SG11202009069YA - Solder paste - Google Patents

Solder paste

Info

Publication number
SG11202009069YA
SG11202009069YA SG11202009069YA SG11202009069YA SG11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA SG 11202009069Y A SG11202009069Y A SG 11202009069YA
Authority
SG
Singapore
Prior art keywords
solder paste
solder
paste
Prior art date
Application number
SG11202009069YA
Inventor
Toru Hayashida
Shunsaku Yoshikawa
Takashi Saito
Kanta DEI
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of SG11202009069YA publication Critical patent/SG11202009069YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3602—Carbonates, basic oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C22C18/04—Alloys based on zinc with aluminium as the next major constituent
SG11202009069YA 2018-03-30 2019-03-22 Solder paste SG11202009069YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018070271 2018-03-30
JP2018184823A JP6540869B1 (en) 2018-03-30 2018-09-28 Solder paste
PCT/JP2019/012009 WO2019188756A1 (en) 2018-03-30 2019-03-22 Solder paste

Publications (1)

Publication Number Publication Date
SG11202009069YA true SG11202009069YA (en) 2020-10-29

Family

ID=67212091

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009069YA SG11202009069YA (en) 2018-03-30 2019-03-22 Solder paste

Country Status (12)

Country Link
US (1) US11633815B2 (en)
EP (1) EP3778107A4 (en)
JP (1) JP6540869B1 (en)
KR (1) KR102307804B1 (en)
CN (1) CN111902238A (en)
BR (1) BR112020019110B1 (en)
MX (1) MX2020010246A (en)
MY (1) MY185339A (en)
PH (1) PH12020551553A1 (en)
SG (1) SG11202009069YA (en)
TW (1) TWI677396B (en)
WO (1) WO2019188756A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814081B (en) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 High temperature ultra-high reliability alloys, manufacturing method thereof, and applications thereof
CN115768591A (en) * 2020-04-10 2023-03-07 千住金属工业株式会社 Solder alloy, solder powder, solder paste, solder ball, solder preform and solder joint
JP6836091B1 (en) * 2020-04-10 2021-02-24 千住金属工業株式会社 Solder alloys, solder powders, solder pastes, solder balls, solder preforms and solder fittings
JP7133739B1 (en) * 2021-11-30 2022-09-08 株式会社タムラ製作所 Joints, electronic circuit boards and semiconductor packages
JP7079889B1 (en) * 2021-11-30 2022-06-02 株式会社タムラ製作所 Solder alloys, solder joints, solder pastes and semiconductor packages
TWI789165B (en) * 2021-12-14 2023-01-01 昇貿科技股份有限公司 Lead-free copper-free tin alloys and solder balls for ball grid array packages
CN115156756B (en) * 2022-08-25 2023-08-15 深圳市鑫富锦新材料有限公司 Environment-friendly low-temperature residue-free solder paste

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPS6061180A (en) * 1983-09-14 1985-04-08 Toshiba Corp Chip cover for welding
JPS61115683A (en) * 1984-11-07 1986-06-03 Toyota Motor Corp Contact tip for arc welding
JPH05237662A (en) * 1992-03-03 1993-09-17 Babcock Hitachi Kk Welding torch
JP3149510B2 (en) * 1992-03-23 2001-03-26 松下電器産業株式会社 Cream solder
DE69701277T2 (en) * 1996-12-03 2000-08-31 Lucent Technologies Inc Fine-particle soft solder containing dispersed particle article
JP2003275892A (en) * 2002-03-20 2003-09-30 Tamura Kaken Co Ltd Lead-free solder alloy and solder paste composition
CN1330455C (en) * 2005-05-09 2007-08-08 天津大学 Zirconium oxide nano grain reinforced composite Sn-Ag welding material and its prepn process
JP6032399B2 (en) * 2011-07-26 2016-11-30 荒川化学工業株式会社 Flux for lead-free solder paste and lead-free solder paste
CN102513720B (en) 2011-12-23 2014-05-07 哈尔滨工业大学深圳研究生院 High-performance tin-based solder alloy and preparation method thereof
JP6051437B2 (en) 2012-06-12 2016-12-27 株式会社弘輝 Electronic device manufacturing method by laser heating method
JP2015077601A (en) * 2013-04-02 2015-04-23 千住金属工業株式会社 Lead-free solder alloy
JP5730353B2 (en) 2013-07-17 2015-06-10 ハリマ化成株式会社 Solder composition, solder paste and electronic circuit board
JP5730354B2 (en) * 2013-07-17 2015-06-10 ハリマ化成株式会社 Solder composition, solder paste and electronic circuit board
CN103551756A (en) * 2013-11-12 2014-02-05 宁波市鄞州恒迅电子材料有限公司 Sn-Ag-Cu system lead-free soldering paste
JP5638174B1 (en) * 2014-06-24 2014-12-10 ハリマ化成株式会社 Solder alloy, solder composition, solder paste and electronic circuit board
KR101671062B1 (en) * 2014-08-18 2016-10-31 주식회사 경동원 Lead-free solder composition and manufacturing method of lead-free solder composition
CN105033496B (en) * 2015-07-03 2018-01-09 北京康普锡威科技有限公司 A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof
JP2017073448A (en) * 2015-10-06 2017-04-13 住友電気工業株式会社 Solder paste, connection sheet, method for manufacturing electrical connection body, and electrical connection body
MX2018011176A (en) * 2016-03-22 2019-03-28 Tamura Seisakusho Kk Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device.

Also Published As

Publication number Publication date
MY185339A (en) 2021-05-06
EP3778107A4 (en) 2021-12-15
BR112020019110A2 (en) 2020-12-29
US11633815B2 (en) 2023-04-25
KR102307804B1 (en) 2021-10-05
BR112020019110B1 (en) 2021-08-03
KR20200117042A (en) 2020-10-13
TW201941862A (en) 2019-11-01
PH12020551553A1 (en) 2021-06-07
WO2019188756A1 (en) 2019-10-03
JP2019181561A (en) 2019-10-24
JP6540869B1 (en) 2019-07-10
CN111902238A (en) 2020-11-06
TWI677396B (en) 2019-11-21
US20210114143A1 (en) 2021-04-22
EP3778107A1 (en) 2021-02-17
MX2020010246A (en) 2021-05-10

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