SG11202009069YA - Solder paste - Google Patents
Solder pasteInfo
- Publication number
- SG11202009069YA SG11202009069YA SG11202009069YA SG11202009069YA SG11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA
- Authority
- SG
- Singapore
- Prior art keywords
- solder paste
- solder
- paste
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3602—Carbonates, basic oxides or hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C18/00—Alloys based on zinc
- C22C18/04—Alloys based on zinc with aluminium as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018070271 | 2018-03-30 | ||
JP2018184823A JP6540869B1 (ja) | 2018-03-30 | 2018-09-28 | はんだペースト |
PCT/JP2019/012009 WO2019188756A1 (ja) | 2018-03-30 | 2019-03-22 | はんだペースト |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202009069YA true SG11202009069YA (en) | 2020-10-29 |
Family
ID=67212091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202009069YA SG11202009069YA (en) | 2018-03-30 | 2019-03-22 | Solder paste |
Country Status (12)
Country | Link |
---|---|
US (1) | US11633815B2 (ja) |
EP (1) | EP3778107B1 (ja) |
JP (1) | JP6540869B1 (ja) |
KR (1) | KR102307804B1 (ja) |
CN (1) | CN111902238A (ja) |
BR (1) | BR112020019110B1 (ja) |
MX (1) | MX2020010246A (ja) |
MY (1) | MY185339A (ja) |
PH (1) | PH12020551553A1 (ja) |
SG (1) | SG11202009069YA (ja) |
TW (1) | TWI677396B (ja) |
WO (1) | WO2019188756A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI814081B (zh) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
CN115768591A (zh) * | 2020-04-10 | 2023-03-07 | 千住金属工业株式会社 | 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 |
JP6836091B1 (ja) * | 2020-04-10 | 2021-02-24 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手 |
JP7133739B1 (ja) | 2021-11-30 | 2022-09-08 | 株式会社タムラ製作所 | 接合部、電子回路基板及び半導体パッケージ |
JP7079889B1 (ja) * | 2021-11-30 | 2022-06-02 | 株式会社タムラ製作所 | はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ |
TWI789165B (zh) * | 2021-12-14 | 2023-01-01 | 昇貿科技股份有限公司 | 無鉛無銅錫合金與用於球柵陣列封裝的錫球 |
CN115156756B (zh) * | 2022-08-25 | 2023-08-15 | 深圳市鑫富锦新材料有限公司 | 一种环保的低温无残留锡膏 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6061180A (ja) * | 1983-09-14 | 1985-04-08 | Toshiba Corp | 溶接用チップカバ− |
JPS61115683A (ja) * | 1984-11-07 | 1986-06-03 | Toyota Motor Corp | ア−ク溶接用コンタクトチツプ |
JPH05237662A (ja) * | 1992-03-03 | 1993-09-17 | Babcock Hitachi Kk | 溶接トーチ |
JP3149510B2 (ja) * | 1992-03-23 | 2001-03-26 | 松下電器産業株式会社 | クリーム半田 |
EP0856376B1 (en) | 1996-12-03 | 2000-02-09 | Lucent Technologies Inc. | Article comprising fine-grained solder compositions with dispersoid particles |
JP2003275892A (ja) * | 2002-03-20 | 2003-09-30 | Tamura Kaken Co Ltd | 無鉛はんだ合金及びソルダペースト組成物 |
CN1330455C (zh) * | 2005-05-09 | 2007-08-08 | 天津大学 | 氧化锆纳米颗粒增强型锡银复合焊料及其制备方法 |
JP6032399B2 (ja) | 2011-07-26 | 2016-11-30 | 荒川化学工業株式会社 | 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト |
CN102513720B (zh) | 2011-12-23 | 2014-05-07 | 哈尔滨工业大学深圳研究生院 | 一种高性能锡基钎料合金及其制备方法 |
JP6051437B2 (ja) * | 2012-06-12 | 2016-12-27 | 株式会社弘輝 | レーザー加熱工法による電子デバイスの製造方法 |
JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP5730354B2 (ja) * | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
JP5730353B2 (ja) | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
CN103551756A (zh) | 2013-11-12 | 2014-02-05 | 宁波市鄞州恒迅电子材料有限公司 | Sn-Ag-Cu系无铅焊锡膏 |
EP3093098B1 (en) * | 2014-06-24 | 2019-01-02 | Harima Chemicals, Inc. | Solder alloy, solder paste and electronic circuit board |
KR101671062B1 (ko) * | 2014-08-18 | 2016-10-31 | 주식회사 경동원 | 무연 솔더 합금 조성물 및 무연 솔더 합금의 제조 방법 |
WO2016178000A1 (en) * | 2015-05-02 | 2016-11-10 | Alpha Metals, Inc. | Lead-free solder alloy with low melting point |
CN105033496B (zh) | 2015-07-03 | 2018-01-09 | 北京康普锡威科技有限公司 | 一种高强高导复合型无铅高温焊料及其制备方法 |
JP2017073448A (ja) * | 2015-10-06 | 2017-04-13 | 住友電気工業株式会社 | 半田ペースト、接続シート、電気的接続体の製造方法及び電気的接続体 |
CN108500499B (zh) * | 2016-03-22 | 2019-10-22 | 株式会社田村制作所 | 无铅软钎料合金、电子电路基板和电子控制装置 |
-
2018
- 2018-09-28 JP JP2018184823A patent/JP6540869B1/ja active Active
-
2019
- 2019-03-22 WO PCT/JP2019/012009 patent/WO2019188756A1/ja active Application Filing
- 2019-03-22 CN CN201980022343.9A patent/CN111902238A/zh active Pending
- 2019-03-22 KR KR1020207027924A patent/KR102307804B1/ko active IP Right Grant
- 2019-03-22 US US17/042,551 patent/US11633815B2/en active Active
- 2019-03-22 SG SG11202009069YA patent/SG11202009069YA/en unknown
- 2019-03-22 EP EP19776738.7A patent/EP3778107B1/en active Active
- 2019-03-22 BR BR112020019110-8A patent/BR112020019110B1/pt active IP Right Grant
- 2019-03-22 MX MX2020010246A patent/MX2020010246A/es unknown
- 2019-03-22 MY MYPI2020004988A patent/MY185339A/en unknown
- 2019-03-29 TW TW108111128A patent/TWI677396B/zh active
-
2020
- 2020-09-24 PH PH12020551553A patent/PH12020551553A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH12020551553A1 (en) | 2021-06-07 |
EP3778107B1 (en) | 2024-05-08 |
CN111902238A (zh) | 2020-11-06 |
EP3778107A4 (en) | 2021-12-15 |
US20210114143A1 (en) | 2021-04-22 |
JP6540869B1 (ja) | 2019-07-10 |
BR112020019110B1 (pt) | 2021-08-03 |
TWI677396B (zh) | 2019-11-21 |
MY185339A (en) | 2021-05-06 |
KR20200117042A (ko) | 2020-10-13 |
TW201941862A (zh) | 2019-11-01 |
US11633815B2 (en) | 2023-04-25 |
JP2019181561A (ja) | 2019-10-24 |
BR112020019110A2 (pt) | 2020-12-29 |
WO2019188756A1 (ja) | 2019-10-03 |
MX2020010246A (es) | 2021-05-10 |
EP3778107A1 (en) | 2021-02-17 |
KR102307804B1 (ko) | 2021-10-05 |
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