株式会社レゾナック | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法 |
JP7088388B1 (ja) | 2021-03-19 | 2022-06-21 | 住友ベークライト株式会社 | 粘着テープ |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4531355B2 (ja) * | 2003-06-25 | 2010-08-25 | 日東電工株式会社 | ダイシング用粘着シートおよび半導体素子の製造方法 |
JP4443962B2 (ja) | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4800694B2 (ja) * | 2005-07-26 | 2011-10-26 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4717051B2 (ja) * | 2007-11-08 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4717086B2 (ja) * | 2008-01-18 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP5303330B2 (ja) | 2009-03-26 | 2013-10-02 | 積水化学工業株式会社 | ダイシングテープ及び半導体チップの製造方法 |
JP5437111B2 (ja) * | 2010-03-01 | 2014-03-12 | 日東電工株式会社 | ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置 |
TWI460779B (zh) * | 2010-07-13 | 2014-11-11 | Hitachi Chemical Co Ltd | 切割-晶粒黏合一體型膜、切割-晶粒黏合一體型膜的製造方法以及半導體晶片的製造方法 |
JP2012069586A (ja) * | 2010-09-21 | 2012-04-05 | Nitto Denko Corp | ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法 |
JP5294358B2 (ja) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
JP2014135469A (ja) * | 2012-12-10 | 2014-07-24 | Nitto Denko Corp | 接着シート、ダイシングテープ一体型接着シート、半導体装置の製造方法、及び、半導体装置 |
KR102108102B1 (ko) * | 2012-12-10 | 2020-05-11 | 닛토덴코 가부시키가이샤 | 다이싱 테이프 일체형 접착 시트, 다이싱 테이프 일체형 접착 시트를 이용한 반도체 장치의 제조 방법 및 반도체 장치 |
JP5696205B2 (ja) * | 2013-12-11 | 2015-04-08 | 日東電工株式会社 | ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置 |
KR101722137B1 (ko) * | 2014-01-03 | 2017-03-31 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
JP5823591B1 (ja) * | 2014-10-01 | 2015-11-25 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
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2018
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- 2019-05-16 KR KR1020207033514A patent/KR102278942B1/ko active IP Right Grant
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- 2019-05-16 JP JP2020519925A patent/JP6789500B2/ja active Active
- 2019-05-16 CN CN201980032401.6A patent/CN112219264B/zh active Active
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JPWO2019221246A1 (ja) | 2020-12-10 |
WO2019220599A1 (ja) | 2019-11-21 |
TW202013474A (zh) | 2020-04-01 |
WO2019221246A1 (ja) | 2019-11-21 |
TWI778263B (zh) | 2022-09-21 |
JP6789500B2 (ja) | 2020-11-25 |
KR102278942B1 (ko) | 2021-07-20 |
CN112219264A (zh) | 2021-01-12 |
KR20200140383A (ko) | 2020-12-15 |
CN112219264B (zh) | 2021-12-03 |
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