SG11202009335RA - Method for transferring a piezoelectric layer onto a support substrate - Google Patents
Method for transferring a piezoelectric layer onto a support substrateInfo
- Publication number
- SG11202009335RA SG11202009335RA SG11202009335RA SG11202009335RA SG11202009335RA SG 11202009335R A SG11202009335R A SG 11202009335RA SG 11202009335R A SG11202009335R A SG 11202009335RA SG 11202009335R A SG11202009335R A SG 11202009335RA SG 11202009335R A SG11202009335R A SG 11202009335RA
- Authority
- SG
- Singapore
- Prior art keywords
- transferring
- support substrate
- piezoelectric layer
- layer onto
- onto
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/025—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks comprising an acoustic mirror
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1852573A FR3079346B1 (fr) | 2018-03-26 | 2018-03-26 | Procede de fabrication d'un substrat donneur pour le transfert d'une couche piezoelectrique, et procede de transfert d'une telle couche piezoelectrique |
PCT/FR2019/050645 WO2019186032A1 (fr) | 2018-03-26 | 2019-03-21 | Procede de transfert d'une couche piezoelectrique sur un substrat support |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202009335RA true SG11202009335RA (en) | 2020-10-29 |
Family
ID=62816717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202009335RA SG11202009335RA (en) | 2018-03-26 | 2019-03-21 | Method for transferring a piezoelectric layer onto a support substrate |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210020826A1 (de) |
EP (1) | EP3776641B1 (de) |
JP (1) | JP7256204B2 (de) |
KR (1) | KR102671192B1 (de) |
CN (1) | CN111919290B (de) |
FR (1) | FR3079346B1 (de) |
SG (1) | SG11202009335RA (de) |
WO (1) | WO2019186032A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11202103906RA (en) * | 2018-10-16 | 2021-05-28 | Univ Tohoku | Acoustic wave devices |
FR3108788A1 (fr) * | 2020-03-24 | 2021-10-01 | Soitec | Procédé de fabrication d’une structure piézoélectrique pour dispositif radiofréquence et pouvant servir pour le transfert d’une couche piézoélectrique, et procédé de transfert d’une telle couche piézoélectrique |
FR3108789B1 (fr) * | 2020-03-24 | 2023-12-08 | Soitec Silicon On Insulator | Procédé de fabrication d’une structure piézoélectrique pour dispositif radiofréquence et pouvant servir pour le transfert d’une couche piézoélectrique, et procédé de transfert d’une telle couche piézoélectrique |
FR3120985B1 (fr) | 2021-03-19 | 2023-03-31 | Soitec Silicon On Insulator | Procédé de fabrication d’une hétérostructure |
CN113394338A (zh) * | 2021-04-28 | 2021-09-14 | 上海新硅聚合半导体有限公司 | 一种异质单晶薄膜的制备方法及异质单晶薄膜 |
FR3131436A1 (fr) * | 2021-12-23 | 2023-06-30 | Soitec | Procede de fabrication d’un substrat donneur |
FR3131979A1 (fr) | 2022-01-17 | 2023-07-21 | Soitec | Procédé de fabrication d’un substrat donneur pour le transfert d’une couche piézoélectrique et procédé de transfert d’une couche piézoélectrique sur un substrat support |
FR3131980B1 (fr) | 2022-01-17 | 2024-01-12 | Soitec Silicon On Insulator | Procédé de fabrication d’un substrat donneur pour le transfert d’une couche piézoélectrique et procédé de transfert d’une couche piézoélectrique sur un substrat support |
WO2024018149A1 (fr) | 2022-07-19 | 2024-01-25 | Soitec | Procédé de fabrication d'un substrat support pour application radiofréquences |
FR3138239A1 (fr) | 2022-07-19 | 2024-01-26 | Soitec | Procédé de fabrication d’un substrat support pour application radiofréquences |
WO2024051945A1 (en) * | 2022-09-08 | 2024-03-14 | Huawei Technologies Co., Ltd. | Surface acoustic wave device, and radio frequency filter and multiplexer comprising the same |
FR3140474A1 (fr) | 2022-09-30 | 2024-04-05 | Soitec | Substrat donneur et Procédé de fabrication d’un substrat donneur pour être utilisé dans un procédé de transfert de couche mince piézoélectrique. |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1126733A (ja) * | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置,アクティブマトリクス基板、液晶表示装置および電子機器 |
FR2788176B1 (fr) * | 1998-12-30 | 2001-05-25 | Thomson Csf | Dispositif a ondes acoustiques guidees dans une fine couche de materiau piezo-electrique collee par une colle moleculaire sur un substrat porteur et procede de fabrication |
US8507361B2 (en) * | 2000-11-27 | 2013-08-13 | Soitec | Fabrication of substrates with a useful layer of monocrystalline semiconductor material |
JP2002217666A (ja) * | 2001-01-24 | 2002-08-02 | Hitachi Ltd | 弾性表面波素子およびその製造方法 |
KR100944886B1 (ko) * | 2001-10-30 | 2010-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제조 방법 |
JP4069640B2 (ja) * | 2002-02-12 | 2008-04-02 | セイコーエプソン株式会社 | 電気光学装置、及び電子機器 |
US20030186521A1 (en) * | 2002-03-29 | 2003-10-02 | Kub Francis J. | Method of transferring thin film functional material to a semiconductor substrate or optimized substrate using a hydrogen ion splitting technique |
US6767749B2 (en) * | 2002-04-22 | 2004-07-27 | The United States Of America As Represented By The Secretary Of The Navy | Method for making piezoelectric resonator and surface acoustic wave device using hydrogen implant layer splitting |
KR100889886B1 (ko) * | 2003-01-07 | 2009-03-20 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 박층을 박리한 후 다층 구조를 포함하는 웨이퍼의 재활용방법 |
US7052978B2 (en) * | 2003-08-28 | 2006-05-30 | Intel Corporation | Arrangements incorporating laser-induced cleaving |
US7466213B2 (en) * | 2003-10-06 | 2008-12-16 | Nxp B.V. | Resonator structure and method of producing it |
JP2005229455A (ja) * | 2004-02-16 | 2005-08-25 | Shin Etsu Chem Co Ltd | 複合圧電基板 |
FR2889887B1 (fr) * | 2005-08-16 | 2007-11-09 | Commissariat Energie Atomique | Procede de report d'une couche mince sur un support |
JP4686342B2 (ja) * | 2005-11-30 | 2011-05-25 | 株式会社日立メディアエレクトロニクス | 弾性表面波装置及びこれを搭載した通信端末。 |
JP4811924B2 (ja) * | 2006-02-24 | 2011-11-09 | 日本碍子株式会社 | 圧電薄膜デバイス |
JP2009166309A (ja) * | 2008-01-15 | 2009-07-30 | Konica Minolta Holdings Inc | インクジェットヘッド及びインクジェットヘッドの製造方法 |
FR2926674B1 (fr) * | 2008-01-21 | 2010-03-26 | Soitec Silicon On Insulator | Procede de fabrication d'une structure composite avec couche d'oxyde de collage stable |
FR2947098A1 (fr) * | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
EP2333824B1 (de) * | 2009-12-11 | 2014-04-16 | Soitec | Herstellung von dünnen SOI-Vorrichtungen |
US9608119B2 (en) * | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
JP5429200B2 (ja) * | 2010-05-17 | 2014-02-26 | 株式会社村田製作所 | 複合圧電基板の製造方法および圧電デバイス |
FR2962598B1 (fr) * | 2010-07-06 | 2012-08-17 | Commissariat Energie Atomique | Procede d'implantation d'un materiau piezoelectrique |
JP5447682B2 (ja) * | 2010-09-28 | 2014-03-19 | 株式会社村田製作所 | 圧電デバイスの製造方法 |
JP5814774B2 (ja) * | 2010-12-22 | 2015-11-17 | 日本碍子株式会社 | 複合基板及び複合基板の製造方法 |
WO2013031617A1 (ja) * | 2011-08-26 | 2013-03-07 | 株式会社村田製作所 | 圧電デバイス、および、圧電デバイスの製造方法 |
FR2983342B1 (fr) * | 2011-11-30 | 2016-05-20 | Soitec Silicon On Insulator | Procede de fabrication d'une heterostructure limitant la formation de defauts et heterostructure ainsi obtenue |
FR3003692B1 (fr) * | 2013-03-25 | 2015-04-10 | Commissariat Energie Atomique | Procede de fabrication d’une structure a multijonctions pour cellule photovoltaique |
KR20140140188A (ko) * | 2013-05-28 | 2014-12-09 | 삼성디스플레이 주식회사 | 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법 |
FR3032555B1 (fr) * | 2015-02-10 | 2018-01-19 | Soitec | Procede de report d'une couche utile |
WO2017052646A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Island transfer for optical, piezo and rf applications |
FR3042647B1 (fr) * | 2015-10-20 | 2017-12-01 | Soitec Silicon On Insulator | Structure composite et procede de fabrication associe |
FR3045933B1 (fr) * | 2015-12-22 | 2018-02-09 | Soitec | Substrat pour un dispositif a ondes acoustiques de surface ou a ondes acoustiques de volume compense en temperature |
FR3045678B1 (fr) * | 2015-12-22 | 2017-12-22 | Soitec Silicon On Insulator | Procede de fabrication d'une couche piezoelectrique monocristalline et dispositif microelectronique, photonique ou optique comprenant une telle couche |
KR20180107212A (ko) * | 2016-03-25 | 2018-10-01 | 엔지케이 인슐레이터 엘티디 | 접합 방법 |
-
2018
- 2018-03-26 FR FR1852573A patent/FR3079346B1/fr active Active
-
2019
- 2019-03-21 US US17/041,355 patent/US20210020826A1/en active Pending
- 2019-03-21 CN CN201980021982.3A patent/CN111919290B/zh active Active
- 2019-03-21 JP JP2020551934A patent/JP7256204B2/ja active Active
- 2019-03-21 SG SG11202009335RA patent/SG11202009335RA/en unknown
- 2019-03-21 WO PCT/FR2019/050645 patent/WO2019186032A1/fr unknown
- 2019-03-21 KR KR1020207029598A patent/KR102671192B1/ko active IP Right Grant
- 2019-03-21 EP EP19718438.5A patent/EP3776641B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP3776641B1 (de) | 2024-05-15 |
CN111919290B (zh) | 2024-03-01 |
CN111919290A (zh) | 2020-11-10 |
EP3776641A1 (de) | 2021-02-17 |
WO2019186032A1 (fr) | 2019-10-03 |
KR20200135411A (ko) | 2020-12-02 |
FR3079346B1 (fr) | 2020-05-29 |
KR102671192B1 (ko) | 2024-05-31 |
JP7256204B2 (ja) | 2023-04-11 |
JP2021519536A (ja) | 2021-08-10 |
US20210020826A1 (en) | 2021-01-21 |
FR3079346A1 (fr) | 2019-09-27 |
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