SG11202009505XA - Method for manufacturing plated molded article - Google Patents

Method for manufacturing plated molded article

Info

Publication number
SG11202009505XA
SG11202009505XA SG11202009505XA SG11202009505XA SG11202009505XA SG 11202009505X A SG11202009505X A SG 11202009505XA SG 11202009505X A SG11202009505X A SG 11202009505XA SG 11202009505X A SG11202009505X A SG 11202009505XA SG 11202009505X A SG11202009505X A SG 11202009505XA
Authority
SG
Singapore
Prior art keywords
molded article
plated molded
manufacturing plated
manufacturing
article
Prior art date
Application number
SG11202009505XA
Other languages
English (en)
Inventor
Aya Momozawa
Yasushi Kuroiwa
Shota Katayama
Yuta Yamamoto
Kazuaki Ebisawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of SG11202009505XA publication Critical patent/SG11202009505XA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/427Stripping or agents therefor using plasma means only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11202009505XA 2018-03-27 2019-01-28 Method for manufacturing plated molded article SG11202009505XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018060344 2018-03-27
PCT/JP2019/002818 WO2019187591A1 (ja) 2018-03-27 2019-01-28 めっき造形物の製造方法

Publications (1)

Publication Number Publication Date
SG11202009505XA true SG11202009505XA (en) 2020-10-29

Family

ID=68061288

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009505XA SG11202009505XA (en) 2018-03-27 2019-01-28 Method for manufacturing plated molded article

Country Status (8)

Country Link
US (1) US20210055655A1 (ja)
EP (1) EP3761117A4 (ja)
JP (2) JP6612485B1 (ja)
KR (1) KR102487143B1 (ja)
CN (1) CN111919174A (ja)
SG (1) SG11202009505XA (ja)
TW (1) TWI699621B (ja)
WO (1) WO2019187591A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7424313B2 (ja) * 2018-12-12 2024-01-30 Jsr株式会社 メッキ造形物の製造方法
WO2021235283A1 (ja) * 2020-05-18 2021-11-25 Jsr株式会社 感放射線性樹脂組成物、パターン形成方法及びオニウム塩化合物
WO2023085246A1 (ja) 2021-11-11 2023-05-19 コニカミノルタ株式会社 非感光性表面改質剤、積層体、プリント基板及び電子デバイス
JP2024065371A (ja) 2022-10-31 2024-05-15 コニカミノルタ株式会社 非感光性表面改質剤、処理液及び積層体

Family Cites Families (27)

* Cited by examiner, † Cited by third party
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JP3937466B2 (ja) 1995-12-28 2007-06-27 東洋インキ製造株式会社 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物
JP3921748B2 (ja) 1997-08-08 2007-05-30 住友化学株式会社 フォトレジスト組成物
JP4127682B2 (ja) * 1999-06-07 2008-07-30 株式会社東芝 パターン形成方法
AU2001288953A1 (en) * 2000-09-08 2002-03-22 Shipley Company, L.L.C. Novel polymers and photoresist compositions comprising labile polymers backbonesfor short wave imaging
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US7413845B2 (en) * 2004-04-23 2008-08-19 Hitachi Global Storage Technologies Netherlands B.V. Elimination of write head plating defects using high activation chemically amplified resist
JP2006145853A (ja) * 2004-11-19 2006-06-08 Jsr Corp 感放射線性樹脂組成物およびメッキ造形物の製造方法
EP1750176A3 (en) * 2005-08-03 2011-04-20 JSR Corporation Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material
JP4650264B2 (ja) * 2005-12-28 2011-03-16 Jsr株式会社 メッキ造形物製造用ポジ型感放射線性樹脂組成物、転写フィルムおよびメッキ造形物の製造方法
JP2007212542A (ja) * 2006-02-07 2007-08-23 Asahi Kasei Electronics Co Ltd 積層体
JP2007256935A (ja) * 2006-02-22 2007-10-04 Jsr Corp メッキ造形物製造用ポジ型感放射線性樹脂組成物、転写フィルムおよびメッキ造形物の製造方法
US20070196765A1 (en) * 2006-02-22 2007-08-23 Jsr Corporation Radiation-sensitive positive resin composition for producing platings, transfer film, and process for producing platings
JP4654958B2 (ja) * 2006-03-31 2011-03-23 Jsr株式会社 ポジ型感放射線性樹脂組成物、及び転写フィルム並びにメッキ造形物の製造方法
KR101710415B1 (ko) * 2009-09-14 2017-02-27 주식회사 동진쎄미켐 유기 반사방지막 형성용 이소시아누레이트 화합물 및 이를 포함하는 조성물
JP5413105B2 (ja) * 2009-09-30 2014-02-12 信越化学工業株式会社 レジストパターン形成方法及びメッキパターン形成方法
KR20130133304A (ko) * 2011-04-08 2013-12-06 다이요 잉키 세이조 가부시키가이샤 감광성 조성물, 그의 경화 피막, 및 그것들을 사용한 프린트 배선판
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Also Published As

Publication number Publication date
WO2019187591A1 (ja) 2019-10-03
JPWO2019187591A1 (ja) 2020-04-30
CN111919174A (zh) 2020-11-10
KR102487143B1 (ko) 2023-01-10
EP3761117A4 (en) 2021-05-12
JP7219691B2 (ja) 2023-02-08
EP3761117A1 (en) 2021-01-06
TWI699621B (zh) 2020-07-21
US20210055655A1 (en) 2021-02-25
TW201942676A (zh) 2019-11-01
KR20200135502A (ko) 2020-12-02
JP6612485B1 (ja) 2019-11-27
JP2020034933A (ja) 2020-03-05

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